在電子工業生產過程中，封裝是一項重要的製程，因為在最後的封裝結果將直接影響電子產品本身的功能與品質，而由於溫度變化所引發的熱應力變化更是決定電子產品在以後工作中的性能。所以本研究以數值模型模擬分析不同型式的電子封裝產品，在高溫差的封裝後，在室溫工作時，各組件間溫度和應力的分佈情形。
本研究採用有限元素及John H.Lau 的有限元素分析理論來探討電子封裝產品之熱應力問題，經研究結果得知溫度和熱應力分佈間的關係，並介電腦數值的方法預測最大應力的位置與對產品可能的不良影響。該結果將有助於電子封裝技術上，使產品品質、可靠度提高和降低封裝產品的不良率，以提高產值效能。

The packaging process is important in the electronic industry, because the function and quality of electronic product is effected significant in the packaging operation. Due to the change of temperature in performance and the different thermal expansion coefficient between several material in component of the package, while the thermal stresses occurs following and effect its operation. Now we analysis temperature field and stresses distribution of the different type electronic product in room temperature after cooling by numerical simulation of computer. The result can predict the location of stress concentration and supply for designer for prevention of failures caused by thermal stress and rising the better reliability in performance.

目錄
摘要………………………………………………………………….…..I
英文摘要………………………………………………………………...II
目錄……………………………………………………………………. III
表目錄…………………………………………………………………. .V
圖目錄…………………………………………………………………...V
符號……………………………………………………………………...X
主文
第一章 序論……………………………………………………………..1
1.1前言…………………………………… ……………………………..1
1.2研究動機……………………………………………………………...2
1.3文獻回顧…………………………………………………………….. 3
1.4本文內容架構……………………………………………………….. 5
第二章 模型說明和理論假設…………………………………………..6
2.1模型假設……………………………………………………………. .6
2.1-1基本假設………………………………………………………….. 6
2.1-2接觸界面假設……………………………………………………...7
2.1-3模型說明…………………………………………………………...8
2.2 三維電子封裝模型………………………………………………….9
2.2-1 多腳封裝模型一………………………………………………..9
2.2-2 多腳封裝模型二……………………………………………….12
2.3基本方程式…………………………………………………………14
2.3-1統禦方程式……………………………………………………….14
2.3-2平面應力與平面應變…………………………………………….15
2.3-3三維應力與應變………………………………………………… 17
2.4有限元素法的應用………………………………………………18
2.4-1二維有限元素分析……………………………………………….19
2.4-2三維有限元素分析……………………………………………….21
第三章 結果與討論……………………………………………………26
3.1模型一之應力分析…………………………………………………26
3.2模型二和模型三的冷卻回焊模擬之應力分析……………………28
第四章 結論與建議……………………………………………………30
參考文獻………………………………………………………………32

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