臺灣博碩士論文加值系統

在本研究中，針對75MHz筆記型電腦散熱性能從事一系列的實驗研究與理論分析。在實驗方面，本文提出了量測75MHz筆記型電腦中主要元件溫度變化與散熱性能之方法。研究中以藉由MS-DOS作業系統下執行三種不同的測試程式，來觀察在不同的系統散熱量下此筆記型電腦之散熱特性。在文中又提出了一通用之無因次公式，來表現75MHz筆記型電腦中各重要元件的暫態溫度變化特性。在未來更進一步作筆記型電腦細部分析中，上述通用公式將適當地被採用為內部分析之邊界條件。另外，經由此筆記型電腦在穩態下散熱方式而計算之總散熱量，與實驗量測的輸入功率相比較，其結果相當符合。 在理論分析方面，本研究中發展出一交談式且有效率的筆記型電腦熱網路分析軟體。利用上述發展出之分析軟體，分析了筆記型電腦五種熱傳模型的散熱特性。由分析結果與實驗比較得知：使用熱傳模型（五）所作散熱分析能得到一令人滿意的計算結果。在研究中更進一步針對筆記型電腦散熱中三個主要影響參數作一系列的探討。此三個主要的影響參數為：印刷電路板與底殼間隔比率，散熱鋁板表面放射率及等效熱傳導係數。此參數探討結果將可提供作75MHz筆記型電腦散熱設計上相當重要的參考資料。

Both the experimental investigation and the theoretical analysis on thermal performance of 75MHz notebook computers have been conducted in the present research. In the experimental aspect, an experimental method for measuring temperature rises and thermal performance for the components of interest in a 75MHz notebook computer has been presented. Thermal behaviors of the notebook computer running three testing cases under MS-DOS, which represent different rated power dissipations, have also been investigated. Generalizeddimensionless formulas are proposed to interpret transient behaviors for thecomponents of interest for 75MHz notebook computers. These generalized formulas will become the known boundary conditions when the interior thermal analysis performs in the further development of thermal analyzer for notebook computers. For steady-state thermal evaluation of 75 MHz notebook computers, the total heat dissipated from the cabinet surfaces of notebook computer to theultimate ambient has been evaluated, and comparisons between the calculatedresults and the experimental input power have been made with a satisfactoryagreement. In the theoretical aspect, an effective and interactive thermal analyzerincluding thermal model establishment and thermal network analysis for notebookcomputers has been developed. With this developed thermal analyzer, the thermal performances of notebook computers using five types of thermal model have been evaluated, and a series of parametric studies have also been explored.Comparison with the experimental data indicates that the temperature rises andthermal performances for the components of interest can be calculatedsatisfactorily by the developed thermal analyzer with Model (V). Furthermore,three sets of relationships of mean temperature rises for the components of interest in terms of total power input and either one of the followingparameters: spacing ratio, equivalent thermal conductivity and emissivityof Al-plate have been presented. These explicit empirical correlations are very helpful for thermal designers who can easily evaluate the thermalperformance of 75MHz notebook computers.