臺灣博碩士論文加值系統

本論文研究針對Silicone添加於Epoxy中，探討流動特性與物性之影響。
流動特性部份，首先探討硬化劑種類對Epoxy硬化反應，綜合DSC及錐板流變儀分析結果以Methyl Tetrahydro Phthalic Anhydride(簡稱MTPA)硬化劑反應最快，所以選擇MTPA硬化劑作為本實驗加工之最佳硬化劑。
另外使用剛性擺錘振動減衰儀測得Silicone添加於Epoxy量至15phr時，反應起始與終止時間最短，玻璃轉移溫度較低。
對MTPA硬化劑對於環氧樹脂摻合Silicone反應硬化之探討而言，MTPA硬化劑與環氧樹脂添加不同量之Silicone Rubber( 0phr、5phr、10phr、15phr、20phr )之反應硬化經由DSC探討轉化率對時間及溫度之關係，以添加15phr Silicone Rubber之反應較快。
物性部份，以Silicone作為Epoxy IC封裝用之低應力改質劑，除了硬化流動行為之外，Silicone 對於IC封裝成品之物性之信賴度亦為重要評估因素。本研究針對Silicone奈系環氧樹脂組成物之基本力學物性、防火性能、絕緣破壞特性，熱性質及熱衝擊之影響予以考察。由實驗結果發現Silicone添加對力學物性有明顯改善之效果，但有降低Tg點之現象。而在200phr silica之組成下，Silicone之添加量以15phr為最佳配料設計。

Here we explored the curing reaction of epoxy with three acid-anhydride type of curing agents. For the reaction mechanism naphthalene epoxy resin and curing agents, we measure the conversion of resin by constant heating and isothermal reaction, to study the relationship of conversion rate-time-temperature .We also used cone & plate rheometer to study the gel time and viscosity under different temperature . Blased on the DSC conversion time and gel time detected ,Methyl Tetrahydro Phthalic Anhydride(MTPA) is the most efficient curing agent. So,we chose MTPA as the curing agent in our process research.
It is know that the Rigid-Body Pendulum Rheometer not only could detect the initial and end reaction time and temperature,but also the Tg under the decreasing temperature process. Experiment result indicated that when adding Silicone Rubber to 15 phr, the initial and end reaction is faster and happens at a lower temperature. The more the Silicone Rubber is added, the lower the Tg would be.
According to the viscometer, the viscosity of epoxy is proportional to the amount of Silicone added.
As for the MTPA addition on the curing effect of Epoxy resin mixed with Silicone, adding MTPA in Epoxy with 15 phr Silicone Rubber has the quickest reaction comparing with 0,5,10,15,20 phrof Silicone Rubber.
Other then its cure flow behavior, Silicone is reliabilty on its physcial properties as IC package material is also an important factor on evaluating its use as Epoxy IC package low stress modifier. This study did a series of reserch on the affect on mechnical property ,flame retardant property, insulation voltge break down property, thermal mechnical property and Thermal shock property of Silicone. From the results,we found out that the addition of Silicone has improved significantly on mechnical property, but has the effect on lower its Tg point. Out results concluded that the best composition for Silicone under a 200phr silica mixture is 15 phr .

指導教授推薦書
學位考試委員會審定書
致謝
目錄
圖表索引
中文摘要
英文摘要
第一章 緒 論
一.前 言
二.研究背景與相關理論
2.1 內部應力探討
2.2 環氧樹脂耐燃性改質分析
2.3 爆米花現象探討
2.4界面接合強度分析
2.5反應動力學之理論分析
2.6黏度量測理論分析
2.7 流變行為的分析理論
2.8 剛性擺錘振動減衰分析理論
三.研究特徵與目的
四.研究架構
五.參考文獻
第二章 Epoxy / Silicone組成之硬化反應與流變行為分析
中文摘要
英文摘要
一.前 言
二.實 驗
2.1 材料
2.2 測定
2.2.1 DSC
2.2.2錐板流變行為分析
2.2.3剛性擺錘振盪減衰試驗
2.2.4黏度測定
三.結果與討論
3.1硬化劑種類對環氧樹脂硬化與流變行為影響效應之探討
3.2 Silicone /Epoxy系硬化行為之探討
3.3 Silicone/silica /Flame Retartdant/Epoxy組成之黏度與溫度相關性探討
3.4 Silicone/silica /Flame Retartdant/Epoxy組成之硬化行為之探討
四.結 論
五.參考文獻
第三章 Silicone /Epoxy組成物性之研究
中文摘要
英文摘要
一.前 言
二.實 驗
2.1 材料
2.2試樣製備
2.3 測定
2.3.1 IZOD衝擊試驗
2.3.2 抗拉強度試驗
2.3.3 抗彎強度試驗
2.3.4 接著試驗
2.3.5 吸濕性分析
2.3.6 硬度
2.3.7 熱重損失分析（TGA）
2.3.8 臨界需氧指數 (LOI
2.3.9 煙密度試驗(Smoke Density)
2.3.10 DMA分析
2.3.11 TMA分析
2.3.12 絕緣破壞試驗
2.3.13 熱衝擊(Thermal Shock)分析
2.3.14 Soft X-ray
2.3.15 SEM
三.結果與討論
3.1 Silicone對Epoxy力學物性之影響效應
IZOD衝擊試驗
抗拉強度試驗
抗彎強度試驗
接著試驗
吸濕性分析
硬度
3.2 Silicone對Epoxy防火性能之影響
熱重損失分析（TGA）
臨界需氧指數 (LOI)
煙密度試驗(Smoke Density)
3.3 Silicone對Epoxy之分子間相互作用力
DMA分析
TMA分析
3.4絕緣破壞特性
3.5熱衝擊(Thermal Shock)之影響效應
四.結論
參考文獻
第四章 總結論
附錄
作者簡介
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