臺灣博碩士論文加值系統

本研究係針對電子構裝材料的特性要求, 以粉末冶金法製作Cu/SiC
複合材料, 探討製程中各項變因及添加Fe元素對Cu/SiC複合材料性質之影
響. 由實驗結果可知,Cu/SiC 複合材料具有良好的熱傳導性及低熱膨脹係
數及低密度等性質, 並可藉由SiC體積分率加以調整. 以SiC體積分率60 -
80%為例, 測得之熱膨脹係數在3.45 - 10.17 E-6/C之間, 相對應預估之
熱傳導性為187.9 - 231.2 W/m C, 其密度為3.19 - 4.03 g/cm3. 對於高
SiC體積分率複合材料, 採取不同粒度組合之粉末可提其緻密度, 增加壓
胚壓力亦可顯著提昇其緻密度及彎曲強度. 添加Fe並不能有效改善Cu與
SiC界面之潤濕性,但是Fe與SiC反應, 可明顯提昇其強度. SiC體積分率越
高則燒結強溫度應提高並延長燒結時間, Fe添加量越大則燒結溫度應降低
且燒結時間應縮短．

this research is to fabricate Cu/SiC composite for the
requirement of electronic packaging by powder metallurgy method.
then study the influences of various fabrication factors and Fe
addition to the properties of Cu/SiC composite.the result show
that Cu/SiC composite has excellent thermal conductivity and low
coefficient of thermal expansion and low specific gravity. In
addition, these properties can tailor by the volume fraction of
SiC. For example, composites with SiC volume fraction among 60 -
80% have the measurement thermal expansion coefficient among
3.45 - 10.17 E-6/C ; the predicted thermal conducttivity is
among 187.9 - 231.2 W/m C ; the measurement specific gravity is
among 3.19 - 4.03 g/cm3.for high SiC volume fraction composites,
using mixing powder of different particle size can increase
density. to increase compact pressure can also increase density
and bending strength. although the addition of Fe can not
improve the wetting of SiC with liquid copper, but obvious
increase strength by the reaction of Fe with SiC . The sintering
temperature and time should increase with increasing SiC volume
fraction. in contrast, the sintering temperature and time should
decrease with increasing the contentof Fe.