本論文主要在於發展一套監控系統，用於電子迴旋化學氣相沉積(ECR-CVD)系統，讓使用者經由主控電腦就能進行化學氣相沉積系統的監控。整個監控系統由四個部份組成：主控電腦、前置腔體電腦、主控腔體電腦和機器手臂控制器。每個控制部份都是獨立之程式架構，以RS-232為溝通連結介面，其中主控電腦方面，以Windows 95作業系統下的軟體來負責全程的監控，並以圖控方式顯示由前置腔體電腦與主控腔體電腦所傳回的監控資料。此監控軟體具有以下之功能：（1）使用者可自己編輯製程控制程式，（2）可進行製程程序的監控，（3）可進行製程監控訊號的儲存，（4）錯誤檢測與警告，（5）具有密碼保護功能。

A real time monitoring system for an ECR-CVD system is proposed in this thesis. This monitoring system includes the host computer, the pretreatment chamber computer, the growth chamber computer and the robot controller. The users can supervise the ECR-CVD system through the RS-232 serial communication port. The host computer, an industry personal computer, is designed as the host supervisor based on Windows 95 operation system and the graphical monitoring interface program to monitor and control the whole process of the ECR-CVD system via the current data feedback from the process chambers. This proposed program has the capabilities of (1) building up the recipe, (2) process monitoring, (3) data acquisition, (4) alarms and (5) basic system security.

Chinese Abstracti
English Abstractii
Acknowledgments (Chinese)iii
Contentsiv
Index of Tables vi
Index of Figures vii
Chapter 1 Introduction.........................................1
1.1 Overview..................................................1
1.2 The scope of The thesis...................................3
Chapter 2 An Introduction to ECR-CVD Automation System.........4
2.1 Theories of Chemical Vapor Deposition.....................4
2.1.1 Fundamentals of Chemical Vapor Deposition..............4
2.1.2 Deposition Sequence....................................6
2.2 ECR-CVD Process Equipment.................................7
2.3 Configuration of ECR-CVD Automation System................9
2.3.1 Mechanical Architecture of ECR-CVD Automation System..11
2.3.2 Monitoring System of ECR-CVD Automation System........17
Chapter 3 Monitoring System —Hardware........................21
3.1 Host Computer............................................22
3.2 Chamber Computers........................................27
3.3 Robot Controller.........................................30
Chapter 4 Graphical Monitoring Interface Program..............33
4.1 Introduction Windows 95..................................33
4.1.1 The System Architecture in Windows 95.................34
4.1.2 Message Driven Architecture...........................36
4.2 A Preemptive Multitasking Operating System...............37
4.3 Graphical Monitoring Program Architecture................39
4.3.1 Manipulating Flow.....................................43
4.4 Simulation...............................................50
Chapter 5 Conclusion and Future Work..........................55
Reference.....................................................58

[1] Nino A.Masnari, John R.Hauser, Gerald Lucovsky, Dennis M. Maher, Robert j Markunas, and Jimmie J, Wortman, “Center for Advanced Electronic Materials Processing “Proceedings of the IEEE, Vol. 81, No. 1, January 1993
[2] Richard S. Muller, Theodore l. Kamins, “Device Electronics for Integrated Circuits,” John Wiley & Sons, Inc. 1977
[3] J. C. Chiou, k. C. Juang, and M. C. Chen, “Copper Chemical Vapor Deposition from Cu (hexafluoroacetylacetonate) Trimethylvinylsilane,” j. Electronic Materials, vol.23, No. 4, p.p. 383-390, 1994
[4] Hugh O. Pierson, “Handbook of Chemical Vapor Deposition Principles, Technology and Applications,” NOYES PUBLICATIONS p26~28
[5] Robert Zorich, “Handbook of Quality Integrated Circuit Manufacturing,” ACADEMIC PRESS, INC.
[6] Y. l. Nissim, A. Katz editors, “Single Chamber Processing,” NORTH-HOLLAND, 1993
[7] D. J. Ehrlich, “Critical Issues for Single-Chamber Manufacturing: The Role of Laser Technology,” Lincoln Laboratory, Massachusetts Institute of Technology Lexington, Massachusetts
[8] Cerhard Lewin, Ph.D., “Fundamentals of Vacuum Science and Technology,” Plasma Physics Laboratory Princeton University
[9] “PC2000 2-axis Position Control Card,” Ching Shang Incorporation
[10] “IM483 Miniature High Performance Microstepper Drive,” Intelligent Motion Systems, Inc.
[11] “C320 turbo User’s Manual,” Moxa Technologies Co. Ltd.
[12] Peter W. Gofton, “Mastering Serial Communications,” SYBEX, Inc.
[13] “A821-PGH Multi-Function Card User’s Manual,” New Approach Co.
[14] “C4000 Controller Instruction Manual,” JEL Corporation
[15] “Introducing Microsoft Windows 95,” Microsoft Corporation
[16] “Supporting Microsoft Windows 95,” Microsoft Corporation
[17] Charles Petzold, “Programming Windows 95,” Microsoft Press. July,1996
[18] G. Lucovsky, J. T. Fitch, D. V. Tsu, and S. S. Kim, “Atomic structure in SiO2 thin films deposited by remote plasma-enhanced chemical vapor deposition, “J. Vac. Sci. Technol., 1989
[19] David J. Kruglinski, “Inside Visual C++ Version 4,” Microsoft Press, March, 1996
[20] Peter Van Zant, “Microchip Fabrication-A Practical Guide to Semiconductor Processing,” McGraw-Hill, Inc.
[21] 莊達人，VLSI製造技術，高立圖書有限公司，March, 1995
[22] 姜志明，“Cu-CVD 即時監控系統的製作(2)”，國立交通大學，碩士論文，
民國八十七年六月
[23] 蔡明志，”Win32 程式設計實務”，松崗出版社 1998