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研究生:徐京暘
研究生(外文):Ching-Yang Hsu
論文名稱:智慧型非接觸式陣列充電平台之研究
論文名稱(外文):Study of a Smart Contactless Charging Platform with Coil Array
指導教授:孫卓勳孫卓勳引用關係
指導教授(外文):Jwo-Shiun Sun
口試委員:賴柏洲楊昌正程光蛟孫卓勳
口試委員(外文):Jwo-Shiun Sun
學位類別:碩士
校院名稱:國立臺北科技大學
系所名稱:電子工程系研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2015
畢業學年度:103
中文關鍵詞:非接觸式充電平台
外文關鍵詞:Contactless Charging Platform
相關次數:
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  • 下載下載:16
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本論文以無線功率傳輸原理設計一非接觸式充電平台,將可對攜帶式裝置或其他電子裝置進行充電。充電平台和電子裝置間是採用電磁感應方式傳輸功率,並藉由繞線式線圈達到非接觸式功率傳輸,充電平台使用一微控制器控制開關切換,使陣列線圈平台可選擇性激發線圈,別於以往的非接觸式充電系統,本論文的陣列結構除了保有原系統的感應面積之外並能偵測次級側線圈的位置,驅動相對應的初級側線圈給負載做充電,達成智慧型充電以節省功率消耗。
經由實驗測試驗證,當感應線圈平行位移小於 2mm 以內時,也就是在近似於初級側線圈中心處,次級側感應接收經由電壓調整電路輸出直流電壓為 4.96V。次級側最大輸出功率可達 3.43W,最大傳輸效率為 64%。
This thesis proposes a contactless charging platform that allows portable devices or other mobile devices being placed and charged. Using wound-wire structure and electromagnetic induction, contactless power transmission can be achieved between platform and electronic devices. The charging platform adopts a microcontroller to select the appropriate array coils to be actived. The proposed array structure not only retains the original sensing area but also detects the secondary-side coil position to drive the primary-side coil and charge the load. Comparing to the previous version of contactless charging systems, the transmission efficiency increased by 6%. Therefore, it can improve the power consumption and achieve smart charging.The experimental results show that the secondary-side output voltage is 4.96V when the induction coil displacement is smaller than 2mm. The corresponding maximum output power and the maximum transmission efficiency are determined to be 3.43W and 64% respectively.
目錄

中文摘要 i
英文摘要 ii
誌謝 iii
目錄 iv
圖目錄 vii
表目錄 xi
第一章 緒論 1
1.1 研究背景 1
1.2 研究動機與目的 3
1.3 研究方法 4
1.4 論文架構 6
第二章 非接觸式功率傳輸原理分析與系統架構 7
2.1 前言 7
2.2 電磁應用理論 7
2.2.1 安培定律 7
2.2.2 比爾沙瓦定律 8
2.2.3 法拉第定律 9
2.2.4 馬克斯威爾方程式 10
2.2.5 邊界條件 11
2.3 耦合線圈與電感 13
2.3.1 電感自感 14
2.3.2 電感互感 15
2.4 耦合線圈結構之非理想效應 17
2.4.1 趨膚效應原理.. 17
2.4.2 近接效應原理 19
2.5 諧振電路 20
2.5.1 .RLC串聯諧振電路 20
2.5.2 .RLC並聯諧振電路 23
第三章 感應線圈之動作設計 25
3.1 感應結構概述 25
3.2 陣列線圈設計 26
3.3 感應線圈耦合方式的設計 27
3.4 鐵磁性材料的應用 29
3.5 感應線圈設計準則 30
3.6 製作初級側陣列線圈平台 31
3.6.1 製作次級側感應結構 33
第四章 電路設計 34
4.1 概述 34
4.2 磁簧開關 35
4.3 諧振電容 36
4.3.1 初級側諧振電容設計 37
4.3.2 次級側諧振電容設計 38
4.4 諧振頻率選擇 40
4.5 初級側電路設計 41
4.5.1 半橋驅動電路 41
4.5.2 半橋轉換器 43
4.5.3 微控制器控制電路 48
4.5.4 光繼電器 49
4.6 次級側電路設計 50
4.6.1 整流電路 51
4.6.2 濾波電路 52
4.6.3 電壓調整電路 53
第五章 硬體製作與模擬實驗結果 56
5.1 概述 56
5.2 硬體製作 56
5.2.1 初級側硬體製作 56
5.2.2 次級側硬體製作 58
5.3 實驗結果 59
5.3.1 系統量測條件 59
5.3.2 實驗結果量測 60
5.3.3 最大輸出功率量測 62
第六章 結論與未來展望 63
6.1 結論 63
6.2 未來展望 64
參考文獻 65
參考文獻

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