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研究生:高季安
研究生(外文):Chi-An Kao
論文名稱:EPC在IC製程上的應用
論文名稱(外文):EPC Application in IC Manufacturing Process
指導教授:江瑞清江瑞清引用關係
指導教授(外文):Jui-Chin Jiang
學位類別:碩士
校院名稱:中原大學
系所名稱:工業工程研究所
學門:工程學門
學類:工業工程學類
論文種類:學術論文
論文出版年:2001
畢業學年度:89
語文別:英文
論文頁數:105
中文關鍵詞:工程製程管制統計製程管制
外文關鍵詞:SPCEPC
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近年來,台灣半導體產業的發展極為快速與蓬勃、並且在全球市場上佔有重要的地位;在技術領域方面0.13um成為量產技術、而12吋晶圓廠也已逐漸取代8吋晶圓成為下一世代的主流
在技術的快速發展下、單片晶圓的價格逐漸提高,因此廠商無不重視其製程的管制能力,展望未來,掌握產品品質即掌握競爭優勢,提供的高品質產品才是讓顧客滿意的關鍵,因此建構一優良的製程管制系統,來快速回應且有效降低產品的變異,便顯得格外迫切需要。

本研究利用統計製程管制(SPC)、工程製程管制(EPC)、回饋控制與品質工程的觀念與方法、進一步結合半導體工程的專業知識、並以CIM做自動調整,建構一套整合適應控制與回饋控制之製程管制系統,並將其系統量產化來應證,同時深入探討出最適當的製程調整策略,以降低變異對製程系統所造成的影響,達到穩定製程管制系統之目標。


Recently, the semiconductor industry in Taiwan grows up very rapidly, and plays the key role in the global market. The 0.13μm manufacturing technology has approved in the production line. And the twelve-inch Fab.(Fabrication) also gradually replaces the eight-inch fab to be the next generation production trend.

In the fast development of the technology, the value of each wafer is higher and higher. Therefore all semiconductor manufacturers put lots of the effort on the improvement of the process control capability. In the future, high product quality means the advantage in the high-competitive market, and the customer satisfaction also comes from the high-quality product. From the above trend, the construction of the rapid-response-to-variation process control system is the future trend.

This study combines the SPC(Statistical Process Control), and EPC(Engineering Process Control), and the CIM auto-control skill to develop the production model. Also by the implementation of this research conclusion into the production, it is approved to get the more stable and lower variation product quality.


Chinese Abstract
English Abstract
Acknowledgement
Contents
Table Contents
Figure Contents

Chapter 1: Introduction
1.Background and Motive
2.Purpose
3.Scope and Hypothesis
3.1Scope
3.2Hypothesis
4.Method and Structure
5.Content Organization

Chapter 2: Process Control System Introduction
1.Process Control System Structure
2.Process Control System Function
3.Process Control System Evaluation

Chapter 3: IC Manufacturing Introduction
1.Keyword
2.IC Process Introduction
2.1Photolithography
2.2Oxidation
2.3Layer deposition
2.4Etching
2.5Diffusion
2.6Implantation

Chapter 4: Literature Review
1.Control Method Literature Review
1.1Feed-forward Control
1.2Feedback Control
2.Control Chart Method Literature Review
2.1EWMA Control Chart
2.2CUSUM Control Chart
3.Quality Engineering
3.1Controllable Factor
3.1.1Signal Factor
3.1.2Control Factor
3.2Uncontrollable Factor
3.2.1External Noise
3.2.2Internal Noise
3.2.3Unit-to-Unit

Chapter 5: Model Construction
1.Construction of the Integration of the Feed-Forward and Feedback System
2.Process Sub-system
3.Measurement Sub-system
4.Analysis and Evaluation Sub-system
5.EPC Sub-system
6.Adjustment Sub-system

Chapter 6: Model Verification and Validation
1.Verification Method and Purpose
2.Model Implementation and Verification
2.1Process Sub-system
2.2Measurement Sub-system
2.3Analysis and Evaluation Sub-system
2.4EPC Sub-system
2.5Adjustment Sub-system
3. Model Performance Validation
3.3Accuracy
3.4Efficiency
3.5Adaptability
3.6Speed
3.7Cost / Profit Effectiveness

Chapter 7: Conclusion and the Future
1.Study Conclusion
2.Further Research

Reference


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