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研究生:王育謙
研究生(外文):Wang, Yu-Qian
論文名稱:無電鍍鎳與Sn-Zn-Al焊錫之潤溼行為
論文名稱(外文):Wetting Behavior Between Electroless Nickel and Sn-Zn-Al Solder
指導教授:林光隆
指導教授(外文):Lin, Guang-Long
學位類別:碩士
校院名稱:國立成功大學
系所名稱:材料科學工程研究所
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:1997
畢業學年度:85
語文別:中文
論文頁數:68
中文關鍵詞:無電鍍鎳無鉛焊錫錫鋅鋁潤溼行為材料科學物理
外文關鍵詞:Electroless NickelLead-free SolderSn-Zn-AlWetting BehaviorMATERIALS-SCIENCEPHYSICS
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This study is to investigate the wetting behavior between the
copper substrate which was deposited with electroless nickel as
a diffusion barrier for the ternary eutectic Sn-Zn-Al solder.
The copper plating was deposited on the electroless nickel to
improve the wetting behavior. The wetting experiment was
conducted with the wetting balance for the two systems of Cu/Ni-
P and Cu/Ni-P/Cu Plating at various temperature and fluxes. The
interfacial reactions between the solder and these two systems
after heat treatment were examined with Scanning Electron
Microscope and with X-ray diffraction. The contact angle
investigation was applied for estimating the temperature needed
for the occurrence of solder wetting without flux. The
experimental results for the Ni-P/solder system showed that good
wetting was achieved only at high temperature (above 350℃) and
with high concentration of active fluxes (above 5g/l DMAHCl).
The solder layer contains pores. The crystallization of
electroless nickel layer and less active fluxes could not
improve wetting. The experiment results of the Ni-P/Cu system
showed that the surface coverage of solder on Ni-P/Cu was more
than that on Ni-P at low concentration of fluxes (above 2.5g/l
DMAHCl), although it also showed partial wetting. The results of
the interfacial elemental line - scanning showed that the Zn
atom diffused to the interface between the solder and copper.
The X-ray showed that the interaction between solder and Ni-P/Cu
resulted in the formation of g-Cu5Zn8 compound which further
avoids the tin diffusing into the layer of copper plating.

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