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研究生:侯尚杰
研究生(外文):Hou, Shang-Chieh
論文名稱:氧化鋁射出成形之胚體熱性質成形壓力及溶濟脫脂動力之研究
論文名稱(外文):Study on thermal properties, holding pressure and dynamic of solvent debinding in alumina injection molding
指導教授:韋文誠韋文誠引用關係
指導教授(外文):Wen-Cheng J. Wei
學位類別:碩士
校院名稱:國立臺灣大學
系所名稱:材料科學與工程學研究所
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:1997
畢業學年度:85
語文別:中文
論文頁數:127
中文關鍵詞:氧化鋁射出成形壓力強度脫脂熱重分析
外文關鍵詞:aluminainjection moldingpressureslovent debindreaction orderthermal debinding
相關次數:
  • 被引用被引用:5
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摘要本研究改變射出成形保壓(PIII)階段的壓力、保壓(tIII)時間及模溫
,觀察穴外壓力和模穴壓力的變化情形,和保壓壓力對試片性質的影響。
此外,分析試片溶劑脫脂速率受脫脂溫度的影響,量測孔隙分佈,試片長
軸方向上的膨脹率和高分子的殘留情形,並對高分子添加劑,包括石臘、
聚丙烯和硬脂酸,及氧化鋁射料(固含量56.5%)於空氣中加熱分解的特性
進行探討。改變保壓壓力(PIII)從5%至95%,保壓時間(tIII)最長至75秒
,並以壓力感應器測量注口之前(稱之為穴外),和注口之後(稱之為模穴)
的壓力變化。結果顯示穴外壓力和模穴壓力曲線的變化趨勢不同,隨保壓
提高曲線的最大壓力皆變大。以天平測量生胚的重量,游標尺度量試片尺
寸,三次元量測儀量測試片的平坦度。結果顯示隨保壓提高生胚重量增加
,試片尺寸亦變大,尤其是長軸方向最明顯,試片的表面的平坦度在提高
保壓後變佳。量測生胚重量的變化和保壓時間的關係,顯示射壓提高會延
長保壓階段射出料的充填時間。利用阿基米德法計算生胚密度、燒結體的
相對密度,以及密度值的分佈,顯示上述三種性質和保壓及保壓時間較無
關聯。以萬能動態試驗機作燒結體的四點彎曲強度測試,試片破斷強度隨
保壓增加的變化亦不大。本研究使用正庚烷當作脫脂溶劑,淬取試片中可
溶性高分子。以實驗中斷法和即時紀錄法,紀錄試片置於正庚烷中重量損
失和時間的關係。改變正庚烷溫度,從40oC至60oC,藉以比較正庚烷溫度
對溶劑脫脂的影響。將可溶性高分子移除量不同的試片進行水銀測孔分析
,顯示孔隙大小呈雙峰分佈,且孔隙體積隨脫脂時間而增加。藉由雷射測
距儀測得試片長軸方向上的膨脹率,結果顯示提高正庚溫度膨脹愈顯著。
以熱重分析儀測定試片殘留的高分子,顯示溶劑脫脂初期呈現核心收縮的
型式。本研究使用熱重分析儀於空氣環境昇溫至550 oC,量測高分子添加
劑及氧化鋁射料的重量損失和溫度之間的關係;此外,並改變昇溫度速率
,從2oC/min至20oC/min,比較昇溫速率的影響。結果顯示昇溫度愈慢,
熱重損失曲線愈向低溫偏移。以Ozawa和Friedman的分析方法求出高分子
添加劑及氧化鋁射料的活化能值,和反應級數。結果顯示高分子添加劑及
氧化鋁射料的活化能相差不大,且射料的反應級數在反應的後半期發生轉
變。關鍵字:氧化鋁、射出成形、壓力、強度、脫脂、熱重分析、反應級
數。
AbstractThe effects of holding pressure (PIII) and holding time
(tIII) on the properties of injection molding parts were
investigated. Besides, gate pressure and cavity pressure were
monitored by pressure sensors positioned in front of and inside
of the gate. Three polymeric additives, paraffin wax,
polypropylene, stearic acid, and alumina feedstocks with former
polymeric additives, in a solid loading containing 56.6 vol%,
were studied by thermogravimetric analysis in air. In addition,
weight loss, pore size distribution and dilatometry of test bars
were measured during solvent debinding.Increasing holding
pressure from 5% to 95% and holding time up to 75 sec, the
pressure-time traces showed different tendency in the mold.
Maximum pressure occurred at the end of pressure build-up.
Increasing the holding pressure (PIII), 5% to 95%, raised the
gate pressure and cavity pressure. Because of resistance through
the gate, the cavity pressure was slightly smaller than the gate
pressure. The mass, dimensions and flatness of injection molded
were measured, and would increased as holding pressure. A high
holding pressure(≧50%) would also decrease the sink of
specimens, and prolonged the packing time by increasing holding
time. Green bulk density, fired density and four-point bending
fracture strength were obtained. The results showed that there
was not apparent dependence of green bulk density, fired density
and fracture strength on the injection pressure(PIII) .N-heptane
was used to leach soluble polymers in solvent debinding. The
weight of sample measurements decreased with time was measured
by two methods, either interruption and in-situ time methods.
The temperature effects of n-heptane tested from 40oC to 60oC,
the result showed that the case of 60oC exhibited a fast
leaching rate and a maximum swelling ratio measured by a laser
dilatometer. Pore size of debinding specimens were measured by a
mercury porosimeter, and showed a bimodal distribution, but
increased the pore volume as the debinding time proceeded.TGA at
a heating rate from 2 oC/min to 20 oC/min of polymeric additives
and alumina greens were conducted up to 550 oC in purged air
50ml/min. The TGA curves of polymeric additives and feedstocks
shifted to low temperature as the heating rate decreased. Then,
the activated energy and reaction order were analyzed using
Ozawa and Friedman, methods. The activated energy was in range
90?0 kJ/mol, but the reaction order of alumina green parts
changed from 0 to 3.2 in the later stage of the thermal
debinding of alumina feedstocks. Keywords:alumina, injection
molding, pressure, solvent debinding, reaction order, thermal
debinding.
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