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研究生:簡維元
研究生(外文):Wei-Yuan Chien
論文名稱:落地實驗量測系統開發之探討
論文名稱(外文):Study on the System Development for Drop Test
指導教授:陳夏宗陳夏宗引用關係
指導教授(外文):Shin-Chung Chen
學位類別:碩士
校院名稱:中原大學
系所名稱:機械工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2001
畢業學年度:89
語文別:中文
論文頁數:76
中文關鍵詞:落地試驗
外文關鍵詞:Drop Test
相關次數:
  • 被引用被引用:13
  • 點閱點閱:245
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  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
摘 要
3C產品設計朝向輕、薄、短、小是未來產業不可避免的趨勢,落地衝擊實驗是評估該產品功能的重要指標之一。以目前業界所使用的衝擊試驗準則,僅對一般產品作概括性實驗規範,對於3C產品而言,並無一詳盡規範要求。另一方面,電腦落地試驗模擬來縮短產品開發時間是未來之趨勢,實際量測與模擬比對相互驗證已是重要課題;本研究建立一套完善之落地試驗量測系統,對於落地角度、系統誤差分析及加速規訊號擷取均作深入探討,並且藉由模擬分析來驗證系統之正確性。
本研究架構一套落地試驗平台,平台是以兩個CCD擷取落地瞬間之影像,並經由電腦影像處理落地之兩個畫面可推導出物體實際落地的空間角度(第三投影角);由系統畫面擷取的延遲時間所導致之角度誤差合乎ASTM D5276的規範之內。本平台另提供多Channels來擷取落地數據。
為評估系統量測值之正確性,藉由一簡單幾何外型之鐵塊作實際落地測試,其量測之加速度值與ANSYS/ LS-DYNA模擬軟體在相同條件下所分析之數據作比對,以驗證此落地試驗平台之可靠度。
經研究發現衝擊加速規之固定方式會直接影響到量測之準確度;在落下過程中,衝擊加速規之訊號連接線會影響落下之角度,因此,產品的重複性不高;模擬軟體方面,簡單之幾何外型鐵塊量測及模擬可相互驗證,但在較複雜之產品(如手機),其量測與模擬仍有差距有待探討。
Abstract
The 3C product will be developed to be light, thin, short, and small in the future. The drop impact test is one important target to evaluate the function of the products. At the present day, the impact test standard used by the industrial circles could only test the general products. There is no detailed standard for the 3C products. On the other side, using the computer drop test simulation to abbreviate the time of developing the products is the trend in the future. To test and verify the practicing measure and the simulating compare has become an important topic.
This research establishes a consummate set of drop test measurement system in order to approach the drop angles, the errors of the system, and the caught signals of the acceleration. Besides, it will test and verify the accuracy of the system by the simulating analysis.
This research establishes a set of drop test platform. The platform could capture the twinkling drop images by two CCD. Moreover, the computer could deal with the two images captured by the CCD to deduce the actual space angles(the third projecting angles ) of the dropping object. The delayed time caught by the system image causes the errors of the angles in accord with the standard of ASTM D5276. The platform also provides several Channels to capture the drop data.
To estimate the accuracy of the system value, a simple geometry shape iron is used in the drop test. To test and verify the reliability of the dropping test platform, we compare the analyzed data of the measured acceleration value and ANSYS/LS-DYNA simulating software at the same condition.
We find the stationary mode of the impact acceleration would directly influence the accuracy of the measurement through the research. In the process of the drop test, the connected wire of the signal of the impact acceleration would influence the dropping angles. Therefore, the duplicate of the products is low. On the aspect of the software, the measurement and the simulation of the simple geometry shape iron could be tested and verified each other. However, the measurement and the simulation of complex products still appear the difference. There is more space for further study.
measure actually the 3C communication product. There are two sets of CCD used in the system structure of drop test to capture the image in the drop instant of X-axis and Y-axis. We also could calculate the angles of the 3-drop axes by the captured image and measure the acceleration and the weight by shock accelerometer and LoadCell.
With the exception of actually measuring the data, we analyze, compare, and simulate the measured data according to the drop analysis software. We could have more data, which is not easy, or unable captured from the analysis simulating soft.
To maintain the system at a proper accuracy, this research also inquire into the speed of the captured image, and the error of the actually measured data.
目 錄
中文摘要I
英文摘要II
致謝IV
目錄V
表目錄VII
圖目錄VIII
第一章 緒論1
1-1 前言1
1-2 研究動機及目的2
1-3 文獻回顧2
1-4 本文架構3
第二章 落地試驗系統之硬體架構6
2-1 系統架構6
2-2 衝擊加速規7
2-3 Load Cell9
2-4 觸發電路10
2-5 影像擷取CCD11
2-6 影像擷取卡13
2-7 資料擷取卡15
第三章 落地試驗之軟體及監控系統26
3-1 監控程式26
3-2 影像擷取程式27
3-3 模擬軟體28
第四章 系統之精確度及校正34
4-1 衝擊加速規之精確度及校正34
4-2 Load Cell之精確度35
4-3 CCD之擷取速度36
第五章 實驗數據及模擬結果與討論41
5-1幾何型鐵塊落至剛體實驗41
5-2 CD938外殼加載重物落至剛體實驗44
5-3 CD938外殼加載重物落至Load Cell平台實驗45
第六章 結論與未來發展方向71
6-1 結論71
6-2 未來發展方向71
參考文獻73
附錄75
參考文獻1.Jason Wu, Guoshu Song, Chao-pin Yeh, Karl Wyatt, “ Drop/Impact Simulation and Test Validation of Telecommunication Products”, InterSociety Conference on Thermal Phenomena (1998)。2.ASTM Standards, D 5276, “Standard Test Method for Drop Test of Loaded Containers by Free Fall” (1998)。3.PCB Piezotronics, Inc., “Shock and Vibration Data Sheet ” (1999)。4.Dytran Instruments Inc., “General Catalog & Instrumentation Handbook”(1998-1999)。5.Microchip Technology Inc., “PIC 12C5XX Data Sheet”(1996)。6.Sentech Inc., “STC-1000 Specifications, B&W Progressive Scan CCD Camera”(1999)。7.Matrox Electronic Systems Ltd., “Matrox Meteor-II Installation and Hardware Reference”(2000)。8.Matrox Electronic Systems Ltd., “Matrox Intellicom user Guide”(1999)。9.Mintron Enterprise CO., LTD., “FA-Camera MS-2821E/C Instruction Manual”(1999)。10.蕭子健,儲昭偉,王智昱,“Labview 基礎篇”,高立圖書公司(1998)。11.蕭子健,儲昭偉,王智昱,“Labview 進階篇”,高立圖書公司(1998)。12.謝勝治,“圖控式程式語言---Labview”,全華科技圖書公司(2000)。13.LSTC-LSDYNA進階訓練課程,訓練教材,90年度第一期,行政院國科會國家高速電腦中心。14.Wu, J. et al., “Drop/Impact Simulation of Electronic Product”, 4th International LS-DYNA3D Conference, Minneapolis, MN, September 6(1996)。15.I-DEAS™ SDRC DM,虎門科技股份有限公司,台灣。16.National Instruments,“The Measurement and Automation Catalog”(2001)。17.林宸生,“數位信號---影像與語音處理”,全華科技圖書公司(1997)。18.C-T Chang, S-C Chen, J-P Chen, H-S Peng and L-T Huang, “Drop-Impact Simulations of a 3C Thin-Wall Part”, 24th National Conference on Applied and Theoretical Mechanics, Taiwan, R.O.C., pp. Q108-115。19.S-C Chen, J-P Chen, H-S, Peng, L-T Huang and H-L Wang “Simulations on Structure Performance of 3C Thin-Wall Injection Molded Parts”, FADMA 2001。20.鄭錦聰,莊鎮嘉,“Matlab 進階”, 全華科技圖書公司(1997)。21.Philips Semiconductors, “Linear Products NE555”(1994)。22.吳明哲,黃世陽,“Visual Basic 學習範本”,松崗電腦圖書公司(1999)。
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