臺灣博碩士論文加值系統

由於PCB印刷電路板開始大量地被使用，不過隨著科技的演進，電路板的尺寸越來越小，因此精密量測的重要性也越來越大。對於PCB上錫球的檢測，二維機器視覺檢測已經有許多討論，且發展日趨成熟。因此本研究想針對PCB上錫球的表面進行三維的量測。
本研究是用條紋投影法與四步相移法與相位展開，結合相機作為機器視覺來完成整個PCB錫球的三維物體表面量測。整個系統使用投影機配合鏡頭的方式，投射結構光在錫球上，再使用相機取像並做後續的檢測。最後再取得整個錫球的高度資訊進而完成三維形貌的重建。

Because of the PCB printed circuit board began to be a lot of use. With the evolution of science and technology, circuit board size is getting smaller and smaller, Precision measurement become important. So this study would like to measure the PCB solder ball Three - Dimensional surface
In this study, we used striped projection method and four-step phase shift method and phase unwrapping, combining with camera for machine vision to complete the PCB solder ball measurement. The system use the projector with lens, the projection structure of light in the ball, then use the camera imaging and detection. Finally we get reconstruction of height information and the 3D morphology of the ball.

目錄

摘 要 i
ABSTRACT ii
誌謝 iii
目錄 iv
表目錄 vi
圖目錄 vii
第一章 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 2
1.3 研究範圍與限制 2
1.4 研究架構 3
第二章 文獻探討 4
2.1 機器視覺量測介紹 4
2.2 三維形貌量測介紹 5
2.2.1 條紋投影法介紹 6
2.2.2 條紋反射法介紹 8
2.3 相移法介紹 9
2.4 相位展開介紹 10
2.4.1 分支切割法 11
2.4.2 Macy相位展開 12
2.5 傾斜量校正 13
第三章 研究方法 14
3.1 硬體機構設置 14
3.2 軟體系統開發 20
3.2.1 條紋投影法 21
3.2.2 四步相移法 22
3.2.3 正弦-餘弦均值濾波 28
3.2.4 區域型相位展開 29
3.2.5 Macy相位展開 33
第四章 實驗結果與分析 37
4.1 表面3D輪廓量測儀 37
4.2 相位圖與相位展開實驗 39
4.3 實驗數據分析 42
第五章 結論與未來方向 52
5.1 結論 52
5.2 未來研究與建議 52
參考文獻 53

1.Lau, J.H., "Ball grid array technology," McGraw-Hill Professional, 1995.
2.朱建政，BGA，封裝晶片表面瑕疵檢測之研究，元智大學工業工程與管理學系學位論文，桃園，2003，第1-123頁。
3.Lin, C.-S. and L.W. Lue, "An image system for fast positioning and accuracy inspection of ball grid array boards," Microelectronics Reliability, 2001. 41(1): pp. 119-128.
4.Ko, K.W., et al, "Enhancement of placement accuracy for SMD via development of a new illumination system. in Intelligent Systems and Smart Manufacturing," International Society for Optics and Photonics.2001.
5.Yen, H.-N, D.-M. Tsai, "A fast full-field 3D measurement system for BGA coplanarity inspection," The International Journal of Advanced Manufacturing Technology. 24(1-2), 2004,pp. 132-139.
6.V. Srinivasan, H.C.Liu, and M. Halioua, "Automated Phase-measuring profilometryof 3-D diffuse objects," AppliedOptics, Vol.23, No.18, 1984, pp. 3105-3108.
7.Xian-Yu Su, Wen-Sen Zhou, "Automated phase-measuring profilometry using defocused projection of a Ronchi grating," Optics Communication, Vol.94, 1992, pp.561-573.
8.Toru Yoshizawa, Takayoshi Yamaguchi, Hiroshi Takahashi, Naohito Ikeda, Masayuki Yamamoto, Shigeru Nagamori," Structured light method using moiré pattern projection," proceedings of SPIE, Vol.4567, 2002, pp. 40-47.
9.C. Quan, X.Y. He, C.F. Wang, C.J. Tay, H.M. Shang, "Shape measurement of small objects using LCD fringe projection with phase shifting," Optics Communication, Vol.189,2001, pp.21-29.
10.C. Quan, C.J. Tay, X.Y. He, X. Kang, H.M. Shang, "Microscopic surface contouring by fringe projection method," Optics & Laser Technology, Vol.34, 2002, pp. 547-552.
11.R. P. Khetan, "Theory and Applications of Projection Moire Method," State of university of New York at Stony Brook, Ph.D.dissertation, 1975.
12.劉滄雅，以投射疊紋法應用數位視頻訊號處理作非接觸式之三度空間物體 外形量測，臺北，1989。
13.張家壽，應用數位投影疊紋法於微小尺寸表面之量測，臺北，2001。
14.R. Weller and B.M. Shepard, "Displacement Measurements by Mechanical Interferometry," Proc. SESA, 1948, pp. 35-38.
15.Syu, Jhe-Wei, "Analysing Object Characteristic and Reconstructing the Three Dimensional Outline Using DLP Projection and Union Computer Image Process."
16.Hidetoshi Miike, Kazutoshi Koga, Takehito Yamada, Tatsuje Kawamura, Masaaki Kitou , and Naohisa Takikawa, "Measuring Surface Shape from Specular Reflection Image Sequence—Quantitative Evaluation of SurfaceDefects of Plastic Moldings," Jpn. J. Appl.Phys, Vol.34, 1995,pp. L1625-L1628.
17.Xianzhu Zhang and Walter North, "Retroreflective grating generation and analysis for surface measurement," Applied Optics, Vol.37, NO.13, 1998, pp.2624-2627.
18.Dong X M et al Chin. J. Scientific Instrumen.2002. pp.23 843.
19.Li Y Q et al Chin. J. Scientific Instrumen.2003. pp.24 498.
20.Guanming Lai and Toyohiko Yatagai. J. Opt. Soc. Am. A 1991. pp.8 822.
21.Dorrio B V et al Applied Optics 1996. pp.35 61.
22.Yves Surrel Applied Optics 1996. pp.35 51.
23.Ghiglia D. C., Mastin G. A. and Romero L. A., "Cellular-automata method for phase unwrapping," J. Opt. Soc. Am. A, Vol. 4, 1987, pp.267.
24.W.Steinchen, L. X. Yang and M. Schuth, "TV-shearography for measuring 3D-strains," 1996. pp.49-57.
25.Chang H. Y., Chen C. W., Lee C. K. and Hu C. P., "The tapestry cellular automata phase unwrapping algorithm for interferogram analysis," Optics and Lasers in Engineering, vol. 30, no. 6, 1998, pp.487-502.
26.Huang M. J. and Lai Cian-Jhih, "Phase unwrapping based on a parallel noise-immune algorithm," Optics and Laser Technology, vol.34, no.6,2002, pp. 457-464.
27.R. M. Goldstein, H. A. Zebker and C. L. Werner, "Satellite radarinterferometry : Two-dimensional phase unwrapping," Radio Science 23(4) ,1988, pp. 713-720 .
28.N. H. Ching, D. Rosenfeld and M. Braun, "Two-dimensional phase unwrapping using a minimum spanning tree algorithm," IEEE 1(3), 1992, pp. 355-361.
29.T. J. Flynn, "Two-dimensional phase unwrapping with minimum weighted discontinuity," J. Opt. Soc. Am. A 14(10), 1997, pp. 2692-2701.
30.Spik A. and Robinson D. W., "Investigation of the cellular automata method for phase unwrapping and its implementation on an array processor", Optics and Lasers in Engineering, vol. 14, 25-37, 1991.
31.J.J.Gierloff, "Phase Unwrapping by regions," Current Developments in Optical Engineering,Vol. 818,1987, pp. 2-9.
32.J.A. Quiroga,A. Gonzalez-Cano,E. Bernabeu, "Phase-unwrapping algorithm based on an adaptive criterion," Appl. Opt. 34 (14),1995, pp. 25-60.