臺灣博碩士論文加值系統

本實驗採用網版印刷技術搭配特殊調配之銀膠，開發穿戴式裝置的可拉伸電子元件電路。此銀膠以網版印刷手法將電路塗佈在厚度20 µm之彈性TPU承載膜上，可拉伸形變量達20%以上，且在拉伸狀態下可以保持導電能力，同時在拉伸後具有電阻恢復能力的可拉伸電路。
將可拉伸銀膠進行三種熱處理溫度、三種線寬以及四種幾何圖形的研究，以了解在不同條件下，進行動態拉伸20%形變且重複拉伸10,000次後電阻前後差異，以及靜態伸張10~30%狀態下的電阻變化趨勢。
實驗結果顯示經過20%形變量重複10,000次拉伸後，導電能力恢復的速度是隨著線寬設計越粗而越快。同時因為特殊之顆粒配比凝團範圍較大，所以容易阻塞網版而產生斷線，因此線寬設計需要大於300 µm為佳，成份中的高分子材料在100°C/30 min熱處理條件下擁有單位長度最小電阻變化率，而搭配Z型設計可以達到最快導電能力恢復速度與最小單位長度電阻變化結果。

In the experiment, screen printing with specially blended silver glues is adopted to develop stretchable electronic circuits for wearable device application. The silver paste is screen printed on an elastic TPU carrier film of 20um thickness. It can sustain 20% stretched deformation and still have degraded electronic conductivities which show recovery behaviors after removing external loading.

The stretchable silver glue was used with conditions of “three heat treatment recipes”, “three line widths” and “four geometric designs” to investigate electronic resistance variation phenomena under “repetitive 20% stretched deformation by 10,000 times” and “static 10~30% stretched deformation”, respectively.

Experimental results show that electronic conductivity recovery speed is faster by widening line width. To prevent printing open lines due to the screen clogging caused from wider coagulation size distribution ranges of this specially synthesized silver paste, line width is suggested to be larger than 300um. Polymer materials have the minimum variation for resistance per unit length under heat treatment of 100°C /30mins. By combining Z-shape line designs, it can get benefits of “fastest electronic conductivity recovery” and “minimum variation for resistance per unit length.”

摘要 I
ABSTRACT II
Abstract II
致謝 IV
目錄 VI
圖目錄 VIII
表目錄 XI
第一章 緒論 1
1.1前言 1
1.2 研究動機與目的 2
第二章 文獻回顧 5
2.1 穿戴式裝置概述與趨勢 5
2.2穿戴式體感應用領域與功能 7
2.3 全球相關研究與文獻概述 11
2.4 可拉伸導電材料種類 23
2.5 可拉伸底材材料種類 26
2.6 彈性底材附著度處理 29
2.7 乾燥與固化 31
2.8 漿料流變、細度、網版印刷 33
第三章 實驗設備與研究方法 38
3.1 實驗規劃-先驅實驗找出重要因子 38
3.2 實驗規劃-魚骨圖 43
3.3 實驗設計 44
3.4 實驗設備 46
3.5 實驗手法 53
3.6 先驅實驗 58
3.7 彈性導電材料拉伸前後的微觀結構變化 61
第四章 結果與討論 62
4.1 熱處理與動態拉伸對銀膜內部的顆粒影響 62
4.2 熱處理與拉動態伸前後顆粒尺寸變化趨勢 65
4.3不同熱處理條件下動態拉伸後導電性恢復能力觀察 67
4.4熱處理對動態拉伸瞬間之導電性的變化 68
4.5熱處理對靜態拉伸瞬間之導電性的變化 69
4.6不同熱處理導電膠隨著時間電阻變化追蹤 70
4.7不同幾何圖形之電路失效分析 71
4.8彈性銀膠的分析－傅里葉轉換紅外光譜分析 73
4.9彈性銀膠的分析－熱重分析（TGA） 76
4.10彈性銀膠的分析－氣相層析質譜儀分析（GC-MS） 77
4.11彈性銀膠巨觀的膜面變化－-step量測粗糙度變化 79
4.12 實驗結果與前案相較 81
第五章 結論 84
參考文獻 86

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