摘要
本研究採用固液擴散接合之法，低溫接合，高溫使用概念，將其應用到厚膜-薄膜混成電路製程上。首先製作銀厚膜導體，再於銀厚膜（8μm）表面蒸鍍低熔點金屬層銦（8μm 或3μm）或錫（3.5μm），將兩蒸鍍條件相同試片加壓（0.03∼0.04MPa）疊合，並加溫至銦或錫熔點以上，進行固液擴散接合，進而以SEM、EDX及EPMA量測剖面接合情形及反應生成物組成，X-ray印證反應生成物種類，拉伸試驗機量測接合剪應力。
研究結果顯示：試片未經燒結，在銀銦界面已有AgIn2介金屬化合物的形成，隨著接合溫度升高或持溫時間增加，液態銦逐漸向銀層擴散並與銀厚膜反應生成AgIn2，厚膜中的銀會進一步與AgIn2反應形成Ag2In。鍍8μm銦之試片接合相以AgIn2為主；而鍍8μm銦之試片接合相以為Ag2In主。蒸鍍錫之銀厚膜試片，接合前界面則未生成銀錫化合物，加溫後液態錫逐漸與銀厚膜反應生成Ag3Sn，最後厚膜中的銀與Ag3Sn界面再反應成Ag4Sn。機械性質方面，若厚膜中所有之銀完全與銦反應生成介金屬化合物，將使基板與金屬層附著力變小。經由微結構解析，本論文提出銀厚膜之銀-銦、銀-錫的固液擴散模型以解釋其反應機構。

Abstract
Solid-liquid interdiffusion (SLID) bonding between silver and indium, and silver and tin has been investigated in this study to develop heat-resistant microjoints for thick-film conductors. Silver conductive thick film (8μm in thickness) was coated by a layer of indium(8 or 3μm) or tin(3.5μm) using thermal evaporization method. Two pices of the In-coated or Sn-coated specimens were compressed at 0.03-0.04 Mpa and heated at temperatures hight than the melting points of In and Sn. The bonding phases of the micropoints were examined by through SEM, EPMA and XRD. The bonding strength of the microjoints was drtermined using shear test. Through the analysis data, a mechamism of Ag-In and Ag-Sn SLID for thick films is proposed.

目錄
摘要（中文）…………………………………………….………………. Ⅰ
摘要（英文）……………………………………………………………. Ⅱ
誌謝………………………………………………………………………. Ⅲ
目錄………………………………………………………………………. Ⅳ
表目錄……………………………………………………………………. Ⅵ
圖目錄……………………………………………………………………. Ⅶ
壹、前言…………………………………………………………………… 1
貳、固液擴散之理論及文獻回顧………………………………………… 3
2-1 電子構裝的發展……………………………………………………. 3
2-2 固液擴散之定義與原理..…………………………………………... 5
2-3固液擴散接合文獻回顧...…………………………………………... 9
參、實驗與裝置…………………………………………………………… 13
3-1 實驗流程…………………………………………………………... 13
3-2 實驗材料…………………………………………………………... 13
3-3 實驗方法…………………………………………………………... 13
3-3.1厚膜製作………………………………………………………. 13
3-3.2蒸鍍……………………………………………………………. 15
3-3.3加溫接合………………………………………………………. 15
3-3.4切割與研磨……………………………………………………. 16
3-3.5儀器分析………………………………………………………. 16
3-3.6拉伸測試………………………………………………………. 17
肆、實驗結果……………………………………………………………… 18
4-1 銀厚膜蒸鍍銦固液擴散接合……………………………………... 18
4-1.1接合界面生成物組成分析……………………………………. 18
4-1.2單片X-ray繞射分析………………………………………….. 21
4-2銀厚膜蒸鍍銦接合機械性質測試………………………………… 22
4-3銀厚膜蒸鍍錫固液擴散接合……………………………………… 23
4-3.1接合界面生成物組成分析……………………………………. 23
4-3.2單片X-ray繞射分析………………………………………….. 25
伍、討論………………………………………………………………….. 27
5-1銀銦系統固液擴散機構解析……………………………………… 27
5-1.1動力學探討……………………………………………………. 27
5-1.2固液擴散之簡單模式說明……………………………………. 28
5-2銀銦系統機械性質解析…………………………………………… 32
5-3銀錫系統固液擴散機構解析……………………………………… 33
陸、結論…………………………………………………………………… 37
柒、未來展望…………………………………………………………….. 38
參考文獻………………………………………………………………….. 39

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