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研究生:溫麗箱
研究生(外文):Wen, Li-Hsiang
論文名稱:鋁鋅錫無鉛焊錫與銅基材之潤濕行為
論文名稱(外文):The Wetting Behaviour Between Al-Zn-Sn Pb-Free Solder and Pure Copper Substrate
指導教授:林光隆
指導教授(外文):Kwang-Lung Lin
學位類別:碩士
校院名稱:國立成功大學
系所名稱:材料科學(工程)學系
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:1996
畢業學年度:84
語文別:中文
論文頁數:79
中文關鍵詞:無鉛焊錫潤濕行為潤濕天平熱差掃描分析儀凝固曲線擴散係數
外文關鍵詞:Lead-free solderWetting behaviourWetting balanceDifferential Scanning CalorimetryCooling curveDiffusion coefficient
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本研究主要目的在於探討鋁-鋅-錫無鉛焊錫與純銅的潤濕行為。此外
,並對鋁-鋅 -錫無鉛焊錫的熱行為(如熔點?凝固曲線)以及基本物性(
如合金的比重)進行初步的研究。
本實驗先配製5Al-Zn(wt%),再與純錫混合配製不同組成的鋁-鋅-錫無鉛
焊錫合金(5Al-Zn) XSnY。採用潤濕天平並使用氯化二甲基胺 (
Dimethylammonium chloride ,C2H8ClN ,DMAHCl)為助熔劑,以浸鍍溫
度及浸鍍速度為主要參數進行潤濕實驗,利用潤濕天平所得到的結果作為
評判潤濕性的依據。再以掃描式電子顯微鏡觀察分析完成潤濕實驗之無鉛
焊錫與純銅的界面反應。此外,以電阻測熔點的方式,及熱差掃描分析儀
進行對此鋁-鋅-錫無鉛焊錫的熱行為探討。
研究結果顯示,鋁-鋅-錫無鉛焊錫與純銅具有良好的潤濕性。尤其是共晶
組成(5Al-Zn)9Sn91焊錫合金,即使在較低的浸鍍溫度下也可以有良好的
潤濕性。根據界面元素掃描分析(Line-Scanning),可以發現鋁和鋅元
素會擴散到鋁-鋅-錫無鉛焊錫與純銅的界面並在其界面上堆積,此現象即
可能是造成此焊錫合金系統與銅潤濕性良好的原因。 隨著5
Al-Zn的增加,所測量到的合金比重相對的減小;此外,由凝固曲線圖(
cooling curve)以及熱差掃描分析儀( differential scanning
calorimeter,DSC)的分析結果可以知道,隨 著5Al-Zn的增加,此鋁-
鋅-錫無鉛焊錫合金的熱行為越趨複雜,可以發現在溫度約 為198℃、270
℃、300℃、350℃、以及360℃左右可能會發生相變化,而且可以得到共
晶組成的鋁-鋅-錫無鉛焊錫合金共晶組成(5Al-Zn)9Sn91的共晶溫度大約
在198℃左右。

This study is to investigate the
wetting behaviour between the Al-Zn-Sn Pb-free solder and the
pure Cu . Futhermore, it also investigated the thermal
behaviour (such as melting temperature , cooling curve) and the
fundamental physical property (such as the specific gravity)
of the Al-Zn-Sn Pb- free solder system.
First of all,the 5Al-Zn(wt%) alloy was prepared and mixed up
with pure Sn to give the desired solder compositions (5Al-
Zn)XSnY. The wetting properties was investigated with a
wetting balance and applying Dimethylammonium chloride,
(DMAHCl), C2H8ClN, as the fluxes .The parameters
investigated include dipping temperature and dipping speed.
The results of the wetting curves were used to
characterize the wetting behaviour. The interfacial
reactions between the solder alloys and the pure Cu were
examined with the Scanning Electrone Microscope .
This work also applied the electrical resistivity
measurement to identify the melting temperatures
and applied the Differential Scanning Calorimeter(DSC)
to analyze the thermal porperties of the Al-Zn-Sn Pb-free
solder systems. All the experimental
results showed that the Al-Zn-Sn Pb- free solder systems have
a good wetting property with the pure Cu . The eutectic
composition (5Al-Zn)9Sn91, of the Al-Zn-Sn alloy system
exhibits good wetting behaviour even at low dipping
temperatures . The results of the interfacial elemental
line-scanning analysis described that the diffusion of the Al
and Zn to the interface between the solder and Cu seemed to be
the main reason for the Al-Zn- Sn solder to have a good
wetting behaviour with copper. The
specific gravity of the Al-Zn-Sn solder systems
decreases with respect to an increase in the wt% of 5Al- Zn
. The experimental results achieved from the cooling curves
and DSC futher revealed that the thermal behaviour became
complicated with the increasing wt% of 5Al-Zn. It is
expected from the results of these thermal behaviour analysis
that phase transformations may occur at 198℃, 270℃,
300℃, 350℃ and 360℃. And the eutectic
temperature of the Al-Zn-Sn solder alloy is located at 198 ℃.


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