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研究生:劉毅成
研究生(外文):Liu, Yi-Cheng
論文名稱:覆晶接合焊錫隆點之重流製程及其性質探討
論文名稱(外文):The Reflow Process and Properties of the Flip Chip Solder Bumps
指導教授:林光隆
指導教授(外文):Kwang-Lung Lin
學位類別:碩士
校院名稱:國立成功大學
系所名稱:材料科學(工程)學系
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:1998
畢業學年度:86
語文別:中文
論文頁數:1
中文關鍵詞:覆晶隆點重流無電鍍鎳電鍍焊錫剪力強度
外文關鍵詞:Flip ChipSolder BumpReflowElectroless NickelPlating Pb-SnShear Strength
相關次數:
  • 被引用被引用:5
  • 點閱點閱:229
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  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:1
中文摘要 隨著IC高I/O數的需求,半導體電子構裝發展出覆晶接合
技術。本論文主要探討用重流製程製作覆晶接合之焊錫隆點,及其性質的
研究。文中討論鋁/銅/無電鍍鎳/焊錫隆點經重流後其間相互的反應,並
於溫度210和250℃進行一次、五次、十次重流後測試隆點的剪力強度。用
真空濺鍍方式製作導電層鋁及黏合層銅,並於銅薄膜上析鍍無電鍍鎳做為
擴散障礙層,再電鍍焊錫合金於鎳磷層上,最後,使用重流技術將其隆點
化成為焊錫隆點。實驗結果顯示,厚度2μm之無電鍍鎳於重流溫度210
、250℃,時間15秒,可以有效做為導電層鋁及焊錫隆點間的擴散障礙層
;此外,黏合層銅於相同的重流條件有擴散穿過厚度2μm、3.9μm的無電
鍍鎳而與焊錫隆點反應生成介金屬化合物,不過,厚度6.5μm、10μm之
無電鍍鎳則不會發生這種情形。同時,無電鍍鎳層亦會與焊錫隆點生成界
金屬化合物。重流溫度250℃之平均剪力強度優於210℃;重流溫度250℃
,經過五次、十次重流後,平均剪力強度為35.4~40.6g。
Abstract Flip chip has
become interest to electronic package because of its gang
bonding and high I/O capability. This present study
investigated the flip chip solder bump produced by reflow
process and its properties. It has been investigated in a series
of study on the solder bump structure of solder / nickel /
copper / aluminum, the interaction among these metal combination
during reflow. In addition, investigations also made on the
shear strength of solder bump when reflowed at temperatures of
210℃, 250℃ and for five, ten times cyclic reflow. The aluminum
and copper were sputtered on silicon wafer. The electroless
nickel was applied as a barrier layer and wetting layer. The
tin-lead solder was deposited on the electroless nickel with
electroplating. The reflow interaction behavior was investigated
with SEM on the cross section of the bump. The experimental
results revealed that the aluminum layer did not penetrate
through the 2μm electroless nickel barrier layer at reflow
temperatures of 210℃and 250℃for a period of 15 sec. In
addition, the copper layer diffuses and penetrates through the
2μm, 3.9μm electroless nickel barrier layer and interacts with
the tin-lead solder, but not diffuses and penetrates through
the 6.5μm, 10μm. Meanwhile, nickel also reacts with solder. An
intermetallic compound layer was formed at the interface between
solder and electroless nickel barrier layer. The results of the
average solder bump shear strength at reflow temperature 250℃
is better than 210℃;for five and ten times cyclic reflow, the
average shear strengths are around 35.4~40.6g.
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