臺灣博碩士論文加值系統

本文針對感應加熱技術用於模具加熱作開發研究，提出一種通以高頻電流之嵌入式感應線圈進行感應加熱快速提高模穴表面溫度之裝置方法。透過嵌入式感應線圈快速加熱模溫並可於塑料合模注入階段持續加溫，解決微結構射出成型製程因流道淺窄流動阻力大而造成塑料流動性不佳之成型困難。利用本技術可達到快速加熱、控制加熱溫度等優點，進而大幅縮短生產週期、降低生產成本。
本研究主要利用ANSYS軟體模擬嵌入式感應線圈對於模具之公母模仁加熱的情形，並利用現有射出成型標準模具規格實際設計開發一組模具，同時設計出特殊線圈接頭與以電木材質之機構固定線圈於模具上配合射出成型製程開合模步驟進行升溫實驗來驗證。由設計模擬結果得知電流大小、線圈匝數及放置位置及模仁厚度等多項控制模溫參數，皆會影響模穴表面溫度高低及溫度分佈。本研究之模擬結果顯示具有良好升溫趨勢，可滿足微結構射出成型之溫度要求，証實嵌入式感應線圈能確實加熱射出成型模具，利用此方法可得到一般射出成型機台與設備製造微結構成品的可行性。

This mold is used for heating induction heating technology for research and development. To propose a high-frequency current through the induction coil induction heating embedded rapid increase in cavity surface temperature of the device method. Rapid heating by induction coil embedded mold temperature in plastic mold injection and continued heating phase, solution microstructure injection molding process flow due to a large shallow flow resistance caused by poor flow of plastic molding difficult. Use this technology to achieve rapid heating, control the heating temperature, etc., thus greatly shortening the production cycle, reduce production costs. In this study, using ANSYS simulation software embedded induction coil for the male and female mold mold heated situation, and use existing standard mold injection molding design and develop a set of specifications of the actual mold, and design a special coil connector with bakelite material of the body to fixed coil in the mold with the injection molding process clamping steps to verify the temperature experiments. From the design simulation results that the current size, the placement of the coil turns and the thickness of mold and mold temperature control and many other parameters, all affect the level of the mold cavity surface temperature and temperature distribution. Simulation results of this study show a good warming trend, micro-structure to meet the temperature requirements of injection molding, can indeed confirm that the embedded induction coil heating injection molds.

目錄
摘要 ii
ABSTRACT iii
誌謝 iv
目錄 v
表目錄 vii
圖目錄 viii
第一章 緒論 1
1.1 前言 1
1.2 研究動機 2
1.3 文獻探討 2
1.4 論文架構 8
第二章 感應加熱原理 9
2.1 感應加熱之簡介 9
2.2 電磁效應 11
2.2.1 集膚效應（Skin Effect） 11
2.2.2 鄰近效應 12
2.2.3 邊界效應 13
2.2.4 磁場集中效應 14
2.3 焦耳效應 14
2.3.1 磁滯損失（Hysteresis Loss） 14
2.3.2 渦流損（Eddy Current Loss） 15
2.4 加工物件之特性 17
2.4.1 電阻係數 17
2.4.2 相對導磁係數 18
2.4.3 溫度分佈 20
2.4.4 加熱時間 20
2.5 感應加熱之優點 21
第三章 電腦輔助工程之磁熱耦合分析 23
3.1 統御方程式 23
3.1.1 電磁場統御方程式 23
3.1.2 溫度場統御方程式 25
3.2 ANSYS基本分析流程 26
3.3 ANSYS耦合分析 27
3.4 嵌入式感應加熱模具模型模擬 30
3.4.1 電磁場分析 30
3.4.2 溫度場分析 35
3.5 公母模仁厚度設計 37
3.6 線圈匝數設計 38
3.7 不同模仁材料之模擬設計 40
第四章 模具開發步驟及實驗設備與方法 41
4.1 使用設備 46
4.2 實驗方法 51
第五章 結果與討論 53
5.1 嵌入式感應加熱模具模擬結果 53
5.1.1 電磁場模擬結果 53
5.1.2 溫度場模擬結果 55
5.2 公母模仁厚度設計模擬結果 56
5.2.1 電磁場模擬結果 56
5.2.2 溫度場模擬結果 57
5.3 線圈匝數設計模擬結果 60
5.4 不同模仁材料設計模擬結果 62
第六章 結論與未來研究 64
6.1 結論 64
6.2 未來研究方向 65
參考文獻 66
作者簡介 69

參考文獻

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