臺灣博碩士論文加值系統

　　本研究主要的目的是發展一套高速影像識別法則，偵測出晶圓盤
(wafer)中晶粒(die)之取放形心(centroid)與擺向方位角度
(orientation)，並且回授相關訊號至X-Y工作平臺控制器上，作為影
像定位控制之用，以使得取放臂上的吸嘴能準確地吸取晶粒。由於
整個取放地速度極快，除了對影像識別系統要求高速的識別能力之外，
亦要求極高之精確度，以免吸嘴在吸取晶粒時，由於未對準形心而在
高速移動下甩落晶粒。而本影像識別之方法採用最小平方法逼近
(discrete least-squares approximation)晶粒邊緣，用以求得晶粒
形心與擺向方位角度，希冀此法可提供需自動化視覺檢測或識別許多
具有直線邊狀物件之參考。
　　此外，在晶圓搬運與物料掌控自動化過程中，將針對配備有視覺
系統的工業用可動機器人(mobile robot)，由於視覺系統的不精確度
(inaccuracy of vision system)可能發生機器手臂取放晶圓匣(wafer-
cassette)失效的狀況，予以描述與探討。

　　The main objective of the study is to develop a high-speed image recognition algorithm which is able to detect the center of mass of the chip on the die, and to feedback such a signal to the controller on the X-Y table for positioning control, so that the sucker installed on the robot arm can suck the chip precisely. Since the completion of a pick-and-place process is limited in a few tenth seconds, the system needs not only a high-speed image recognition system, but also a high-speed positioning system in order to prevent dropping off the chip because of the inaccurate sucking position and fast movement.
　　A material handling application of mobile robot to carry silicon wafer in a semiconductor company is also focused in this article. An accuracy problem of an industrial mobile robot implemented with vision system to perform pick-and-place operation is also investigated in this.