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1.6 Reference [1] K. J. Klabunde, Nanoscale Materials in Chemistry 2001, 1-13. [2] K. J. Klabunde, Nanoscale Materials in Chemistry, Wiley, New York, 2001. [3] X. Liu, Q. Dai, L. Austin, J. Coutts, G. Knowles, J. H. Zou, H. Chen, Q. Huo, Journal of the American Chemical Society 2008, 130, 2780-2782. [4] M. C. Daniel, D. Astruc, Chem. Rev. 2004, 104, 293-346. [5] M. Hu, J. Y. Chen, Z. Y. Li, L. Au, G. V. Hartland, X. D. Li, M. Marquez, Y. N. Xia, Chem. Soc. Rev. 2006, 35, 1084-1094. [6] Y. Huang, X. F. Duan, Q. Q. Wei, C. M. Lieber, Science 2001, 291, 630-633. [7] S. Colodrero, M. Ocana, H. Miguez, Langmuir 2008, 24, 4430-4434. [8] C. F. Duan, H. Cui, Z. F. Zhang, B. Liu, J. Z. Guo, W. Wang, J. Phys. Chem. C 2007, 111, 4561-4566. [9] H. L. Wu, C. H. Chen, M. H. Huang, Chemistry of Materials 2009, 21, 110-114. [10] E. Carbo-Argibay, B. Rodriguez-Gonzalez, J. Pacifico, I. Pastoriza-Santos, J. Perez-Juste, L. M. Liz-Marzan, Angewandte Chemie-International Edition 2007, 46, 8983-8987. [11] J. Zhu, L. Q. Huang, J. W. Zhao, Y. C. Wang, Y. R. Zhao, L. M. Hao, Y. M. Lu, Materials Science and Engineering B-Solid State Materials for Advanced Technology 2005, 121, 199-203. [12] N. Zhao, Y. Wei, N. J. Sun, Q. J. Chen, J. W. Bai, L. P. Zhou, Y. Qin, M. X. Li, L. M. Qi, Langmuir 2008, 24, 991-998. [13] H. J. Chen, X. S. Kou, Z. Yang, W. H. Ni, J. F. Wang, Langmuir 2008, 24, 5233-5237. [14] S. A. Harfenist, Z. L. Wang, R. L. Whetten, I. Vezmar, M. M. Alvarez, Advanced Materials 1997, 9, 817-&. [15] G. Malyavantham, D. O'Brien, M. Becker, J. Keto, D. Kovar, J. Nanopart. Res. 2004, 6, 661-664. [16] D. M. Mattox, Handbook of Physical Vapor Deposition (PVD) Processing, Elsevier, 1998. [17] K. Barbour, M. Ashokkumar, R. A. Caruso, F. Grieser, J. Phys. Chem. B 1999, 103, 9231-9236. [18] T. Fujimoto, S. Terauchi, H. Umehara, I. Kojima, W. Henderson, Chemistry of Materials 2001, 13, 1057-1060. [19] R. A. Caruso, M. Ashokkumar, F. Grieser, Langmuir 2002, 18, 7831-7836. [20] M. Y. Han, C. H. Quek, Langmuir 2000, 16, 362-367. [21] J. H. Park, Chemical Vapor Deposition (surface Engineering Series, Vol. 2), Wiley, 2001. [22] J. Puippe, in AESF Third International Pulse Plating Symposium, Washington, 1986. [23] N. V. Mandich, Metal Finishing 2000, 98, 375-380. [24] K. A. Assiongbon, D. Roy, Surf. Sci. 2005, 594, 99-119. [25] Z. Borkowska, A. Tymosiak-Zielinska, G. Shul, Electrochemica Acta 2004, 1209-1220. [26] J. T. Zhang, P. P. Liu, H. Y. Ma, Y. Ding, J. Phys. Chem. C 2007, 111, 10382-10388. [27] S. Strbac, R. R. Adzic, Electrochimica Acta 1996, 41, 2903-2908. [28] A. Sarapuu, M. Nurmik, H. Mandar, A. Rosental, T. Laaksonen, K. Kontturi, D. J. Schiffrin, K. Tammeveski, J. Electroanal. Chem. 2008, 612, 78-86. [29] C. Paliteiro, A. Hamnett, J. B. Goodenough, J. Electroanal. Chem. 1987, 234, 193-211. [30] A. Prieto, J. Hernandez, E. Herrero, J. M. Feliu, J. Solid State Electrochem. 2003, 7, 599-606.
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