臺灣博碩士論文加值系統

企業面對大環境競爭，想要永續經營下去必須持續保持創新的態度，不斷改善自身的弱點，及提升競爭優勢。本研究是以一個案公司為研究對象，該公司在面板產業界已經擁有四十多年的經營經驗，面對市場瞬息萬變的生態，為了增加公司競爭力和獲利，積極導入創新製程，縮短產品開發流程、彈性調整產品組合與生產高附加價值產品。
此次於關鍵新製程導入過程中，遇到連原本技轉公司都無法解決之品質不良事件，個案公司以專案方式成立改善團隊，配合企業內導入行之有年的品質管理活動，成功採用六標準差定義(Define)、衡量(Measure)、分析(Analyze)、改善(Improve)及控制(Control)五個步驟來改善製程上的不良，達成客戶對品質的滿意和提高交貨率。
本研究透過個案公司案例之執行結果，來驗證所提出之六標準差專案推動步驟，確實是可以提升公司製程改善績效，及達到本專案研究目的，期望未來公司相關專案皆能套入此法，為企業創造出更多經濟效益。

In order to enhance companies’ competitiveness and keep sustainable development in the changeable environment, enterprises have to keep pursuing innovation and improving their weakness all the time. This study is to study a case company, which has manufactured many kinds of panels for more than 40 years. For facing the fluctuating market, the case company wants to enhance its competitiveness and earn more profits. Therefore, the case company took some actions, including implementing new manufacturing processes, shortening product development processes, adjusting the product-mix flexibly, and manufacturing high added-value products.
The motivation of this study was to investigate a project that was reported a poor quality issue. The quality issue could not be solved by the technology transferring company. The goal of this study was to organize a project team for solving this problem. With the implementation of quality projects for years, the project team of the case company used the five steps of Six Sigma, which consisted of Define, Measure, Analyze, Improve, and Control, to reduce the number of defects caused by manufacturing processes. The results of the project met customers’ satisfaction with products’ quality and improved orders’ filling rates.
Through the implementation of the project, this study showed that Six Sigma could improve performance of manufacturing processes and achieve the research purpose. The experience of this project could be viewed as a reference for managers to implement similar projects in order to create more economic profits in the future.

目錄
摘要.................................................I
ABSTRACT............................................II
誌謝.................................................III
目錄.................................................IV
圖目錄...............................................VI
表目錄...............................................VII
第一章 緒論.........................................1
1.1 研究背景與動機.................................1
1.2 面板技術簡介...................................2
1.3 研究目的......................................4
1.4 論文架構......................................5
第二章 文獻探討......................................6
2.1 品質管理演進...................................6
2.2 六標準差起源...................................7
2.3 六標準差意義...................................8
2.4 六標準差想法和改善活動..........................11
2.4.1 六標準差想法..................................11
2.4.2 六標準差改善活動...............................11
2.5 六標準差實際應用...............................13
第三章 研究方法......................................15
3.1 個案公司簡介...................................15
3.2 個案公司推動六標準差改善組織和機制.................16
3.2.1 六標準差執行團隊................................17
3.3 個案公司六標準差改善活動步驟......................17
3.3.1 定義步驟(Define)...............................17
3.3.2 量測步驟 (Measure).............................18
3.3.3 分析步驟(Analysis).............................20
3.3.4 改善步驟 (Improve).............................20
3.3.5 控制步驟 (Control).............................21
3.4 小結..........................................21
第四章 個案驗證.......................................22
4.1 製程流程說明....................................22
4.2 問題定義.......................................23
4.2.1 5W1H..........................................23
4.3 量測步驟.......................................24
4.3.1 圖案缺陷檢查裝置檢查方式..........................24
4.3.2 圖案缺陷檢查裝置檢查量測系統分析...................24
4.3.3 電性量測系統分析................................27
4.4 分析步驟.......................................27
4.4.1 實驗一：確認氮化矽成膜厚度與黑色小麻點不良之關係......28
4.4.2 實驗二：改變氮化矽成膜條件與黑色小麻點不良之關係 ......29
4.4.3 實驗三：製程流程變更與黑色小麻點不良之關係...........29
4.4.4 實驗四：製程流程優化.............................30
4.4.5 實驗五：最佳化驗證...............................30
4.5 改善步驟.......................................33
4.6 控制步驟.......................................33
4.7 管理意涵.......................................33
4.8 小結..........................................34
第五章 結論與建議.....................................35
5.1 研究結論.......................................35
5.2 未來建議.......................................36
參考文獻...............................................37

圖目錄
圖1-1 扭曲向列型液晶面板..............................3
圖1-2 廣視角液晶面板.................................3
圖2-1 摩托羅拉（MOTOROLA）假設允許製程有1.5Σ之偏移......9
圖2-2 六標準差基本想法(蘇朝墩, 2009)..................11
圖2-3 DMAIC模式....................................12
圖4-1 圖案缺陷檢查裝置量測系統分析.....................26
圖4-2 電性量測機再現性測試............................27
圖4-3 主要因子與RSD關聯圖............................31
圖4-4 電漿表面處理製程最佳化實驗之接觸阻抗分析電性圖......32
圖4-5 電漿表面處理製程最佳化實驗之接觸阻抗電性分析數據 ....32

表目錄
表1-1 扭曲向列型與廣視角面板差異.......................4
表2-1 製程平均值等於規格值中心時之不良率.................9
表2-2 製程平均值有1.5Σ之偏移時之不良率..................10
表4-1(A) 圖案缺陷檢查裝置樣本重複性測試.....................25
表4-1(B) 樣本重複性測試資料...............................26
表4-2 要因分析表......................................28
表4-3 變更膜厚對小麻點改善狀況..........................29
表4-4 改變氮化矽成膜條件對黑色小麻點改善狀況 ..............29
表4-5 加入H2+N2O電漿表面處理對黑色小麻點改善狀況..........30
表4-6 H2和N2O 之2因子3水準電極之接觸阻抗彙整表...........31

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