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研究生:曾乙修
研究生(外文):Yi-Hsiu Tseng
論文名稱:電子構裝銦錫無鉛銲錫與鎳及銅基材之界面反應研究
指導教授:莊東漢莊東漢引用關係
指導教授(外文):Tung-Han Chuang
學位類別:博士
校院名稱:國立臺灣大學
系所名稱:材料科學與工程學研究所
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:2000
畢業學年度:88
語文別:中文
論文頁數:168
中文關鍵詞:界面反應共晶銦錫介金屬軟銲
外文關鍵詞:interfacial reactioneutectic indium-tinindiumtinnickelcopperintermetallic compoundsoldering
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在電子構裝製程中軟銲為最普遍的接合技術,對於大多數的構裝,不論是引腳插入型(PTH)、表面黏著型(SMT)、銲球網排技術(BGA)或覆晶組裝(FCA)等,都需要藉由軟銲技術達成其接合之目的,也唯有良好的接合才能維持一個系統的正常運作。因為傳統鉛錫合金具有優異的潤濕性、機械強度、抗疲勞性、抗腐蝕性及價格便宜等優點,被廣泛的應用在軟銲製程上;然而又由於環保問題的考量,使得無鉛銲錫在電子構裝產業中日益重要。本研究主要即探討無鉛銦錫銲料(共晶銦錫、純錫、純銦)與金屬基材(鎳、銅)的界面反應,實驗進行的方式鎖定在無鉛銲料熔點(Tm)以上至軟銲溫度(400℃)左右的溫度範圍,進行銲料與基材的固相-液相界面反應型態、動力學、潤濕性及介金屬生長機構探討。
Soldering process is the most popular joining technology in the electronic packaging process. Many important packaging process need this technology to achieve joining purpose, like as pin-through hole (PTH), surface mount technology (SMT), ball grid array (BGA) and flip chip bonding (FC). Only a good connection can provide the system working normally. For soldering process, Pb-Sn alloy has been widely used because of its good wettability, mechanical strength, fatigue resistance, corrosion resistance and low price etc. However, considering the environmental problem, lead-free solder has get more and more important in the electronic packaging industry. Anyway, these soldering processes involve the interfacial reaction between solders and metal substrates. In this study, we are interested in the interfacial reaction between the lead-free solder (eutectic In-Sn, pure Sn and pure In) and metal substrate (Ni and Cu). The major proceeding temperatures are ranged from the melting temperature of solder to the general soldering temperature (400C). This solid-liquid interfacial morphologies, growth kinetics, wettability and intermetallic compound growth mechanism are discussed.
封面
誌謝
中文摘要
英文摘要
目錄
圖目錄
表目錄
壹 前言
1.1 電子構裝產業簡介
1.2 無鉛銲錫
1.3 界面反應動力學
1.4 潤濕性
1.5 研究目的
貳 文獻回顧
2.1 鎳基材與銲錫之界面研究相關文獻
2.2 銅基材與銲錫之界面研究相關文獻
2.3 其他界面反應研究相關文獻
參 實驗方法
3.1 實驗材料與設備
3.2 鎳/銦錫界面反應系統
3.3 銅/銦錫界面反應系統
肆 結果與討論
4.1 鎳/共晶銦錫界面反應
4.2 鎳/純錫界面反應
4.3 鎳/純銦界面反應
4.4 鎳/銦錫界面反應系統比較
4.5 銅/共晶銦錫界面反應
4.6 銅/純錫界面反應
4.7 銅/純銦界面反應
4.8 銅/銦錫界面反應系統比較
伍 結論
陸 參考文獻
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