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研究生:鄭馨隆
研究生(外文):Shin-Lung Cheng
論文名稱:嵌入式高週波感應加熱線圈之模具系統整合
論文名稱(外文):Integration System of Mold Embedded with Induction Heating Coil
指導教授:黃榮堂黃榮堂引用關係
口試委員:韓麗龍陳炤彰
口試日期:2014-01-07
學位類別:碩士
校院名稱:國立臺北科技大學
系所名稱:機電整合研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2014
畢業學年度:102
語文別:中文
論文頁數:97
中文關鍵詞:感應加熱射出成型ANSYS Multiphysics
外文關鍵詞:Induction HeatingInjection MoldingANSYS Multiphysics
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本文針對感應加熱技術用於模具加熱作開發研究,提出兩種通以高頻電流之嵌入式感應線圈和感應線圈整合集中器進行感應加熱快速提高模穴表面溫度之裝置方法。透過嵌入式感應線圈快速加熱模溫這項技術並可於塑料開模與合模注入階段持續加溫,解決射出成型製程流動阻力大而造成塑料流動性不佳之成型困難。顯示出高模溫的重要性所以本技術高週波感應加熱可達到快速加熱、控制加熱溫度等優點,降低生產成本以達到同時兼顧縮短成型週期與高生產量率之目標。
本論文主要利用ANSYS APDL/ ANSYS Maxwell 和ANSYS Multiphysics軟體模擬嵌入式感應線圈與集中器之整合對於模具之公模仁加熱的情形作與模擬熱油機提升模溫做比較,對ANSYS應用於含加熱源模具溫度場分析與驗證做討論,並對電磁與熱耦合分析應用於感應線圈設計進行分析,以進行感應加熱模擬尋找相關操作參數並驗證分析與實際的可行度,確定ANSYS軟體在分析含加熱源模具溫度場之可行性。本研究利用現有射出成型標準模具規格實際設計開發一組模具,同時設計出特殊線圈與以電木材質之機構固定線圈於模具上配合射出成型製程步驟進行升溫與冷卻做模擬分析。


My research and development is to aim for mold heating induction heating technology. There two ways of propose with passing a high-frequency current through the induction coil and embedded integrated with concentrator method for rapidly increased the surface temperature of the mold cavity. Mold temperature of this technology through rapid heating is induction coil embedded in the plastic injection mold to be heated up, this phenomenon solving injection molding process flow resistance caused by poor liquidity of plastic molding difficulties. That the importance of the technology of rapid heating mold temperature will reduce production costs in order to achieve objectives while taking into account for shorten molding cycle and high production rates.
This paper using ANSYS APDL / ANSYS Maxwell for comparison and mainly used ANSYS Multiphysics simulation software to simulate embedded induction heating coil and oil heating to make a comparison of increasing mold temperature. ANSYS used in mold temperature field analysis and verification do discuss and theory , the coupling of electromagnetic and thermal analysis is applied to the induction coil design is analyzed for induction heating simulations to find relevant operating parameters and verify the credibility of the analysis to determine the feasibility of heating source mold temperature field analysis with ANSYS software .
In this study, the use of existing standard injection molding mold design and development of a set of specifications of the actual mold with designing a special coil and institutional fixed coil phenolic material in the injection molding process with the heating and cooling steps to simulate and analyze the mold.


目錄
中文摘要 i
英文摘要 ii
誌謝 iii
目錄 v
表目錄 vii
圖目錄 viii
第一章 緒論 1
1.1 前言 1
1.2 模具加熱方式 2
1.3 研究動機 4
1.4 文獻探討 5
1.5 論文架構 14
第二章 感應加熱原理 15
2.1 感應加熱之簡介 15
2.2 感應加熱之系統設計考量 17
2.2.1 系統頻率與功率 17
2.3 電磁效應 20
2.3.1 集膚效應(Skin Effect) 20
2.3.2 鄰近效應 22
2.3.3 邊界效應 23
2.3.4 磁場集中效應 24
2.3.5 加熱線圈 24
2.4 焦耳效應 25
2.4.1 磁滯損失(Hysteresis Loss) 25
2.4.2 渦流損(Eddy Current Loss) 26
2.5 感應加熱之優點 28
第三章 感應加熱系統負載特性原理 29
3.1 加工物件之電阻係數與相對導磁係數 29
3.1.1 電阻係數 29
3.1.2 相對導磁係數 30
3.2 加工物件之溫度分佈與加熱時間 33
3.2.1 溫度分佈 33
3.2.2 加熱時間 34
第四章 ANSYS APDL磁熱耦合分析 35
4.1 理論架構 35
4.1.1 電磁場方程式 35
4.1.2 溫度場方程式 36
4.2 ANSYS基本分析流程 37
4.3 ANSYS耦合分析 40
4.4 嵌入式感應加熱模具模型與模擬 42
4.4.1 模具模型改良與嵌入線圈設計 42
4.4.2 電磁場分析與模擬結果 45
4.4.3 溫度場分析與模擬結果 52
4.4.4 線圈與線圈整合集中器之模擬結果比較 56
第五章 ANSYS Multiphysics 磁熱耦合分析 59
5.1 ANSYS Maxwell分析流程 59
5.2 ANSYS Maxwell網格處理與設定 61
5.2.1 彎曲與切割表面 61
5.2.2 有限元素法之資訊 61
5.3 ANSYS Maxwell模擬分析與結果 63
5.3.1 電磁場模擬分析過程與結果 64
5.4 Transient Thermal模擬分析與結果 67
第六章 線圈感應與熱油之加熱模擬比較 72
6.1 溫度模擬分析與結果 74
第七章 溫度檢測控制系統 80
第八章 實驗模擬驗證與設備 83
8.1 實際模擬驗證 83
8.2 使用設備 87
第九章 結論與未來研究 90
9.1 結論 90
9.2 未來研究方向 92
參考文獻 94



參考文獻
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