臺灣博碩士論文加值系統

1981年Tuckerman 與Pease 首先提出微流道具有非常優異的散熱能力，可進一步應用於電子元件之散熱。由於流道縮小至微米等級時，有諸如過渡雷諾數區間、熱傳學中Re-Nu-Pr的關係式不明確等問題，所以直接將感測器置於微流道中進行量測有其必要性。
本文利用半導體薄膜鍍著製程先於玻璃基材上製作白金薄膜感測器，配合靜電鍵合技術，將玻璃基材與體型加工法所製作之矽質微流道結合，藉由現地量測設備之功能，直接觀察微流道中工作流體之溫度分佈特性，可作為微流道研究課題之基礎研究。

The compact heat sink is an array of micro-channels, whose heat dissipation is excellently pronounced by Tuckerman and Pease in 1981.However, there are several issues still under dispute, such as what is the range of transition value of Reynolds number? What is the relation between Reynolds number, Nusselt number and Prandtl number? It is then necessary to figure out the micro-scale heat flow along a micro-channel by means of the state of art in MEMS.
This thesis used thin film evaporation process and silicon bulk micromachining to fabricate an array of on-site temperature sensors along a silicon , V-groove microchannel.The platinum thin film sensors as temperature sensors were evaporated on Pyrex 7740 glass before. By anodic bonding technology, the silicon wafer with a V-groove microchannel bonds with the Pyrex glass constitute the Plate platform for the In-site measurement of temperature distribution along the microchannel directly.

目錄
中文摘要………………………………………………………… Ⅰ
英文摘要………………………………………………………… Ⅱ
目錄……………………………………………………………… Ⅲ
圖目錄…………………………………………………………… Ⅵ
表目錄…………………………………………………………… Ⅷ
第一章 緒論…………………………………………………… 1
1.1文獻回顧………………………………………………… 1
1.2研究動機………………………………………………… 3
第二章 白金薄膜感測器……………………………………… 4
2.1感測原理與白金特性…………………………………… 4
2.2製造程序………………………………………………… 6
2.2.1濕蝕刻法…………………………………………… 8
2.2.2金屬剝離法………………………………………… 11
第三章 微流道熱散………………………………………… 14
3.1微流道特性……………………………………………… 14
3.2設計理論………………………………………………… 15
3.3估算結果………………………………………………… 17
3.4微流道進出口角落凸角補償…………………………… 21
3.4.1凸角補償原理…………………………………… 22
3.4.2凸角補償結構設計原則與流程………………… 24
3.4.3濕蝕刻參數……………………………………… 25
3.4.4 凸角補償結構幾何設計與尺寸估算…………… 25
3.4.5 凸角補償結果…………………………………… 34
3.5晶片背面加熱源………………………………………… 37
3.5.1 擴散濃度估算…………………………………… 39
3.5.2離子佈植………………………………………… 42
3.6製造程序………………………………………………… 44
第四章 現地量測……………………………………………… 48
4.1量測系統與封裝………………………………………… 48
4.2白金薄膜感測器阻值-溫度校正………………………… 50
4.3量測結果與討論………………………………………… 54
第五章 結論與建議…………………………………………… 58
參考文獻……………………………………………… ……… 60
附錄一 圓管理論推導………………………………………… 64
附錄二 白金薄膜感測器溫度-阻值資料表…………………… 67
附錄三 白金薄膜感測器溫度-阻值關係式…………………… 68
附錄四 協助本研究之相關單位及民間企業資料…………… 74

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