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New aromatic bismaleimides containing bis(phenoxy)naphthalene
unit , were synthesized. The presence of oxyethylene bond in
the backbone is expected to enhance the flexibility and the
elogation at breakage of these resins. The presence of a
naphthalen unit in the backbone of the bismaleimide had
increased the curing temper ature and reduced the reactivity of
the maleimide bond. The cured resins showed higher Tg，thermal
stability and char yield for naphthalene-containing
bismaleimides than the corresponding analog. A series of
polyaspartimides containing naphthalene unit in the polymer
backbone were prepared by the polyaddition of this bismaleimide
and various diamines via a michael-type addition. Tg were in
the range 192∼231℃.and the 5% weight loss temperatures were
above 300℃ in nitrogn. In this study, The combination of
bismaleimide containing naphthalene unit with cyanate esters
had produced a series of B-T resins. The effect of chemical
composition and structure on the properties of bismaleimide-
triazine resin were investigated in detial in order to
understand the structures-properties relat ionship. The
bismaleimide-triazine resins have special features, such as
better resistance to moisture absorption, excellent chem- ical
resistance, good dimensional stability, low dielectric cons-
tant, and low dielectric loss,wich make this type of resin
import ant in the aerospace and electronic industries.
Aerospace applic ations include high temperatures adhesives,
protective coatings and matrix resin for structure composite.
Electric applications include printed circuit boards and
semiconductor encapsulants.
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