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研究生:溫宏卿
研究生(外文):Hung-ching Wen
論文名稱:電漿處理對克維拉纖維複合材料介面及破壞性質之研究
論文名稱(外文):Effect of Plasma Treatments on the Interfacial and Fracture Properties of Kevlar Fiber Composites
指導教授:徐新興
指導教授(外文):Shin-shing Shyu
學位類別:碩士
校院名稱:國立中央大學
系所名稱:化學工程研究所
學門:工程學門
學類:化學工程學類
論文種類:學術論文
論文出版年:1993
畢業學年度:81
語文別:中文
論文頁數:121
中文關鍵詞:克維拉纖維環氧樹脂介面剪應力電漿處理微粒
外文關鍵詞:Kevlar fiberEpoxy resinIFSSPlasma treatmentMicrobond
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本研究以氣體(氧氣、氨氣)電漿蝕刻、單體(丙烯酸、丙烯氰)電漿披覆、
以及氣體電漿蝕刻/單體電漿披覆方法對克維拉149纖維進行表面處理,以
改善纖維與環氧樹脂的介面黏著。再以單纖抗張強度和微粒拉出(
Microbond pull-out)測試方法來研究纖維的強度及纖維與環氧樹脂間的
介面剪應力(Interfacial shear strength,IFSS)改變。經電漿處理後的
IFSS值提高1.1到2.07之結果 。而纖維之表面化學性質及表面形態則以
IR,ESCA與SEM測試並觀察。由電漿處理後,以環氧樹脂測單纖接觸角降低
的結果可知,纖維表面極性官能基濃度及表面能皆提高,使得纖維/樹脂
間介面剪應力提高。IR分析結果指出,丙烯酸及丙烯氰電漿披覆的薄膜有
極大部分是同核鍵結之結構,可知薄膜的組成是單體所構成的聚合物。
ESCA測試後與未處理纖維之原子比率比較,電漿處理後纖維表面原子組成
顯然已改變。此外 ,以SEM來觀察微粒拉出測試後的纖維/樹脂表面形態
。微粒拉出的破壞發生在介面層及環氧樹脂層,有些則有纖維剝離的情形
。結果顯示,隨著電漿處理時間及輸入功率的提高,經氣體電漿蝕刻及丙
烯酸電漿聚合薄膜之介面剪應力亦隨之提高,但丙烯氰電漿聚合薄膜之結
果與上述不同。

The surface of p-aramid poly( p-phenylene terephthalamide )(
PPTA,Kevlar 149)fibers was modified using gas(oxygen and ammo-
nia)plasma etching, monomer(acrylic acid,AAc and acrylonitrile
,AN)plasma deposition, and gas plasma etching / monomer plasma
deposition to improve their adhesion to epoxy resins. The eff-
ects on the fibers were characterized by changing the tensile
strength and interfacial shear strength (IFSS) of the fibers.
IFSS was measured using the microbond test method,which showed
that the IFSS increased by a factor of 1.1to 2.07 after plasma
treatments. The surface chemistry and morphology were charact-
erized by IR,ESCA, and scanningelectron microscopy (SEM) . The
plasma treatments increased the concentration of polar groups
and surface energy on the fiber surface,resulting in a fall in
the observed epoxy resin contact angle estimated by the drop-
let measurement technique, and also corresponding improvements
of interfacial shear strength between resins and the fibers .
Infrared analysis shows that plasma-polymerized deposition of
AAc and AN films have large fractions of homonuclear bonds and
that this materialis best described as a Polymer.In this study
,the atomic composition changes of the surface of Kevlar fibers
were identified by means of ESCA,referring to the atomic ratio
of virgen Kevlar. SEM was also used to study the topography of
fibers pulled from the epoxy resin.It was observed that micro-
bond pull-out failure occurred both at the interface and in
bulk epoxy resin. In some cases,fibrils were peeled from fibers
. From this study,it has been found that the interfacial shear
strength of the gas plasma etching and AAc plasma-polymerized
film increased with the increasing of plasma treatment time and
power input. However, the AN plasma-polymerized film is diffe-
rent.

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