臺灣博碩士論文加值系統

本研究藉由鋁之高熱傳導率搭配低熱膨脹係數之多晶矽(Polysilicon)，以熱壓燒結法，分別於固、液相燒結狀況下，製作高體積分率之Al/(Si)P複合材料；並以物理量測與機械測試等方法，研究與探討在固、液相之燒結環境下，Si添加相尺寸與體積分率對於複合材料性質之影響，以期開發出符合電子構裝用途(低熱膨脹係數、高熱傳導率及高強度)之材料。
相較之下，經液相燒結之複合材料具有較優良之物理與機械性質；在相同之體積分率下，複合材料之熱膨脹係數隨著Si顆粒尺寸增大而升高；至於機械性質(抗彎強度)則呈現相反之趨勢。若固定Si顆粒尺寸，單獨探討體積分率對複合材料之影響，可發現不論物理性質或機械性質都隨著 Si體積分率之增高而下降。
由實驗結果得知，以熱壓法製作之高體積分率Al/(Si)P複合材料，兼具低熱膨脹係數、高熱傳導率、低密度以及高抗彎強度，就其性質而言，頗具電子構裝領域應用之潛力。

目 錄
謝誌……………………………………………………………………. Ⅰ
摘要……………………………………………………………………. Ⅱ
總目錄………………………………………………………………….. Ⅲ
圖目錄………………………………………………………………….. Ⅴ
表目錄………………………………………………………………….. Ⅶ
一、 前言………………………………………………………………. 1
二、 理論基礎…………………………………………………………. 2
2-1電子構裝技術……………………………………….….……. 2
2-2複合材料熱壓製程…………………………………………... 4
2-3燒結理論……………………………………………………... 6
2-3-1固相燒結原理………………………………………… 6
2-3-2液相燒結原理………………………………………… 7
2-4電子構裝用複合材料性質預估.………………………….…..8
2-4-1 熱膨脹係數……………………………………………8
2-4-2 熱傳導率………………………………………………9
三、實驗步驟與方法…………………………………………………… 18
3-1粉末製作與混合……………………………………………… 18
3-2熱壓燒結……………………………………………………… 18
3-3微結構分析…………………………………………………… 19
3-4 物理性質量測………………………………………………..19
3-4-1 密度量測…………………………………………….. 19
3-4-2 熱膨脹係數量測…………………………………….. 20
3-4-3 熱傳導率量測……………………………………….. 21
3-5 機械性質試驗……………………………………………….. 21
四、結果與討論………………………………………………………… 31
4-1熱壓溫度對複合材料性質之影響 …………………………. 31
4-1-1 緻密度分析…...………………………………………31
4-1-2 熱膨脹係數分析……………………………………32
4-1-3 機械性質分析………………………………………32
4-2液相燒結之複合材料性質分析..……………………………. 33
4-2-1 緻密度分析…………………………………………33
4-2-2 熱膨脹係數分析……………………………………33
4-2-3 熱傳導率預估值之探討……………………………35
4-2-4 抗彎強度分析………………………………………35
4-3 Al/(Si)P複合材料應用於電子構裝之可行性評估.………36
五、 結論..………………………………………………………………49
六、 參考文獻……………………………………………………….… 50
附錄………………………………………………

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