本研究的目的是以矽基微加工(Silicon Based Micromachining)技術研製一微型熱導感測器(Miniature Thermal Conductivity Detector)。其製程為利用蝕刻技術於一1cmX1cm的矽晶片上製備一玻璃絕熱支撐膜，而後在此玻璃膜上，以熱蒸鍍的方式鍍上具有高溫度電阻係數(Temperature Coefficient of Resistivity, TCR)的鎳薄膜當作氣體感測區中的加熱導線，並蒸鍍金薄膜製作外接線路導線；在此同時，以非等向性蝕刻液於另一矽晶片上製作兩道10000μmX500μmX20μm的氣體通道，其中氣體感測區為39nL。以膠合方式將上述兩片晶片結合，並進行導線接合及毛細管柱接合製程，即完成了一完整的微熱導感測器。本研究亦有對製作出來的微型熱導感測器做一些基本的校正測試。製作出來的微型熱導感測器除了可因應微氣相層析儀的需要，還可應用於氣體流量計、真空計、測漏儀、溫度計及微熱卡儀等方面。

A miniature thermal conductivity detector has been designed and fabricated by silicon based micromachining. The sensor consists of four serpentine nickel thin films, which has highest temperature coefficient of resistivity than other common metal. The Ni film resistors are supported on a Pyrex glass membrane. The Pyrex glass of 500μm is anodically bonded on a silicon chip first, and then ecthed and lapped to 40μm. The silicon chip has been previously etched with two cavities to reduce heat dissipation. The Pyrex glass serves as substrate for Ni film resistors that are aligned with silicon cavities. Gold films are also deposited for wire bonding pads. Another piece of silicon chip etched with two gas channels of 500X10000X20μm are aligned with Ni film resistors and then bonded with epoxy. With wire bonding on the gold pads, a micro-gas thermal conductivity detector is finished. The resistances are also calibrated. The miniature thermal conductivity detector not only can be used in a micro gas chromatography but also be formed a gas flow sensor, vacuum sensor, gas leak sensor, temperature sensor and microcalorimeter.

中文摘要...............................I
英文摘要...............................II
誌 謝 ...............................III
目 錄 ...............................IV
圖索引 ...............................VI
表索引 ...............................VIII
第1章 緒論.............................1
1.1本論文的大綱......................6
第2章 原理.............................7
2.1感測原理..........................7
2.2微熱導感測器的設計................12
2.2.1加熱導線材的選擇...............12
2.2.2感測室的設計...................15
2.3微熱導感測器之熱傳分析............16
第3章 實驗方法.........................21
3.1 矽基微加工.......................21
3.1.1積體電路技術...................22
3.1.1.1 晶片與清洗.................24
3.1.1.2 薄膜形成...................27
3.1.1.3 微影及蝕刻.................30
3.1.2體型微加工.....................33
3.1.2.1等向性蝕刻..................33
3.1.2.2非等向性蝕刻................35
3.1.3 接合技術......................42
3.2 微熱導感測器的製作...............45
3.2.1 實驗材料及設備................46
3.2.2 微熱導感測器製造流程..........48
3.2.2.1玻璃熱導絕緣膜的製備........49
3.2.2.2加熱導線及外接電路的形成....58
3.2.2.3氣體通道的蝕刻..............61
3.2.2.4組裝........................62
3.2.2 測試..........................62
3.2.2.1電阻測試....................63
3.2.2.2外加電壓測試................63
3.2.2.3氣體量測....................64
第4章 結果與討論.......................66
4.1玻璃熱導絕緣膜的製備..............66
4.2加熱導線及外接電路的形成..........71
4.3氣體通道的蝕刻....................73
4.4組裝..............................78
4.5微熱導感測器的測試................80
4.5.1電阻測試.......................80
4.5.2外加電壓測試...................82
4.5.3氣體量測.......................83
第5章 結論與未來發展...................85
參考文獻...............................87
作者簡介...............................90
授權書.................................91

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