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ABSTRACTThis study presents thermal deformation on solder joints
during repeated cycledworking period because of the mismatch of
CTE among solder joints、overmold andPCB(print circuit board) in
PBGA. It leads to fatigue of material interfaces .In addition ,
it destroys and affects the lives of electronic package products
,and decreases the reliability of electronic package products.
In this research ,Moire￠ interferometry is adopted as an
experiment method to analyze thermal strain distribution during
thermal cycle and suggest design engineers a advanced method for
reliability and stress distribution .The result of this
experiment will provide further data concerning life of
electronic package products .
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