臺灣博碩士論文加值系統

在這篇論文中，我們將提出一種平面屏蔽結構設計，用以抑制封裝微帶線中高階模(即雜散模)對電路之干擾。這種屏蔽結構是由四塊金屬邊帶所構成，分別成對且左右對稱地置於電路元件的前後，以抑制雜散模的傳播，進而減少對電路元件的干擾。對此電路結構的分析，我們將利用結合二維的線方法和模式匹配法的全波數值分析方法來做封裝微帶線各個區域的分析。利用線方法結合模式匹配法可求得在電路中各個不連續處(即電路的交接面)的散射矩陣，再將各散射矩陣串接成一整個電路系統的散射參數，並由其分析出電路特性。我們將先分析加入金屬邊帶後，微帶線中各個模式的傳播特性之變化。再來研究改變金屬邊帶之設計(包括邊帶寬度、長度及邊帶和元件間的距離)對雜散模抑制效應的影響。論文中將分別討論電路為一微帶線縫(代表一被動元件)及一電流源(代表一主動元件)時的情形。此外，我們亦將分析金屬邊帶對一密閉封裝盒中寄生共振現象的抑制效應。最後，我們可從結果得知，當金屬邊帶設計在適當的尺寸範圍時，可有效地抑制雜散模對元件的干擾，且不影響到主模的傳遞。

In this thesis, a planar shielding structure is proposed and analyzed for suppressing the higher-order modes (the spurious modes) in a packaged microstrip line circuit. This structure is formed by two pairs of side metal patches deposited symmetrically on the substrate. The circuit element (CE) located between these side metal patches would be then prevented from the influence of the parasitic modes.
The Method of Lines (MoL) coupled with the Mode-Matching Method (MMM) will be used to analyze the proposed structure. The scattering matrices of the junctions in the structure will be calculated firstly, then that of the whole structure will be computed by cascading these scattering matrices. The characteristic of the structure can then be analyzed from the scattering parameters. To find the effects of the side metal patches, the influence of the patches on propagating characteristics of the modes of the packaged microstrip will be studied firstly. The design parameters of the patches (including the lengths, widths, and positions of the patches) will be varied to investigate the suppression effect of the patches. Two kinds of circuit, that is, a microstrip line gap (representing a passive device) and a electric current source (representing an active device) will be discussed in the thesis. Also, the suppression effect of the patches on the parasitic resonance in a metal boxed circuit will be analyzed. Finally, the appropriate designs of the patches for suppressing the spurious mode effectively and having negligible influence on the dominant mode will be found.

誌謝………………………………………………………………………I
中文摘要…………………………………………………………………II
ABSTRACT ………………………………………………………………III
目錄………………………………………………………………………IV
圖錄………………………………………………………………………VI
符號說明…………………………………………………………………IX
第一章 緒論……………………………………………………………1
1.1 研究動機…………………………………………………………1
1.2 相關研究…………………………………………………………2
1.3 電路設計與分析…………………………………………………2
第二章 分析方法………………………………………………………5
2.1 線方法……………………………………………………………6
2.2 電路元件之分析…………………………………………………13
2.2.1 微帶線縫…………………………………………………13
2.2.2 電流源……………………………………………………16
2.3 模式匹配法………………………………………………………18
2.4 兩散射矩陣之串接………………………………………………21
第三章 結果分析與討論………………………………………………27
3.1 金屬邊帶屏蔽效應(shielding effects)分析………………27
3.2 金屬邊帶對雜散模抑制的效應(suppression effects)分
析………………………………………………………………30
3.2.1 微帶線縫…………………………………………………30
3.2.2 電流源……………………………………………………33
3.3 密閉封裝盒共振的金屬邊帶抑制效應………………………34
第四章 結論與未來研究方向.………………………………………55
中英對照說明…………………………………………………………57
參考文獻………………………………………………………………59
個人資料………………………………………………………………62

[1] R. K. Hoffmann, Handbook of Microwave Integrated circuits, M.A.: Artech House, 1987, pp. 399-400.
[2] Cebi Haki and K.C. Gupta, “Effect of package shape on spurious coupling among microstrip discontinuities,” in IEEE MTT-S Int. Microwave Symp. Dig., 1996, pp. 1823-1826.
[3] D. F. Williams and D.W. Paananen, “Suppression of resonant modes in mocrowave packages,” in IEEE MTT-S Int. Microwave Symp. Dig., 1989, pp. 1263-1265.
[4] J. J. Burke and R. W. Jackson, “Reduction of parasitic coupling in packaged MMIC’s,” in IEEE MTT-S Int. Microwave Symp. Dig., 1990, pp.255-258.
[5] D. F. Williams, “Damping of the resonant modes of a rectangular metal package,”IEEE Trans. Microwave Theory Tech., vol.37, pp. 253- 256, Jan. 1989.
[6] R. W. Jackson, “Removing package effects from microstrip moment method calculations,” in IEEE MTT-S Int. Microwave Symp. Dig., 1992, pp.1225-1228.
[7] S. J. Chung and L. K. Wu, “Analysis of the effects of a resistively coated upper dielectric layer on the propagation characteristics of hybrid modes in a waveguide shielded microstrip using method of lines,”IEEE Trans. Microwave Theory Tech., vol. 41, pp. 1393- 1399 , Aug. 1993.
[8] H.-H. Chen and S.-J. Chung, “Analysis of a partially sealed package for microstrip-line circuits,” IEEE Trans. Microwave Theory Tech., vol.46, pp.2124-2130, Dec. 1998.
[9] P. Mexxamotte, M. Mongiardo, L.Roselli, R.Sorrentivo, and W.Heinrich, “Analysis of packaged microwave integrated circuits by FDTD,” IEEE Trans. Microwave Theory Tech., vol.42, pp.1796-1801, Sept. 1994.
[10] H.-H. Chen and S.-J. Chung, “Shielding effect of a diaphragm in a packaged microstrip circuit,” IEEE Trans. Microwave Theory Tech., vol. 43, pp.1082-1086, May. 1995.
[11] S.-J. Chung and H.-H. Chen, “Resonant frequencies of a microwave package with vertical diaphragms attached to the top cover,” Microwave and Optical Tech. Lett., vol. 8, pp.300-302, Apr. 1995.
[12] R. Clark, A. Agrawal, and S. Miller, “Simulation of multi-chip module package resonance using commercial finite element electromagnetic software,” in IEEE MTT-S Int. Microwave Symp. Dig., 1995, pp. 1211-1214.
[13] J.-G. Yook, L. Katehi, R.N. Simons, and K. A. Shalkhauser, “Experimental and theoretical study of parasitic leakage/resonance in a K/KA-band MMIC package” IEEE Trans. Microwave Theory Tech., vol. 44, pp.2403-2410, Dec. 1996.
[14] A. C. Polycarpou, M. R. Lyons, and C. A. Balanis, “Finite element analysis of MMIC waveguide structures with anisotropic substrates,” IEEE Trans. Microwave Theory Tech., vol. 44, pp.1650-1663, Oct. 1996.
[15] S. J. Chung and Y. H. Chou, “Attenuation of the parasitic modes in a shielded mcrostrip line by coating resistive films on the substrate, ”IEEE Trans. Microwave Theory Tech., vol. 43, pp. 1610-1613, Aug. 1995.
[16] H.-H. Chen, C.-L. Wang and S.-J. Chung, “A Simple Method for Shielding Parasitic Modes in a Waveguide-Packaged Microstrip Line Circuit,” IEEE Trans. Microwave Theory Tech., vol. 46, pp.2156-2159, Dec. 1998.
[17] R. Pregla and W. Pascher, “The method of lines,” in Numerical Te- chniques for Microwave and Millimeter-wave Passive Structures. Itoh T., Ed. Wiley, New York, 1989, Ch.6.
[18] Y. C. Shih,”The mode-matching method,” in Numerical Techniques for Microwave and Millimeter-Wave Passive Structures. Itoh T., Ed. Wiley, New York, 1989, Ch9
[19] D. K. Cheng, Fundamentals of Engineering Electromagnetics, Addis- on- Wesley, New York, Apr. 1994.
[20] D. M. Pozar, Microwave Engineering, Second, John Wiley & Sons, New York, 1998.
[21] P. Meyer, “Solving microstrip discontinuities with a combined mode-matching and method-of-lines procedure,”, Microwave and Optical Tech. Lett., vol. 8., pp. 4-8, Jan. 1995.
[22] R. F. Harrington, Time-Harmonic Electromagnetic Fields, McGraw-Hill, 1993.