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Chemical-Mechanical Polishing (CMP) technique has become one of the major plan
arization processes in advanced semiconductor manufacturing. CMP technique can
achieve global planarization and it shows potential applications in multileve
l interconnect and new IC structure design. Novel CMP Processes combined new f
ormulations in slurry and pads for polishing dielectric and metal films have b
een developed rapidly. Low dielectric constant polymers emerge as a potential
candidate of a dielectric film for deep sub-micron processes due to the consid
eration of power consumption, signal propagation delay, and crosstalk between
signal lines. Hence, development of low dielectric constant materials applied
in IC interconnects has become a major issue. However, study on the CMP charac
teristics of low dielectric constant polymer has just started. Hence, the poor
understanding of the CMP mechanism is resulted in the difficulty of applying
low dielectric constant polymers in IC fabrcation. In this study, two major cl
asses of low dielectric constant polymers polysiloxanes; Dow Corning FOX-14 (H
SQ) and Allied Signal 418 (MSQ); and polyimides; BPDA/PDA, PMDA/ODA, and 6FDA/
ODA. These polymers were coated and cured under different processing condition
s. The chemical structures of the studied polymers were well characterized by
the FTIR spectroscopy. The characteristics of the prepared films surface refr
active index, thermal-stress and surface roughness were also investigated. The
experimental results showed that the molecular structures had significant eff
ects on the studied physical properties. The dielectric constants of the five
materials were in the range of 2.453-2.996. Thication. In this study, two majo
r ces of low dielectric constant polymersawere processed and characterized: po
lysiloxanes; Dow Corning FOX-14 (HSQ) and Allied Signal 418 (MSQ); and polyimi
des; BPDA/PDA, PMDA/ODA, and 6FDA/ODA. These polymers were coated and cured un
der different processing conditions. The chemical structures of the studied po
lymers were well characterized by the FTIRwere processed and
characterized: polysiloxanes; Dow Corning FOX-14 (HSQ) and
Allied Signal 418 (MSQ); and polyimides; BPDA/PDA, PMDA/ODA,
and 6FDA/ODA. These polymers were coated and cured under
different processing conditions. The chemical structures of the
studied polymers were well characterized by the FTIR
spectroscopy. The characteristics of the prepared films
surface refractive index, thermal-stress and surface roughness
were also investigated. The experimen
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