因應電路系統中電子的傳輸頻率大幅提高，且為適應使用環境溫度的提昇，傳統電路板中的高分子材之耐熱性質受到嚴重考驗。本實驗係以3,4'-ODA、BDTA、NA等三單體聚合形成聚醯亞胺樹脂，並在無接著劑下與銅箔進行接著，而製成雙層印刷電路板。測試積層板對溫度的抵抗能力及耐化學藥品性的程度，並檢測其介電常數和損耗因數，而評估此電路板之實用性。實驗結果顯示，此型聚醯亞胺樹脂和銅箔間有不錯的剝離強度，可達商業化81b/in的基本要求。且在耐溫性，耐化性及在電氣性質方面亦能有極佳的表現。故此樹脂應可廣泛應用在印電路板上，大幅改善傳統電路板之缺點，是極具開發的價值。

For the transmission frequency of electron in electric circuit system has been risen highly, and to fit the temperature promote in applied circumstances. The resist heat property in polymer stuff of traditional circuit board has been undergo serious ordeal. In this study, the polyimide are prepared by in-situ polymerization of three monomer reactants: monoisopropyl ester of 5-norbomene-2,3-dicarboxylic acid (NE) 3,4'-oxydianiline (3,4'-ODA)diisopropyl ester of 3,3',4,4'-benzophenonetetracarboxylic acid (BDTE) , and attach with the copper foil to manufacture two-layer printed circuit board without adhesive. By testing the laminate ability in heat, chemical, and examining its dielectric constant and dissipation factor, to evaluate the practicability of this kind circuit board. The experiment result reveals the peel strength between resin and copper foil has good presentation. It also has excellent performance in resist heat property, resist chemical property and insulation property, so the type of polyimide resin can be broadly applied in printed circuit board. On account of it can improve the effect of the traditional circuit board by a wide margin, so it has a great value to develop this research.