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研究生:謝梅寬
研究生(外文):Hsich, Mei-Kuan
論文名稱:矽質場效電晶體壓力感測器之製作及特性研究
論文名稱(外文):Fabrication and Characterization of Silicon JFET Pressure Sensor
指導教授:張忠誠張忠誠引用關係
指導教授(外文):Chung Cheng Chang
學位類別:碩士
校院名稱:國立海洋大學
系所名稱:電機工程學系
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:1997
畢業學年度:86
語文別:中文
論文頁數:79
中文關鍵詞:零點輸出電壓壓力感測器場效電晶體表面濃度
外文關鍵詞:offset voltagepressure sensorJFETsurface concentration
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半導體型壓力感測器和一般傳統型壓力感測器比較有高感度、高精
度、無遲滯、體積小、可體積化等優點,因此被廣泛的應用在各種領域,
且隨著半體製成的壓力感測器之感度受薄膜的幾何結構、壓阻位置及壓阻
係數影響非常大,所以製造一個均勻、平滑、可精確控制厚度的矽薄膜,
與擴散一層低表面濃度的電阻,有助於壓力感測器品質的提高。近幾年來
有許多的研究,利用不同的薄膜幾何結構,希望對矽質壓力感測器的感度
及各項重要參數能有所改善。基於此觀點,本論文以場效電晶體取代一般
壓阻式的壓力感測器之擴散電阻,研究場效電晶體的電壓控制通道電阻之
非線性特性對感測器感度的影響並與一般壓阻式壓力感測器作比較,期望
能獲得更佳的感度及穩定度,此為本論文所研究的目的。 本實驗研究
矽薄膜大小的控制、影響壓力感測器輸出電壓之各項參數( 包括薄膜大小
與厚度、壓阻位置與方向、壓阻濃度) 及JFET的pn接面壓縮通道的特性對
感度(Sensitivity)、零點輸出電壓(Voffset)的影響。 在薄膜大小控
制方面:利用85C、45%wtKOH溶液方向性蝕刻的特性及對Si、SiO2之不同
的蝕刻速率,以相對時間差法製造一方形薄膜面積1mm×1mm,且將薄膜厚
度控制在15um,同時獲得正面對準窗口,使得JFET能擴散在正確的位置(
薄膜邊緣中央) 與晶格方向。 在感度的測量方面:感度會隨著閘極電
壓的提高(Vgs由0V->2V)而提高(NormalizeSensitivity由1->1.08) 及感
度也會隨著輸入電壓的提高(Vin由1V->5V)而提高(Normalize
Sensitivity由1->1.03) 在零點輸出電壓 (Voffset)方面:可因調整
閘極電壓或提高輸入電壓使零點輸出電壓(Voffset)獲得適當的補償。

Semiconductor pressure sensors have better characteristics
than conventional pressure sensors, such as high sensitivity,
high accuracy, no hysteresis, small size and on-chip, to
recommend their useful in a wide field. Ongoing advances in IC
fabrication technology, semiconductor pressure sensors have
become to the major objective of manufacture already. The
sensitivity of a silicon pressure sensor is influenced by the
geometry structure of thin diaphragm, piezoresistor layout and
piezorestive coefficients.Therefore, the semiconductor pressure
sensors which the diaphragm has a uniform, smooth, well-
controlled thickness dimension and low resistivity of the
piezoresistors are helpful to promote the performance of the
sensors. Recently, there are many reports about improving the
sensitivity and other important parameter of the silicon
pressure sensors by utilizing special geometry structure. From
this point of view, the objective of the paper focus on the
fabrication and characterization of JFET pressure sensors,which
replace four resistors by JFET in the form of a Wheatston
bridge, its voltage-variable-resistance effect can improve the
performance of the sensor. In this experiment, the process
design, precision control of diaphragm thickness, the parameters
which may influence the output voltage (sensitivity and Voffset)
of sensors including the diaphragm thickness,piezoresistors
layout, dopant concentration and pn junction of JFET etc. are
discussed. On the precision control of diaphragm
thickness, we use 85C、45%wt、KOH etchant which has different
etch rate for Si and SiO2 to make a thin square diaphragm (1mm
length and 15um thickness) and alignment window simultaneously,
then JFET can be diffused on the correct position of diaphragm
and crystallographic line. On the measurement of
sensitivity, it can be increased (Normalize Sensitivity from 1
to 1.08) by increasing gate voltage (Vgs from 0V to 2V) or it
can be increased(Normalize Sensitivity from 1 to 1.03) by
increasing input voltage (Vin from 1V to 5V). On the
measurement of zero-pressure offset voe (Voffset), it can be
compensated for adjusting the gate voltage or increasing input
voltage.

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