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[3]3GPP, 3GPP TS 34.121
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[5]http://en.wikipedia.org/wiki/UMTS_frequency_bands
[6]3GPP, 3GPP TS 36.101
[7]http://en.wikipedia.org/wiki/3GPP_Long_Term_Evolution
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[11]魏國峰、李威廷和莊惠如,「2.4GHz CMOS單混頻器射頻收發機RFIC之研製與量測」,奈米通訊,第十四卷,第四期,2007。[12]D. M. Pozar, Microwave and RF Design of Wireless Systems, John Wiley & Sons , New York, 2001.
[13]J. Ryynanen et al, “A single-chip multimode receiver for GSM900, DCS1800, PCS1900 and WCDMA,” IEEE J. Solid-State Circuits, vol.38, no. 4, pp. 594-602, April 2003.
[14]于岳,「降低EMI干擾技術綜觀」,零組件雜誌,第155期,2004。
[15]http://flyingdesign.sg1003.myweb.hinet.net/EMI%20Solution-2.pdf
[16]A. Wang, On-Chip ESD Protection for Integrated Circuits, Kluwer, 2002.
[17]H. C. Jiang, “The Protection of Electronic Devices Against ESD Events,” 2010.
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[19]http://www.eettaiwan.com/ART_8800510066_617739_TA_79fc
36f9.htm
[20]于岳,「傳導式EMI的測量技術」,電子設計資源網,2005。
[21]http://kunyichen.wordpress.com/2008/05/01/tdd-noise
[22]CTIA, CTIA_Test Plan for Mobile Station OTA Performance_Revision_2.2.2, 2008.
[23]劉權貴,3G雙模滑蓋式行動電話天線設計,碩士論文,中央大學,2005。
[24]https://sites.google.com/site/changch1011/my-blog/LTE-Bands
[25]http://www.wirelesspowerconsortium.com/developers/
specification.html
[26]羅國原,非接觸式感應充電技術應用於可攜式電子產品之研究,碩士論文,成功大學,2006。[27]張宗文,陣列鐵芯結構應用於非接觸式手機充電平台之研究,碩士論文,成功大學,2007。