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研究生:謝仁豪
研究生(外文):HSIEH JEN HEI
論文名稱:壓電厚膜微致動器之製作
論文名稱(外文):Fabrication of Piezoelectric Thick-film Microactuator
指導教授:鄭江河鄭江河引用關係
指導教授(外文):Chiang-Ho Cheng
學位類別:碩士
校院名稱:大葉大學
系所名稱:機械工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:87
中文關鍵詞:壓電低溫燒結致動器網版印刷障礙層
外文關鍵詞:piezoelectriclow temperature sinteractuatorprintingbarrier layer
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中文摘要
本篇論文將低溫燒結壓電粉末進行漿料調配,以刮刀成型法製作壓電厚膜生胚。將壓電厚膜生胚貼附在矽晶片上,並共燒900℃1 小時,製作致動器模組,藉由晶圓切割機切割陣列狀之壓電厚膜微致動器,以阻抗分析儀量測致動器之共振頻率,計算出壓電厚膜之楊氏係數,並藉由雷射位移計量測位移量,反算壓電係數 值。
經由文獻可發現壓電厚膜在高溫燒結時容易與矽晶片產生反應,而降低壓電特性。因此本文將燒結溫度降低使結構緻密,並且網版印刷障礙層,阻隔壓電厚膜之鉛含量擴散至矽晶片,使得壓電特性提高。本文將障礙層、底部電極、壓電厚膜、上部電極沉積於基板上,其基板為氧化鋯或矽晶片。

ABSTRACT
This paper proceeded to low-temperature sinter piezoelectric powder slurry blend to make piezoelectric thick film green paste by doctor blade. Which piezoelectric green paste was deposited on the silicon wafer to make monomorph actuator modulus by co-sinter at a temperature of 900℃ for one hour, then cut the actuator modulus into an array of piezoelectric thick film by dicing saw machine. We can use impedance analyzer to measure resonance to calculate the Young’s modulus of piezoelectric thick film, and measure the displacement by laser meter to the piezoelectric coefficient .
According the literature, we can find that the piezoelectric thick film was very easy to react with silicon wafer at high temperature sinter. So we try to reduce the temperature of sintering to make the structure more denser, and printing barrier layer with isolated the Pb particle of piezoelectric diffused to silicon wafer, therefore the piezoelectric coefficient of thick film is increased. The experiment was deposited bottom electrode, piezoelectric thick film and top electrode on the substrates, which substrates may be ZrO2 or silicon wafer.

目錄
封面內頁 頁次
簽名頁
博碩士論文電子檔案上網授權書……………………….……….iii
博碩士論文授權書…………..…………………….….…………iv
中文摘要……………………………………………………………v
英文摘要……………………………………………………………vi
誌謝……………………………………..…………………………vii
目錄………………….…………………….………………………viii
圖目錄……………………………………………………………..xi
表目錄…………………...……………………………………….xiii
符號說明………………...……………………………………….xiv
第一章 諸論………………………………………….….…….…1
1.1 壓電材料簡介...………………..…..…….…..1
1.2 研究背景─壓電致動器技術……………………..4
1.3 研究動機……………………………………………5
1.4 文獻回顧……………………………………………6
1.5 本文架構…………………...…………………….10
第二章 壓電理論…………………………………….……………11
2.1 壓電性質及材料…………………………………11
2.2 壓電理論…….……..………………………….13
第三章 壓電厚膜之貼覆生胚製程……………………………….18
3.1壓電厚膜製程簡介..…...………..……..…….18
3.2壓電粉末製作程序…….…..………...………..18
3.3壓電圓片生胚製作…....………..…..…...….21
3.4電性量測..….……...…………..…..…….….23
3.5燒結溫度與時間對電性的影響……..…………..32
3.6壓電厚膜生胚製作……..…………………………33
3.6.1壓電生胚漿料調配………………………….33
3.6.2壓電生胚刮刀成型………………………….34
3.7壓電厚膜生胚貼附矽晶片之製程………….….…34
3.7.1沉積底部電極..………………...……....35
3.7.2貼附壓電厚膜生胚與熱壓…..….…………36
3.7.3抽真空與熱水均壓………..….…….…….37
3.7.4沉積上部電極....………………………….39
3.7.5燒結與電性量測結果…..………..……….40
3.8 陣列狀壓電厚膜致動器製作……….……….….41
3.9 量測結果………………....……………….……44
3.10壓電生胚於不同基板之電性量測結果.….…...47
3.11本章討論..….……..…………….…………….51
第四章 壓電厚膜之網印製程….……………....……………..52
4.1壓電厚膜製程簡介….……...…………..…..….52
4.2壓電厚膜網版印刷於矽晶片之製程………….....52
4.2.1壓電厚膜配置………...……..……………52
4.2.2矽晶片切割及酸洗……….....……………53
4.2.3網版印刷底部電極層.………….…….…..54
4.2.4壓電厚膜網印……….....…………………55
4.3本章討論…….….….……..…….………….…..57
第五章 絕緣油墨對壓電特性的影響….…………....……..…58
5.1絕緣油墨對壓電特性的簡介.……..….…...…..58
5.2網版印刷絕緣油墨.….……..…..….……………58
5.3電性量測…….………………...………………….61
5.4網印絕緣油墨於矽晶片與壓電厚膜生胚結合共燒.63
5.5本章討論….………………........………………65
第六章 結論……………………………..……………...…..…66
6.1 結論…………….…..…….….…..………..….66
第七章 未來努力方向.………………..…………..……….….68
7.1未來努力方向…………………………………...…68
參考文獻……………..……………………………………………69
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