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研究生:余昱辰
研究生(外文):Yu-Chen Yu
論文名稱:氫在HBT元件中所造成的穩定度問題之特性研究
論文名稱(外文):The Effect of Hydrogen on MOCVD Grown HBT Device
指導教授:李建平李建平引用關係
指導教授(外文):Chien-Pin Lee
學位類別:碩士
校院名稱:國立交通大學
系所名稱:電子工程系
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:1999
畢業學年度:87
語文別:中文
論文頁數:80
中文關鍵詞:穩定度曲線近似
外文關鍵詞:HBTMOCVDCarbonHydrogen
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本論文主要研究的主題是針對金屬有機化學氣相沉積(MOCVD)所磊晶的碳攙雜雜異質接面雙載子電晶體(Carbon-Doped Heterojunction Bipolar Transistor)在元件首次上所造成的基極電流暫態現象做描述與分析討論。由於在磊晶的過程中無可避免會有碳與氫的結合,經由熱分解,釋出部份的氫離子,增加了基極的覆合電流,影響元件的穩定度。在我們的討論中,我們提出四種可能機制,利用其所代表的方程式對量測的基極電流做曲線近似,藉以釐清運作的行為模式。接著,我們討論溫度效應對元件的影響。對於首次量測後的元件,欲使其暫態現像能重覆出現,我們可利用200。C-250。C的溫度加以回火,使氫離子脫離碳的束縛而釋出少許,便可使暫態效應一再產生,並透過不同的溫度回火所造成現象回復比例的差異推算出欲釋出氫離子所需的反應活化能。隨後,我們討論若在元件製程前, 先對材料做高溫的回火,用以驅離基極中與碳結合的氫離子,這樣便可使元件免於暫態效應的產生。

In this thesis,we focus on the transient phenomenon which only show up on virgin device of MOCVD (metal-organic chemical vapor deposition) grown HBT (hetero-junction bipolar transistor). Because there is no way to inhibit hydrogen from incorporating with carbon acceptor,by theraml decomposition,hydrgogen will be released to increase base recombination current and affect the stability of the device.With our analysis and discussion ,we hope that the stability of the device will be improved. We provide some physical model for curve fitting in order to understand the overall physical operating mechanism. And,we use thermal treatment under no bias to look forward to the properly post-annealing temperature for re-initiation. After the transient phenomenon show up,we can anneal device with 200。C-250。C for re-initiation.We can also extract the activation energy by varying the annealing temperature. And then ,we discovery that with a suitable pre-annealing condition before process ,the transient effect will be eliminated .

誌謝 i
中文摘要 ii
英文摘要 iii
目錄 iv
圖檔說明 vi
第一章 緒論 1
1.1 研究動機 1
1.2 論文組織 2
第二章 基本概念 3
2.1 暫態效應的起因與所造成的影響 3
2.1.1 暫態效應的研究 3
2.1.2 暫態效應的觀察 6
2.2 低溫回火造成元件暫態效應的影響 7
2.3 高溫回火造成元件暫態效應的影響 8
2.4 本章結語 10
第三章 曲線近似 11
3.1 單向與雙向擴散係數近似法 11
3.1.1雙向擴散模型分析法 14
3.1.2單向擴散模型分析法 15
3.1.3擴散模型的討論 16
3.2 單一時間常數的近似分析法 16
3.3 雙時間常數的近似分析法 17
3.4 一個時間函數加上擴散模型的近似法 20
3.5 模型近似的結語 22
第四章 暫態效應的量測與分析 23
4.1 Be-Doped HBT 元件的製程與量測 23
4.2 電流密度對暫態效應時間常數的影響 24
4.3 低溫回火暫態效應量測與分析 26
4.4 高溫回火後暫態效應的量測與分析 27
4.5 暫態效應結論 29
第五章 氫造成暫態效應的總結與討論 31
5.1 氫造成暫態效應的總結 31
5.2 對未來研究的建議 33
參考文獻 34

[1] Sandeep R. Bahl, "Reliability Investigation of InGaP/GaAs Heterojunction Bipolar Transistor," Proc. IEDM. pp.815-818 (1995)
[2] T. Henderson, "Hydrogen-Related Burn-in in GaAs/AlGaAs HBTs and implications for Reliability," Proc. IEDM. pp.203-206 (1996)
[3] M. Borgarino, R. Plana, S. Delage, H. Blanck, F. Fantini, J. Graffeuil, "On The Burn-in Effect in C-Doped GaInP/GaAs HBTs ."
[4] Jim Y. Chi,Ke Lu , "A Mechanism for Hydrogen-Related Transient Effect in Carbon-Doped AlGaAs/GaAs Hetero- Structure Bipolar Transistors." IEEE EDL. ,Vol.19, pp 408-410,No.11,1998.
[5] J. Y. Chi,K. Lu, "Mechanism for the Initial Current Gain Increase in Carbon-Doped Heterostructure Bipolar Transistors."
[6] H.Fushimi and K. Wada, "Degradation mechanism in Carbon- doped GaAs minority-carrier injection devices"IEEE Trans.Electron Devices,vol.44,pp.1996-2001,1997.
[7] T. Takahashi, S.Sasa, A.Kawano, T.Iwai, T.Fujii, "High- Reliability InGaP/GaAs HBTs Fabricated by self-Aligned Process," Proc. IEDM94, pp.191-194,1994.
[8] T.Henderson, V.Ley, T.Kim, T.Moise, D.Hill, "Hydrogen--Related Burn-in in GaAs/AlGaAs HBTs and Impications for Reliability," Proc. IEDM96,pp203-206 ,1996.
[9] S.A.Stockman, A.W.Hanson, M.Lichtenthal, M.T. FresinA, G.E.Hofler, K.C.Hsieh, G.E. Stillman, "Passivation of Carbon Acceptors during Growth of Carbon-Doped GaAs, InGaAs,and HBTs by MOCVD." Journal of Electronic Material, Vol.21, pp.1111-1118,No.12,1992.
[10] N.Bovolon, R.Schultheis, J.E.Muller,P.Zwocknagl, E. Zanoni, "A Short Term High-Current-Density Reliabilty Investigation of AlGaAs/GaAs Heterojunction Bipolar Transistor," IEEE EDL.,vol.19,pp.469-471 ,1998.
[11] Q.J.Hartmann, H.Hwangbo, D.A.Ahmari, M.T.Fresina, J.E. Baker , G.E.Stillamn, "Removal of Hydrogen from the base of Carbon-doped In0.49Ga0.51P/GaAs heterojunction bipolar transistors by ex situ annealing and the effects on device characteristics," Appl. Phys. Lett.,vol68,no.7,pp.982-984,1996.
[12] Hartmann QJ, Fresina MT, Ahmari DA, Stockman SA, Baker JE, Barlage D, Hwangbo H, Yung A, Feng M, StillmanGE. "Effects of annealing on the performance of InP/lnGaAs HBTs grown by LP-MOCVD," Proc. 1997 International Conference on Indium Phosphide and Related Materials IEEE. Pp505-508,1997.
[13] Yow HK, Houston PA, Button CC, David JPR, Ng CMS. "Effects of high temperature annealing on the device characteristics of Ga/sub 0.52/In/sub 0.48/P/GaAs and Al/sub 0.52/In/sub 0.48/P/GaAs heterojunction bipolar transistors."Journal of Electronic Materials, vol.27, no.1, pp.17-23, 1998.

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