臺灣博碩士論文加值系統

在IC構裝製程中,拉線過程(Wire-bonding process)是一非常重要的環節,
其連接晶圓(Die)與導線架(Leadframe),當作電流的橋樑,使整顆IC能夠正
常地運作.當金線高度(Loopheight)不足時,容易造成金線下陷而使金線接
觸晶圓,造成短路使IC失效,因此,在整個過程中,我們必須仔細思考這個因
素.在本論文中,即以探討金線高度為要點,藉由預測金線之外形,進行研究
與分析.本文共分為兩大部份,第一部份主要是利用簡單的實驗工具與分析
軟體-ANSYS,利用不同之銲線路徑為基礎來進行驗證,以確認分析結果的正
確性.第二部份中,則是討論其預成型(pre-forming)所造成金線外形之影
響,並利用田口式實驗計劃法,探討影響金線高度之主要成因並求出其外
形.關鍵詞 : IC構裝 銲線程序 金線外形 金線高度 預成形

Wire-bonding process is one of the most important process in IC
packaging.Through this process, the gold-wire connects die and
leadfrane, and electronic signal pass through the gold-wire.
Four factors are important in wire-bonding:kink-height, reverse
loop, loop height and wire tension. These factors can be used
to check the suitability of wire bonding.Among the four factors,
two important ones - loop height and reverse loop factor will be
considered in the wire profile study of this paper, wire
tensionfactor will be used to check the results. In this
thesis, a simple experimentwas performed and use ANSYS software
to verify the results. Then the effects offactors such as
reverse loop, loop height etc., were studied. Finally,
Taguchimethod was used to find optimum design parameters.
Keywords : IC PACKAGING, WIRE-BONDING PROCESS, LOOP HEIGHT, WIRE
PROFILE, REVERSE LOOP