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研究生:黃明忠
研究生(外文):Ming-Zhong Huang
論文名稱:三維電腦輔助工程在模具設計分析應用性之研究
論文名稱(外文):The Research of Mold Design And Analysis withThree-Dimensional Computer-Aided Engineering Application
指導教授:陳夏宗陳夏宗引用關係
指導教授(外文):Shia-Chung Chen
學位類別:碩士
校院名稱:中原大學
系所名稱:機械工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:80
中文關鍵詞:分析三維
外文關鍵詞:analysis3d
相關次數:
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在產品不斷推陳出新,技術不斷的在進步下,越來越多的產品,其開發週期已經不到一個月了。在面對開發週期越來越短的競爭下,從概念設計、產品設計、模具設計、開模、試模到量產卻有著太多的未知數,CAE以模擬的方式檢驗各種概念與設計的可行性,可以在設計階段就把所有可能造成缺憾的因素一一排除。但隨著CAE軟體模組的推陳出新,三維實體模流分析也逐漸被重視與應用,但其真實準確性也倍受質疑。
本文中我們針對薄殼、厚殼塑件與半導體IC封裝對於不同型式有限元素網格模式進行模擬分析探討暨實驗比對,有限元素網格我們採取2.5D中間平面網格(Midplane Mesh)與三維網格(3D Mesh)進行各種不同厚度試片進行分析。因為塑件某些區域仍可能存在明顯的三維流動效應,如肉厚變化區的迴流、波前區的噴泉效應或T形銜接區的流動…等。這些區域不僅使得建圖過程的中間面難以決定,更會流動場誤差,進而影響到整體計算結果的正確性。
本文我們將探討中間平面網格與三維網格射出成型(CIM)製程中之充填階段(Fill)暨半導體封裝成型(RIM),流動場情況與實際射出成型時之短射情況進行觀察比對,在此分析中射出成型製程材料我們採用熱塑性塑膠奇美-ABS PA-717C,半導體封裝成型製程材料我們採用熱固性塑膠-SUMIKON EMC-6300 HG進行中間平面網格與三維網格可行性探討。
Advances in technology and growing competition from an ever-shrinking global market have resulted in more product variety, shorter product lifecycles, and more suppliers than ever before. There is a continuous need to keep costs down, maximize profits and remain competitive locally as well as internationally. Yet, there are too many unknown factors existence started from the entire design-to-manufacture cycle for injection-molded plastic parts, CAE analysis that can provide detailed predictions about all phases of part and mold design, manufacturing, and resulting part quality. Integrated suites of software tools helps to identify critical manufacturability and quality issues and recommend appropriate actions to address those issues. With advances in developing CEA software, more and more people has come to the aid of Three-Dimensional Computer-Aided Engineering Application, but the precision and the accuracy of the results has also been questioned by many people.
In this research essay we will be using both thin wall, thick wall and to have different modeling of final elements to simulate and analyze Microchip Encapsulation; final elements will be using the 2.5D Midplane Mesh and 3D Mesh for a variety of thickness trial tests analysis. Some of the plastic parts could have areas of obvious occurrence of 3D Flow effectiveness influences, Melt-front flow circuit, fountain flow effects and T-zone flow effects to make the production of products being unpredictable and unable to calculate and decide the accuracy. We will be discussing the Midplane Mesh and 3D Mesh Convention Injection Molding to process the stage of Filling and Reacting Injection Molding, and to compare and observe the flowing tendency and the actual injection molding’s short shot. In this analysis, the Injection molding material we will be using is thermoplastic Chi-Mei-ABS PA-717C, and for the Microchip Encapsulation we will be using thermosetting- SUMIKON EMC-6300 HG to practice the Midplane Mash and 3D Mesh development.
摘要I
致謝II
目錄III
表目錄III
圖目錄III
一、緒論1
1-1前言1
1-2研究背景1
1-2 研究目的與方法3
1-3 本文架構4
二、電腦輔助工程分析網格模式概念7
2-1 中間平面網格暨三維實體網格簡介7
2-2 慣性與重力效應9
三、實驗方法與設備14
3-1 產品幾何圖形與模具設計14
3-2射出成型機器21
3-3成型材料22
四、實驗結果探討與驗證25
4-1 結果探討與驗證25
4-2 分析與實驗結果驗證31
五、結論與未來展望70
5-1 結果與討論70
5-2 未來發展方向72
參考文獻74
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