Cover
Acknowledge
Contents
Abstract (in Chinese)
Abstract (in English)
Figure Captions
Chapter 1 Introduction
1-1 Overview of the intermetallic dielectric and interpoly oxide process
1-2 Motivation
1-3 Thesis outline
1-4 Reference
Chapter 2 Improvement of Water-Related Hot-Carrier Reliability by Optimizing the Plasma-Enhanced TEOS Deposition Process
2-1 Introduction
2-2 Experimental Procedures
2-3 Results and Discussion
2-4 Conclusion
Chapter 3 Plasma Charging Damage and Water-Related Hot-Carrier Reliability in the Deposition of Plasma Enhanced Tetraethylorthosilicate Oxide
3-1 introduction
3-2 Experimental Procedures
3-3 Results and Discussion
Conclusion
Chapter 4 The Characteristics of Polysilicon Oxide Grown on Amorphous Silicon Deposited from Disilane
4-1 Introduction
4-2 Experimental Procedures
4-3 Results and Discussion
4-4 Conclusion
Chapter 5 Study of Process Effect on the Polyoxide
5-1 Introduction
5-2 Experimental Procedures
5-3 Results and Discussion
5-4 Summary
Chapter 6 Impact of Post-Polysilicon Thermal Cycling on the Underlying Thin Gate Oxide
6-1 Introduction
6-2 Experimental Procedures
6-3 Results and Discussion
6-4 Conclusion
Chapter 7 Effects of Bottom Polysilicon on the TDDB of ONO Interpoly-Si Dielectric and Stress-Induced Low Field Leakage Current of ONO Interpoly-Si Dielectric
7-1 Introduction
7-2 Experimental procedures
7-3 Results and Discussion
7-4 Conclusion
Chapter 8 Conclusions and Recommendation for Future Research
8-1 Introduction
8-2 Suggestions for Future Work
Vita
Publication List
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