臺灣博碩士論文加值系統

摘要
本研究以Degussa P-25 二氧化鈦粉末為載體，使用光催化沈積法來製備含鉑(Pt)及銅(Cu)的金屬／二氧化鈦觸媒。並以浸漬覆膜(dip-coating)及旋轉覆膜(spin-coating)兩種方法將之轉鍍在氧化銦錫(ITO)基材表面上形成薄膜。經由掃描式穿隧顯微鏡(STM)的鑑定，來探討金屬／二氧化鈦催化薄膜上之分散度及其與製備條件、鍍膜方式等的相關性，最後利用二硫化物的分解反應來穩定此薄膜的光催化效能。

ABSTRACT
The platium- and copper- modified titanium oxide (Pt-TiO2 and Cu-TiO2) particles have been successively made by photocatalytic deposition on Degussa P-25, those photocatalytic particles are deposited onto the indium tin oxide (ITO) substrate to form thin films of Pt-TiO2 and Cu-TiO2 by means of dip-coating and spin-coating processes. The morphology, microstructure, crystalline structure, the dispersion of Pt/TiO2 and Cu/TiO2,chemical composition, and the correlation between these factors and the coating condition of such prepared thin films have been investigated using the combination techniques of scanning tunneling microscopy (STM)。

目次
中文摘要……………………………………………………………………………… I
ABSTRACT……………………………………………………………..………… II
誌謝………………………………………………………………………..…………III
目次………………………………………………………………………..…………IV
表目錄……………………………………………………………………………… VI
圖目錄………………………………………………………………………….…VII
第一章 前言……………………………………………………………………….. 1
1.1 金屬與擔體的相互作用 ………………………………………………… 3
1.2 光催化沉積法 …………………………………………………………… 4
1.2.1 催化 ……………………………………………………………… 4
1.2.2 光催化 …………………………………………………………… 5
1.2.3 光催化沈積法 …………………………………………………… 9
1.3 光催化沉積法製備觸媒之性質評估..……………………….……….…10
1.4 研究目標…………………………………………………………………11
第二章 STM之原理與設備應用 ………………………………………………12
2.1 STM的原理………………………………………………………………12
2.1.1 原理…………………………………………………...…………..12
2.1.2 工作原理 ………………………………………………...……….14
2.2 STM的儀器與防震 ………………………………………………………15
2.2.1 STM的基本構造…………………………………………………..15
2.2.2 STM的防震系統 …………………………………………………16
2.3 STM的應用 ………………………………………………………………17
2.3.1 有機材料之應用 ………………………………………………….17
2.3.2 無機材料之應用 ………………………………………………….23
第三章 實驗部份 …………………………………………………………………27
3.1 實驗藥品……………….………………………………………………….27
3.1.1 一般葯品…..……………………………………………………….27
3.1.2 金屬藥品……..…………………………………………………….27
3.2 實驗儀器…………………………………………………………………..28
3.3 實驗步驟…………………………………………………………………..29
3.3.1 擔體金屬觸媒之製備……………………………………………….29
3.3.2 基材清潔 ……………………..…..………………………………30
3.3.3 基材的鍍膜製備的方法 …..…….………………………………..31
3.4 STM探針的製備…………………………………..………………………34
3.4.1 蝕刻法 ……………………………………………………………34
3.4.2 剪切法……………………………………………………………..36第四章 結果與討論 …..…………………………………………………………..38
4.1基材 (ITO) 之性質……………………………………………………….38
4.1.1 基材 (ITO) 的組成與形態…………..………………..…………38
4.2二氧化鈦之來源.…………………………………………………………..40
4.2.1二氧化鈦組成與形態………………….…………………………….40
4.3 擔體鉑 (Pt) 之性質 …………………………………………………… 42
4.3.1 Pt/TiO2的組成與形態…………………………………………… 43
4.3.2 以光催化沈積法製備之觸媒性質評估…………………………...51
4.4 擔體銅 (Cu) 之性質 …………………………………………………...55
4.4.1 Cu/TiO2的組成與形態…………………………………………..56
4.4.2 以光催化沈積法製備之觸媒性質評估 …………………………64
第五章 結論 ………………………………………………………………………68
參考文獻……………………………………………………………………………..69

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