臺灣博碩士論文加值系統

由於雷射二極體本身為一非線性元件，因此雷射二極體驅動器為了能夠驅動低成本的10-Gb/s雷射二極體，必須在輸出端做終端匹配(Back-Termination)以吸收由不理想負載反射回來的反射信號。實現終端匹配最簡單的方法為在驅動器輸出端接上一個匹配電阻，但所帶來的負載效應也使得這樣的做法非常沒有功率效益。為了克服功率消耗的問題，近幾年已有許多實現在昂貴的砷化鎵與矽鍺製程上的主動式終端匹配架構被發表出來。在此論文中，我們新提出一個主動式終端匹配架構以作為低成本且容易實現的一個解決方法。此架構最主要由一個二極體連接形式的電晶體和一個與輸出調變電流成比例的動態偏壓電流源組成。除此之外，我們使用堆疊架構並且加入恆定偏壓電路來降低溫度製程變異的影響。電路中同時採用了並聯尖峰(Shunt Peaking)與源極電容衰減(Capacitive Degeneration)來增加操作頻寬。我們並將此適用於低電壓先進互補式金氧半製程的架構實現在一個供應電壓為1.8V之10-Gb/s 雷射二極體驅動器上。此雷射二極體驅動器採用了TSMC 0.18um CMOS製程，同時輸出調變電流範圍設計在20mA到60mA。晶片量測的結果為上升時間與下降時間小於38ps，且信號抖動量(Jitter)峰對峰值為12.3ps。輸出端反射損失在10GHz之前可以維持7dB以上。電路整體功率消耗在輸出調變電流60mA狀況下只需0.24W。電路佈局面積則是760μm*610μm。

中文摘要.................................i
英文摘要................................ii
誌謝....................................iv
目錄.....................................v
圖目錄.................................vii
表目錄..................................ix
第一章 緒論...............................................1
1-1 動機.............................................1
1-2 光纖通訊系統介紹.................................2
1-3 論文組織.........................................3

第二章 高速光通訊傳送機之簡介.............................5
2-1 雷射二極體與操作特性.............................5
2-2 雷射二極體驅動器簡介.............................7
2-3 輸出端耦合介面的探討.............................7
2-4 設計參數規範和專有名詞的介紹.....................9
2-3-1 信號抖動與眼圖遮罩.........................9
2-3-2 高頻網路參數矩陣與轉換....................10

第三章 具主動式終端匹配之10-Gb/s雷射二極體驅動器設計....14
3-1 引言............................................14
3-2 高速電路之終端匹配..............................15
3-3 主動式終端匹配之實現與設計考量..................16
3-3-1 現有架構之缺點與討論.......................16
3-3-2 新提出適用於低電壓CMOS製程之主動匹配架構..20
3-4 電路架構與設計流程..............................21
3-4-1 輸出級與主動式終端匹配電路.................22
3-4-2 直流偏壓電路...............................24
3-4-3 高速電路頻寬擴增技巧.......................27
3-4-4 前置放大器電路的設計.......................32
3-5 電路佈局........................................33
3-5-1 電感的實現.................................33
3-5-2 佈局考量...................................35
3-6 模擬結果與分析..................................37

第四章 實驗結果..........................................42
4-1 量測環境介紹....................................42
4-2 晶片量測........................................43
4-2-1 電訊號量測.................................43
4-2-2 反射損失量測...............................46
4-2-3 光訊號量測.................................49
4-3 實驗結果摘要與比較..............................51
4-4 晶片照像圖......................................52
4-5 結論............................................52

第五章 討論與未來展望....................................54
參考文獻..................................................55
附錄一....................................................57
簡歷......................................................58

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