臺灣博碩士論文加值系統

半導體元件的尺度有日益縮小的趨勢，傳統的有腳架的構裝方式，也漸漸地變成軟銲接點的構裝方法，利用銲球來連接晶片（chip）與基材（substrate），軟銲接點雖有其優點，但也由於材料及界面的複雜，為了增加軟銲接點構裝的可靠性，有必要對於銲球之熱傳及熱應力分析加以探討，以提供設計及製造之參考。
本論文將針對覆晶（Flip Chip）構裝半導體元件因受熱而產生溫度變化時的熱應力及應變，作有限元素計算之研究，由於軟銲材料在工作溫度範圍內，以顯示具有材料非線性之問題，所以將以ABAQUS FEM軟體，再佐以適當的材料模式作熱彈塑變形之計算，並針對一些參數進行分析。

The dimensions of microelectronics packaging are getting smaller, the lead frame packaging will be replaced by the solder joint packaging gradually. Flip chip technology that allowed direct attachment of chips onto ceramic substrates was developed for main frame computers in 1960`s. This technology resulted in the achievement of a high density packaging and is applied to Ball Grid Array （BGA） and chip size packages（CSP）. For those applications, it is important to study the thermal stresses and strains of the solder balls to optimize the structure of the packages.
This paper presents the thermal stresses and strains of flip chip packaging of micro-electronic devices due to temperature changes and thermal cycles. The material properties of the solder ball are temperature dependent, the nonlinear finite element method is used to study the thermal elasto-plastic deformation of the solder balls. Some parametric studies are presented.

摘要...................................................................Ⅰ
Abstract..............................................................Ⅱ
誌謝...................................................................Ⅲ
目錄...................................................................Ⅳ
表目錄...............................................................Ⅵ
圖目錄...............................................................Ⅶ
符號說明...........................................................Ⅸ
第一章 緒論........................................................1
1-1 前言...............................................................1
1-2 文獻回顧.......................................................2
1-3 本文架構.......................................................4
第二章 理論分析................................................5
2-1 溫度場分析...................................................5
2-1-1 熱傳模型方程式........................................5
2-1-2 解溫度分析................................................7
2-2 應力場分析...................................................9
2-2-1 基本方程式................................................9
2-2-2 彈塑模型....................................................9
第三章 幾何、材料性質與邊界條件...............15
3-1 幾何模型與有限元素模型..........................15
3-2 材料性質、起始值與邊界條件..................17
3-2-1 材料性質...................................................17
3-2-2 起始值與邊界條件...................................23
第四章 結果與討論............................................26
4-1 整體與局部分析...........................................26
4-2 銲球材料性質分析.......................................27
4-3 縫隙填膠的熱膨脹係數分析.......................29
4-4 縫隙填膠的缺陷分析...................................30
4-5 間隙高度分析...............................................31
4-6 基板厚度分析...............................................32
第五章 綜合結論與建議.....................................44
5-1 綜合結論........................................................44
5-2 未來研究方向的建議....................................45
參考文獻..............................................................46
自述......................................................................49

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