臺灣博碩士論文加值系統

本論文研製之現今科技日新月異，隨著半導體製程技術的增進以及摩爾定律，中央處理器(CPU)的運算核心晶片製程從2000年的單核心Intel® Pentium® 4處理器90奈米(nm)處理器問世後，短短六、七年內Intel於2007年在舊金山發表可實際運作的四核心32奈米(nm)製程技術，甚至在未來的一到兩年內會推出八核心或是更多晶片整合的多核心中央處理器。
因此隨著運算功率逐漸增加，相對的所產生的熱能也持續攀升，現今CPU散熱系統將無法應付未來高達350W的熱能窘境，有鑑於此我們以目前散熱效能最優異的水冷系統作為基礎架構，開發新一代的水冷散熱系統。
本文提出並敘述創新CPU中央處理冷卻系統之作動式隧道型散熱座(Active-Liquid-Heat-Sink；簡稱ALHS)技術。主要的概念及設計基礎，是整合作動式液體散熱座技術於內置型液體冷卻系統。
本系統不僅體積小，重量輕，安裝方便，且透過與美國ASTM-5470D標準符合的 LW-9091CPU測試儀，實驗結果證實本系統具有優異的散熱效率；並經由與市售的空冷、熱導管及內置型液體冷卻系統做比較，也再度驗證本系統確實擁有較佳的散熱功能。

With great advancement of science and technology, with the development of chip manufacturing processes, since the delivery of first single core Intel® Pentium® 90 nm process, an operational four core 32 nm processor has been announced in San Francisco in 2007. In the near future, micro-processors with more than four cores are on the way to the market.

It is obvious that with the increase of computational power, relative more heat is inevitable produced. Therefore, current CPU heat dissipation methods would be unable to deal with the higher heat-energy problem, as high as 350 watts. To cope with the situation, a new generation liquid cooling system is developed, based on and combining existing CPU cooling technologies.

In the paper, an Active-Liquid-Heat-Sink Technology is introduced for CPU cooling purposes. With this technology, the active liquid driving mechanism is integrated into the liquid heat sink, and the whole system can be assembled into a regular computer mother board.

The advantages of the system are not only its small size, light weight, convenient installation, but more importantly its very high cooling efficiency. Through the “LW-9091CPU Tester” that complies with U.S.A. ASTM-5470D standard, the experimental result verifies that this system has excellent thermal efficiency. Comparing with commercial air cool, heat pipe and internal liquid cooling systems, a better heat dissipation function of this system is testified.

中文摘要--------------------------------------------- i
英文摘要--------------------------------------------- ii
致謝 --------------------------------------------- iii
目錄 --------------------------------------------- iv
表目錄 --------------------------------------------- vii
圖目錄 --------------------------------------------- ix
符號說明 --------------------------------------------- XV
一、 緒論----------------------------------------- 1
1.1 前言----------------------------------------- 1
1.2 研究動機------------------------------------- 3
1.3 文獻回顧------------------------------------- 5
二、 隧道型液冷CPU散熱器之設計與原理-------------- 11
2.1 液冷CPU散熱系統元件功能---------------------- 11
2.2 隧道型液冷CPU散熱器之設計-------------------- 16
2.2.1 相加----------------------------------------- 17
2.2.2 替代----------------------------------------- 17
2.2.3 融合----------------------------------------- 17
2.3 技術原理------------------------------------- 18
2.3.1 磁耦合（Magnetic Coupling）無軸傳動技術------ 18
2.3.2 混合式泵浦技術------------------------------- 19
2.3.3 水冷座與泵浦葉片整合技術--------------------- 22
2.4 液冷散熱系統基礎模型理論--------------------- 24
三、 研究設備與方法------------------------------- 25
3.1 泵浦排水量實驗------------------------------- 26
3.1.1 實驗設備------------------------------------- 26
3.1.2 實驗方法------------------------------------- 31
3.2 系統降（升）溫實驗--------------------------- 37
3.2.1 實驗設備------------------------------------- 37
3.2.2 實驗方法------------------------------------- 40
3.3 熱阻抗實驗----------------------------------- 44
3.3.1 實驗設備------------------------------------- 44
3.3.2 實驗方法------------------------------------- 48
四、 結果與討論----------------------------------- 50
4.1 泵浦排水量實驗------------------------------- 50
4.1.1 雙20S流道排水量測試-------------------------- 52
4.1.2 雙20流道排水量測試--------------------------- 54
4.1.3 雙20L流道排水量測試-------------------------- 57
4.1.4 雙20XL流道排水量測試------------------------- 59
4.1.5 數據分析------------------------------------- 62
4.2 系統降（升）溫實驗--------------------------- 64
4.2.1 降溫測試------------------------------------- 65
4.2.2 升溫測試------------------------------------- 67
4.2.3 數據分析------------------------------------- 69
4.3 熱阻抗實驗----------------------------------- 70
4.3.1 50w熱阻抗數據-------------------------------- 71
4.3.2 75W熱阻抗數據-------------------------------- 74
4.3.3 100W熱阻抗數據------------------------------- 77
4.3.4 140W熱阻抗數據------------------------------- 80
4.3.5 數據分析------------------------------------- 83
五、 結論與建議----------------------------------- 84
5.1 結論----------------------------------------- 84
5.2 建議----------------------------------------- 87
參考文獻--------------------------------------------- 88
附 錄 一-------------------------------------------- 90
自 傳--------------------------------------------- 91

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