臺灣博碩士論文加值系統

隨著PCB(printed circuit board，印刷電路板)電路訊號的上升時間愈來愈短，高速度傳輸與高密度包裝已成為未來發展的驅勢，因此面對技術層次的提升，對於高頻環境下的電氣特性及雜訊的控制，應該有周詳的考慮。串音(Crosstalk)雜訊正是數位系統中最常見的雜訊源之一。印刷電路板上之串音雜訊更是不容忽視。
本論文將PCB上之電路轉換成一耦合之多導體傳輸線模型，而一般傳輸線上之單位長度參數可經由解析解計算或數值模擬求得。解析解可計算簡單線路且均勻介質下之參數；然而若印刷電路板上之幾何線路較複雜且在不均勻的介質下，則需藉由數值方法來決定單位長度參數，但數值模擬計算非常耗時。因此在本論文中，將提出由量測方法來決定這些參數，並建立一個分佈電路SPICE模型，再將量測所得之參數值代入此SPICE模型，並將SPICE模擬串音之結果與實作樣品之量測結果及解析解計算在時域及頻域上互相比較，以印證本論文之SPICE模型之準確性。
最後，本論文將探討PCB上線路之幾何圖形對串音雜訊之影響並討論改善串音雜訊的方法與結果。

The rise time of signals in PCB (printed circuit board) circuits become shorter and shorter. High speed transmission and high density packaging have become the trend of PCB development. Therefore, when designing a PCB circuit, the electrical characteristics under high frequency circumstance and noise-control can not be ignored. One of the most common noise sources in digital systems is the crosstalk noise, and the crosstalk noise is very significant within high frequency PCB circuits.
Thus, in this thesis, a PCB circuit is simulated by a corresponding coupling multiconductor transmission line model. The unit length parameters of the transmission line can be determined by analytical calculations or numerical simulations. However, analytical solutions are satisfied only under simple circuit and homogeneous medium conditions. If the geometry of PCB circuit are complex and the medium is nonhomogeneous, then these parameters are found through numerical methods. However, numerical simulations usually talk a lot of time. Thus, in this thesis, these unit length parameters are determined by measurement methods. A distributed SPICE model is proposed, and the measured parameters are used to simulate the crosstalk, The SPICE model are verified by comparison with experimental and analytical results in frequency and time domains.
At last, the effects influence crosstalk noise on PCB circuits and the shielding methods are investigated.

中文摘要
英文摘要
目錄
圖目錄
第一章 緒論
1-1 研究動機與目地
1-2 文獻回顧
第二章 串音及屏蔽之解析解
2-1 前言
2-2 傳輸線方程式
2-3 串音之解析解
2-4 解析解求屏蔽效應
第三章 串音之量測與模擬
3-1 前言
3-2 樣品製作及編號
3-3 儀器與量測
3-4 SPICE 模擬
第四章 結果與討論
第五章 結論
參考文獻

[1] P.L Khan and G.I.Costache, “Considerations on modeling crosstalk on printed circuit boards,”IEEE 1987 int.EMC Symp pp.279-281,1987.
[2] R.F.Harrington and C.Wei, “Losses on multiconductor transmission lines in multilayered dielectric media,”IEEE Trans on MTT ,vol. MTT -32,no.7.pp.705-710,July 1984.
[3] C.Wei,R.F.Harrington,J.R.Mautz,and T.K.Sarkar, “Multiconductor transmission lines in multilayered dielectric media,”IEEE Trans on MTT,vol.MTT- 32,no.4,pp.439-450,Apr.1984.
[4] D.J. Riley and L. D. Bacon, “On the limination of the weak-coupling for crosstalk analysis based on quasi-TEM propagation,” IEEE Trans. On EMC, vol. 32, no.1, pp. 28-37, Feb. 1990.
[5] H. Cory and S. Shiran, “The importance of losses in the coupling of transmission lines,” IEEE Trans. On EMC, vol. 30, no. 4, pp. 567-570, Nov. 1988.
[6] C. R. Paul, “Estimation of crosstalk in three-conductor transmission lines,” IEEE Trans. On EMC, vol. EMC-26, no. 4, pp.182-192, Nov. 1984.
[7] R. G. Olsen, “A simple model for weakly coupled loosy transmission lines of finite length,” IEEE Trans. On EMC, vol. EMC-26, vol. EMC-26, no.2, pp. 79-83, May 1984.
[8] Clayton R. Paul, “On the Superposition of Inductive and Capacitive Coupling in Crosstalk-Prediction Models”, IEEE Transactions on Electromagnetic Compatibility, Vol. EMC-24, No. 3,pp.335-343 August, 1982.
[9] C. R. Paul, “Computation of crosstalk in a multiconductor transmission line,” IEEE Trans. On EMC, vol. EMC-23, no.4, pp. 352-358, Nov. 1981.
[10] Istvan Novak, IEEE, Bertalan Eged, and Lasz16 Hatvani, “Measurement and Simulation of Crosstalk Reduction by Discrete Discontinuities Along Coupled PCB Traces”, IEEE Transactions on Instrumentation and Measurement, vol. 43, No. 2,pp.170-175,April, 1994.
[11] W. Cui, H. Shi, X. Luo, F. Sha, J.L. Drewniak, T.P. Van Doren and T. Anderson, “Lumped-element Sections for Modeling Coupling Between High-Speed Digital and I/O Lines”,IEEE International Symposium on 1997,pp.260-265
[12] Clayton R. Paul, “Modeling Electromagnetic Interference Properties of Printed Circuit Boards.”, IBM J. Res. Develop. Vol. 33 No.1,pp.33-50,January, 1989.
[13] David A. Hill, Fellow, IEEE, Kenneth H. Cavcey, and Rebert T. Johnk, Member, IEEE, “Crosstalk Between Microstrip Transmission Lines”, IEEE Transactions on Electromagnetic Compatibility, Vol. 36, No. 4, pp.314-321,November, 1994.
[14] Clayton R. Paul, “Transmission-Line Modeling of Shielded Wire for Crosstalk Prediction.”, IEEE Transactions on Electromagnetic Compatibility, Vol. EMC-23, No.4,pp.345-351,November, 1981.
[15] Clayton R. Paul, “Introduction to Electromagnetic Compatibility.”, Wiley Series in Microwave and Optical Engineering Kai Chang, Series Editor, 1992.
[16] T.C.Edwards, “Foundations for Microstrip Engineering” ,John
Wiley,New York (1981)
[17] Dracy N.Ladd and George I.Costach, “SPICE Simulation Used to
Characterize the Crosstalk Reduction Effect of Additional Tracks Grounded With Vias on Printed Circuit Boards”,IEEE Transactions on Circuits and System, Vol.39,No.6,pp.342-347,June,1992
[18] Clayton R. Paul. “Analysis of Multiconductor Transmission Lines” Wiley Series in Microwave and Optical Engineering Kai Chang, Series Editor, 1994
[19] E.H. Fooks and R.A Zakarevicius, “Microwave Engineering using Microstrip Circuit ”.Prentice Hall ,1990
[20] Kenneth D. Marx and Rex I. Eastin “A Configuration-Oriented SPICE Model for Multiconductor Transmission Lines with Homogeneous Dielectrics”,IEEE Transactions on Microwave Theory and Techniques, Vol.38,No.8,pp1123-1129,Auguest,1990
[21] Christopoulos “The Transmission-line Modeling Method:TLM”,New York IEEE.1995
[22] F.A.Benson and T.M.Benson “Fields Waves and Transmission Lines” London Chapman &Hall 1991
[23] J.A.Brandao Faria “Multiconductor Transmission Line Structures Modal Analysis Techniques”,New York Wiley 1993