臺灣博碩士論文加值系統

混合量測系統(Hybrid measurement system)是整合接觸式探頭系統(Touch trigger probe system)與非接觸探頭系統(Non-contact laser probe system)於工具機上。二種探頭在量測應用上各有其優點，如接觸式探頭可精確量測具有規則幾何形狀之工件，而非接觸式探頭可快速量測自由曲面或軟質工件，如能結合應用將使量測更具彈性與可靠性。而切削中心機在加工過程可利用混合量測系統做加工間量測(In-process measurement ), 以利隨時掌控加工間的狀態。本研究在切削中心機進行實驗，將二種探頭整合於切削中心機完成對切削測試之標準件之量測，並以非接觸雷射探頭對自由曲面工件作三維量測(Measurement)與三維輪廓之資料取樣(Digitizing)。探討不同量測條件下利用二種探頭的優點，針對待測件之幾何形狀規劃出最佳量測方式。
本研究首先完成雷射探頭調整裝置之設計與製造，接著針對二種探頭作量測不確定分析，此結果可成為往後量測誤差補償與量測規劃的參考依據。本系統以個人電腦為基礎，整合二種探頭於切削中心機，將二種探頭系統與切削中心機的NC控制器及個人電腦作資訊整合，而量測所需的NC程式，則可經RS232串列介面由PC傳送至NC控制器，以驅動工具機。
另外，本研究也設計一混合量測之載具，載具為ISO切削測試件(ISO10791-7)及4凸一凹試件。依待測件之幾何形狀特性作量測路徑規劃，利用混合量測軟體量取載具之尺寸資料。再利用量測精度較高的三次元座標量測儀(C.M.M.)量測相同載具，並以C.M.M.量測結果為基準，與工具機上混合量測的結果做比對分析，驗証二種探頭在工具機上混合量測所得結果的精確性與可靠性。
由實驗結果可知，透過發展的混合量測系統，成功地針對自由曲面或規則幾何形狀做加工間量測(In-process measurement)，可應用於模型製造之加工間檢測。另外，利用CNC工具機光學尺所產生之訊號，觸發OTM3A20雷射探頭，可快速、準確地攫取小元件3D之點資料。

This study introduces the development of a hybrid measurement system consisting of touch trigger probe system and non-contact laser probe system integrated on a machining center to carry out the in-process measurement of a workpiece combined with free-form surface and regular geometric features. The touch trigger probe, which has the advantages of high accuracy and reliability, was used to measure the regular geometric feature, whereas the non-contact laser probe, which has the advantages of quick measurement, no probe radius compensation needed and no contact force induced, was used to measure the free form surface in this study.
An adjustment device consists mainly of adjustment unit, joint unit, and assembly unit was designed and manufactured to minimize the cosine error caused by the assembly inaccuracy. The measuring uncertainty analysis experiments for both touch trigger probe system and non-contact laser probe system was first investigated. The whole measuring system consisting of a personal computer, controller of a CNC machining center, a RENISHAW MP10 touch probe system and the controller of a Wolf&Back OTM3A20 laser probe system has been integrated information-technically. The developed system can also be used to digitize the data points of 3D small workpieces, such as teeth model and IC parts with this information integration.
To evaluate the performance of the developed hybrid measuring system a carrier combined with free form surface and regular geometric feature referred to ISO 10791-7 cutting test standard was designed, manufactured and inspected. The measuring result of this carrier was verified through the coordinate measuring machine with good result. According to the measuring results, the developed hybrid measuring system was successfully and effectively used to carry out the in-process measurement. The developed system is especially adequate applied to the mold production with bakelite material.

中文摘要………………………………………………….………………Ⅰ
Abstract...……………………………………………………….….……Ⅲ
誌 謝………………………………………………………………….…Ⅴ
目 錄……………………………………………………………….……Ⅵ
圖索引………………………………………………………...…….…….Ⅹ
表索引…………………………………………………………………..ⅩⅤ
第一章 緒論……………………………………………………………….1
1.1 研究動機及目的……………………………………………1
1.2 文獻回顧………………………………………………………3
1.3 研究方法與論文結構…………………………………………5
第二章 混合量測介紹…………………………………………………….8
2.1 量測探頭分類介紹………………………………8
2.1.1 接觸式探頭…………………………………9
2.1.2 非接觸式探頭……………………………………11
2.2 探頭原理介紹………………………………………………….12
2.2.1 非接觸式雷射探頭……………………………………….12
2.2.2 接觸式探頭……………………………………………….14
2.3 基本概念與應用………………………………………………15
2.3.1 加工間量測……………………………………………….16
2.3.2 點資料取樣……………………………………………….18
2.4 探頭調整裝置之設計與製造及校驗結果……………………20
2.5 實驗設備……………………………………………………….26
第三章 探頭之量測不確定分析………………………………………...27
3.1 非接觸式雷射探頭……………………………………………27
3.1.1 材料……………………………………………………….28
3.1.2 粗糙度…………………………………………………….32
3.1.3 斜率……………………………………………………….34
3.1.4 顏色……………………………………………………….35
3.2 接觸式雷射探頭………………………………………………37
3.2.1探頭校準…………………………………………………..38
3.2.2重複性……………………………………………………..42
3.2.3 精密度…………………………………………………….42
3.3 雷射探頭之量測重覆性……………...………………………..45
第四章 探頭系統與切削中心機NC控制器系統及PC之系統整合…..46
4.1 系統簡介……………………………………………………….46
4.2 硬體系統與資訊系統之整合………...………………………..48
4.2.1 硬體系統………………………………………………….48
4.2.2 資訊系統………………………………………………….50
4.3 工具機精度校驗……………………………………………….53
4.4 二種探頭系統中心之offset校驗與整合…………………...56
第五章 三維點資料取樣與自由曲面量測分析………………...………60
5.1 三維點資料取樣(Digitizing)…………………………….…60
5.1.1 實驗載具製作…………………………………………….61
5.1.2 掃描路徑規劃…………………………………………….62
5.1.3 點資料前處理…………………………………………….66
5.1.4 Filter後之點群資料……………………………………68
5.2 自由曲面量測(Measurement)…………………...…………...72
5.2.1 實驗載具製作…………………………………………….72
5.2.2 量測路徑規劃…………………………………………….81
5.2.3 誤差比對………………………………………………….83
第六章 實驗結果………………………………………………………...91
6.1 製造與量測流程規劃…………………………………………92
6.2 CAD/CAM系統………………………………………….……….93
6.3 量測路徑規劃………………………………………………….97
6.4 加工間量測(In-process measurement)…………………...101
6.5 二次精加工………………………...…………………………108
6.6 結果………...…………………………………………………110
第七章 結論與未來研究方向………………………………………….112
7.1 結論……………………………………………...……………112
7.2 未來研究方向……………………………………...…………114
參考文獻 ……………………………………………………………….115
附 錄 A ……………………………………………………………...…120
附 錄 B ……………………………………………………………...…121
附 錄 C ……………………………………………………………...…125
附 錄 D ……………………………………………………………...…126
附 錄 E ……………………………………………………………...…127
作者簡介 ……………………………………………………………….130

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