臺灣博碩士論文加值系統

電腦視覺已經廣泛的應用在電子元件的線上即時檢測中。本論文即針對各種元件的缺陷有效結合數種演算法，以發展準確快速的印刷電路板插件檢測系統為目標。印刷電路板插件檢測系統主要可以分為影像分割及影像處理兩大部份。在影像分割中，應用Sobel運算子針對影像亮度分量處理印刷電路板快速定位問題，另分別應用倒傳遞類神經法則及結合與分類中心相比較的FCM（Fuzzy c-Means）聚類演算法，有效分割彩色影像中物件與非物件圖素。之後針對所得的二值影像，應用跑長平滑概念與跑長標記的影像處理技術予以雜訊消除與元件定位，並以左右像素落點差擷取元件特徵資訊判斷元件倒置缺陷。最後透過模擬的結果取得各演算法最佳參數調校，並將上述所有理論技術整合建構成一實際的印刷電路板插件檢測系統。

Computer vision has been widely used in on-line inspection of electronic components. In this paper, we present a printed circuit board (PCB) inspection system based on computer vision using several methods, which provides us with an efficient solution for inspecting all kinds of mistakes of component. The PCB inspection system can be divided into two phases: (1) image segmentation and (2) image processing. In image segmentation, we locate the position of PCB by using sobel operator in intensity of image. Then we process our color image with bi-level quantization by using back-propagation neural network and fuzzy c-means clustering method in combination with the algorithm of compared with cluster centers. In part of image processing, we use run-length smoothing in noise cancellation and use run-length labeling to fix the position of component; furthermore we extract character of those components by left and right fallen-point feature extraction. Finally, we simulate the best parameters for all methods, and build the accurate, repeating, and flexible system to inspect components in PCB.

中文摘要..................................................I
英文摘要.................................................II
誌 謝................................................III
目 錄.................................................IV
圖表索引................................................VII
第一章緒論.............................................1
1.1 研究動機...................................1
1.2 發展方向與目的.............................3
1.3 主要貢獻...................................5
1.4 論文架構...................................6
第二章系統架構.........................................8
2.1 硬體設備...................................9
2.2 印刷電路板檢測流程........................11
第三章色彩模型........................................13
3.1 RGB色彩模型...............................14
3.2 CMY＆CMYK色彩模型.........................15
3.3 YIQ色彩模型...............................16
3.4 HSI色彩模型...............................17
3.4.1 由RGB轉換至HSI色彩模型...............19
3.4.2 由HSI轉換至RGB色彩模型...............23
3.5 HSV&HSB色彩模型...........................26
3.6 HLS色彩模型...............................29
第四章影像分割........................................33
4.1 梯度運算子................................34
4.2 倒傳遞類神經網路..........................38
4.2.1學習演算法.............................39
4.2.2回想演算法.............................44
4.2.3演算法的推導...........................44
4.3 結合與分類中心相比較的FCM聚類演算法.......48
4.3.1 FCM聚類演算法........................49
4.3.2 與分類中心相比較法...................51
第五章 影像處理........................................52
5.1 雜訊消除..................................52
5.2 影像標記..................................54
5.2.1 四連通標記法.........................55
5.2.2 跑長標記法...........................57
5.3 左右像素落點差特徵抽取法..................59
第六章系統模擬與實現..................................63
6.1影像分割.....................................64
6.1.1 Sobel運算子臨界值選取................64
6.1.2 倒傳遞類神經演算法特徵分析...........65
6.1.3 FCM聚類演算法特徵分析................76
6.2 影像處理..................................85
6.2.1 雜訊消除與元件定位...................85
6.2.2 特徵向量萃取.........................86
6.3 系統實現..................................88
6.3.1 離線訓練.............................88
6.3.2 線上檢測.............................95
第七章結論與未來展望.................................100
7.1 結論.....................................100
7.2 未來展望.................................101
參考文獻................................................103
作者簡介................................................106
授權書..................................................107

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