臺灣博碩士論文加值系統

　　由於半導體製程技術的成熟發展，使得微機電系統（ Micro Electro Mechanical System）的研究得以持續進展，而微機構可應用於生物工程、航太工程和醫學工程等。
　　本論文主要利用半導體製程，在（100）矽晶片上製作之無數微小凸緣角為二氧化矽（SiO2）及氮化矽（SiNx），依其彈性以作為兩機械結構表面之接合。
　　此微結構機械栓緊系統不需任何化學接合機制、熱、超音波震動，它是個純機械式的內鎖裝置。每個結構為18umx18um，高12um，每平方公分有接近200000個獨立的結構，可形成強力之接合，其預測結合的張力強度超過400kpa。
　　我們已建立了微結構之相關製程技術資料庫，本文結構可應用於機械結構之結合，包括在醫學方面細胞組織之接合與IC封裝，都有其擅揚之所在。

　　Duo to the mature of semiconductor process technology, the study on the MEMS "Micro Electro Mechanical System" is will developing. Micro joining structures can be applied to bio-engineering, aerospace - engineering and medical engineering.
　　In the paper, we use semiconductor process to sfabricate many micro elastic deflection of Sio2 and SINx flanges angles on (100) silicon wafer that acts as mechanical adhesives structure between two wafer surfaces.
　　The micro structures fastening system do not need any chemical adhesive, heat or ultrasonic vibrations, it is a pure mechanical interlocking devic e. The structure is 18□m x 18□m by 12□m high , there are approximately 200,000 individual structure per cm2 of substrate, resulting in a strong strength of the join to be in excess of 400kpa.
　　We have make some database for the fabrication process of the micro structures. The result can apply t the areas where need micro joining structureds including medical uses (joinging tissues) and IC packaging.