臺灣博碩士論文加值系統

半導體製造業長久以來均以縮短生產週期、降低生產成本、增加生產製造彈性、提高設備使用率、增進品質及產品追蹤等為製造目標。由於半導體之製程非常複雜，因此需要有更好的管理資訊系統與生產自動化技術來輔助完成其目標，製造執行系統（MES）正好符合此需求。
本研究根據OMG所制訂之CORBA規格為基礎，探討如何有效率地建構一個分散可整合式的製造執行系統。經由分析探討的結果，得到一個適當且具效率的分散式CORBA架構；再以此分散式CORBA架構作為發展MES系統的基礎，提出CORBA-based MES系統的建構流程。首先使用統一模式語言（UML）進行系統需求分析與物件類別模型建立，設計MES的物件系統；再以CORBA規格的介面定義語言（IDL）設計分散式物件介面；最後再將MES系統分析與設計的結果，使用CORBA軟體VisiBroker for Java實作 CORBA-based MES系統，建構一分散可整合式製造執行系統。本研究以WIP Tracking 模組為例進行設計驗證。

Shortening cycle time, decreasing production cost, increasing manufacturing flexibility, increasing equipment utilization, and promoting quality are the main goals of the production management for semiconductor manufacturing plants. Due to the complexity of wafer fabrication processes, there is a need for providing management information systems working with automated manufacturing systems. Manufacturing execution system（MES）is suitable for this requirement.
This study adopts the CORBA technology developed by the OMG, as a framework for developing a MES. This study also analyzes various distributed architectures for providing the best one for the MES. Then, based on the best architecture, a procedure for building the CORBA-based MES is proposed. First, this study uses the Unified Modeling Language (UML) to perform system analysis and design in order to develop a MES object system. Then, this research uses the Interface Definition Language (IDL) to design the distributed object interface. Finally, following the results of MES analysis and design and using the CORBA software called VisiBroker for Java, a CORBA-based MES can be implemented. This study chooses the WIP tracking module as an example to illustrate the design of a CORBA-based MES.

第一章 緒論………………………………………………………1
1.1 研究背景與動機……………………………………………1
1.2 研究目的……………………………………………………2
1.3 研究方法與架構……………………………………………3
1.4 章節概要……………………………………………………4
第二章 文獻探討…………………………………………………6
2.1 製造執行系統………………………………………………6
2.1.1 製造執行系統之演進…………………………………6
2.1.2 製造執行系統之定義…………………………………7
2.1.3 MES與規劃層及控制層之關係……………………….8
2.1.4 MES的功能模組……………………………………….9
2.1.5 MES相關軟體…………………………………………11
2.2分散式物件架構……………………………………………13
2.3 CORBA與DCOM………………………………………………15
2.3.1 OMG的物件管理架構…………………………………15
2.3.2 微軟的DCOM架構…………………………………….17
2.3.3 CORBA與DCOM的比較………………………………..18
2.4 CORBA的應用………………………………………………20
2.5 文獻探討結論…………………………………………….22
第三章 分散式物件技術CORBA………………………………….23
3.1 ORB之角色與功用…………………………………………23
3.2 ORB的標準結構……………………………………………24
3.3 分散式物件與ORB介面之互動關係………………………26
3.4 CORBA程式設計……………………………………………28
3.5 總結與討論……………………………………………….30
第四章 CORBA-based MES系統之分散式架構探討…………….31
4.1集中式處理系統與分散式處理系統的比較與探討……..31
4.1.1 一部機台之比較與探討…………………………….34
4.1.2 二部機台之比較與探討…………………………….36
4.1.3 四部機台之比較與探討…………………………….38
4.1.4 總結討論…………………………………………….40
4.2 四種分散式處理架構的比較與探討…………………….42
4.2.1 四部機台之比較與探討…………………………….46
4.2.2 八部機台之比較與探討…………………………….49
4.2.3 十六部機台之比較與探討………………………….53
4.2.4 三十二部機台之比較與探討……………………….56
4.2.5 總結討論…………………………………………….60
第五章 CORBA-based MES系統建構………………………………62
5.1功能需求分析……………………………………………….62
5.1.1 訂定預期達成功能……………………………………62
5.1.2 系統需求掌握…………………………………………64
5.2 建立分析模型………………………………………………67
5.3 建立物件類別模型…………………………………………68
5.3.1 活動事件分析…………………………………………68
5.3.2 辨識屬性與方法………………………………………70
5.4 辨識物件類別間傳送的訊息………………………………73
5.5 設計分散式物件介面………………………………………77
5.6 建立分散式物件系統架構…………………………………81
5.7 整合分散式CORBA架構與分散式物件系統架構………….82
5.8 CORBA-based MES系統之建構流程……………………….84
5.9 WIP Tracking實例設計……………………………………85
5.10 WIP Tracking系統實行………………………………….87
第六章 結論與未來展望………………………………………….91
6.1結論………………………………………………………….91
6.2未來展望…………………………………………………….92
參考文獻…………………………………………………………..93

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