臺灣博碩士論文加值系統

摘 要
氮化矽陶瓷具有多項良好的物理性質和化學性質，已被廣泛應用於各種領域，陶瓷坯體在燒結時所產生的體積收縮經常造成尺寸規格的偏差，於實際應用時往往須透過機械加工手段以達到所需之精確度，吾人嘗試以深切緩進研磨及鏡面研磨二階段加工製程手段，使難加工之陶瓷坯體期能獲得較高材料移除效果及光滑平整無加工缺陷之工件表面。氮化矽(Si3N4)陶瓷材料，因其具有高強度、高硬度、低韌性等特性，於加工過程中易產生脆性破壞，因而增加了氮化矽陶瓷材料研磨加工製程的困難度。同時，精密陶瓷之研磨加工製程常會直接影響到陶瓷產品的機械性質和表面特性，導致機械研磨加工成本佔陶瓷產品生產總成本的比例頗高。尋找一高效率高品質的研磨加工製程，將是開發及提昇氮化矽陶瓷產品效能上的上一個重要課題。
對氮化矽陶瓷加工件而言，研磨加工參數的設定對於加工件品質、砂輪損耗及加工效率的影響頗鉅，且具有相當的挑戰性。因此，本實驗利用不同的研磨加工參數包括砂輪種類、進刀量、砂輪轉速、工作台速度、添加氧化鋁自由磨粒等，對氮化矽陶瓷材料實施深切緩進研磨及鏡面研磨二階段複合加工製程。研究重點為探討不同研磨加工條件對氮化矽加工件表面的破壞形態、表面完整性及加工效率的影響關係。同時，我們將以SEM、AFM、XRD、ECSA及表面粗度儀等設備分析檢測Si3N4加工件表面的加工質量，亦計算材料移除率及比研磨能量，以利評估其研磨加工效率，且針對二階段加工製程機制作做一系統性探討。
實驗結果顯示二階段研磨加工製程可有效改善單純進行深切緩進研磨所產生的加工損傷，並提昇單純進行鏡面研磨之材料移除率，使整體的加工品質提昇，加工成本降低。以號數#1200WA砂輪進行二階段研磨加工中之第二階段鏡面研磨製程，可獲奈米級工件中心線表面粗度值(Ra = 34 nm)。而以號數#3000鑽石砂輪進行相同參數之加工製程，可獲最佳工件中心線表面粗度值(Ra = 24 nm)。添加氧化鋁自由磨粒確實有輔助修整工件表面之效果，透過自由磨粒與工件表面之相互磨耗，可去除工件表面的微小損傷及裂紋，使工件表面達到高精度的加工品質
本研究發現使用低號數D#270砂輪進行第一階段深切緩進研磨能夠快速大量移除工件表面材料，進而以高號數#1200WA砂輪及#3000及#5000鑽石砂輪進行添加粒徑3 □m氧化鋁自由磨粒之第二階段鏡面研磨加工，搭配進刀量1 □m/pass、砂輪轉速3000 rpm及工作台速度1 m/min等研磨加工製程參數，可獲最佳的氮化矽陶瓷工件表面加工品質。

關鍵詞：氮化矽、研磨效率、二階段複合加工製程、深切緩進研磨、鏡面研磨、氧化鋁自由磨粒漿料、超慢工作台速度、加工損傷、ESCA、AFM。

ABSTRACT

Post-sintering grinding and polishing processes are a common practice to eliminate the occurrence of dimensional non-uniformity of ceramic materials due to the shrinkage during sintering, however such a process also needs to meet the requirements of good machined surface quality with least machining damages introduced in the ceramic bodies. Silicon nitride, as our interest in this study, is well known for its remarkable mechanical properties such as high strength, high elastic modulus, high specific grinding energy, low toughness, and its fracture behavior associated with the brittle mode, which would heighten the difficulty of machining process and the machining cost as well. The machining process would directly affect the mechanical properties of surface and sub-surface regions of silicon nitride ceramics. Thus, this research is aimed to investigate how to achieve better ceramic performance and higher grinding efficiency via the two-step combined grinding process through the creep-feed grinding and the mirror-finish grinding for enhanced machining performance of silicon nitride based ceramic products.
There are various machining parameters involved in the two-step combined grinding process such as the abrasive type and bond type of grinding wheels, depth of cut, and wheel speed, and the application of alumina free abrasive slurry. These factors would substantially affect the ceramic workpiece quality, wear of grinding wheel and machining efficiency in such a grinding process. This work was meant to systematically investigate how these machining parameters would influence surface fracture mechanism of silicon nitride, surface integrity, and grinding efficiency as a result of the two-step combined grinding process. Both machined surface quality and effectiveness of two-step grinding process are evaluated by the analysis of SEM, AFM, XRD, ESCA and profilometer.
The results indicated that the greatly improved machining efficiency can be achieved through the creep-feed grinding in conjunction with mirror-finish grinding for fine-grained Si3N4 doped with 2 wt% Al2O3 and 6 wt% Y2O3 (avg. grain size 0.306 □m) with either diamond or white alumina (WA) wheels. The minimum average surface roughness (Ra) of Si3N4 samples,34 nm and 24 nm, was resulted from using #1200 WA wheel and #3000 diamond wheel at the second step mirror-finish grinding, respectively. The residual stress at surface and sub-surface zones of Si3N4 responding to grinding process, which was qualitatively examined by lowering and broadening of major XRD peaks, was similar for both diamond and WA wheels as the same machining parameters in mirror-finish grinding were employed. The injection of alumina free abrasive slurry into the grinding contact zone between the wheel and workpiece was demonstrated as an effective means to illuminate the fine machining damage and microcracks at sample surface by exerting the addition wear of silicon nitride sample by free abrasives during the grinding process.
In this study, we found that the first-step creep feed grinding process by using coarse-grit #270 diamond wheel (avg. grit size 53 □m) would reach maximum material removal rate, which can be followed by the second-step mirror-finish grinding process as using fine-grit #1200WA, #3000 diamond or #5000 diamond wheel in conjunction with the alumina free abrasive (3 □m). The optimal surface quality for silicon nitride under the two-step grinding process was achieved with 1□m/pass depth of cut, 3000 rpm wheel speed, and slow table feed rate of 1 m/min.
Keywords: Silicon nitride, grinding efficiency, two-step combined grinding process, creep-feed grinding, mirror-finish grinding, alumina free abrasive slurry, ESCA, AFM, slow table feed, machining damage

目 錄
中文摘要……………………………………………………………….I
英文摘要……………………………………………………………….III
目錄……………………………………………………………………V
圖目錄………………………………………………………………..IX
表目錄……………………………………………………………….XV
第一章 緒 論…………………………………………………….....1
1.1 前言………………………………………………………….1
1.2 研究之背景及目的………………………………………….5
第二章 理論基礎…………………………………………………….12
2.1 氮化矽基複合陶瓷材料簡介及其實際應用……………...12
2.1.1 氮化矽( Si3N4 )簡介…………………………………..….12
2.1.2 氮化矽基複合陶瓷材料相關性質之實際應用………….14
2.2 研磨加工基本原理………………………………………...15
2.2.1 砂輪和研磨研削力………………………………………15
2.2.2 研磨加工之特色…………………………………………21
2.2.3 研磨區域的交互作用……………………………………22
2.2.4 陶瓷工件的切屑形成………………………………..30
2.2.5 砂輪的削正與削銳…………..................................37
2.3 研磨加工種類…………………………………………......39
2.3.1 深切緩進研磨與鏡面研磨………………........................39
2.3.2 細磨粒白色氧化鋁砂輪與氧化鋁自由磨粒於鏡面研
磨之影響………................................................................42
2.4 研磨加工參數對加工件表面品質與機械強度之影響.......44
2.4.1 進刀量、工作台進給速度及砂輪轉速對加工件表面
粗度與機械強度之影響……….…………………….......44
2.4.2 磨粒尺寸、研磨加工方向及表面粗度…………............47
2.4.3 切削液種類………….......................................................51
2.5 Si3N4陶瓷材料之加工損傷行為………………………….52
2.5.1 表面與次表面的加工損傷……………………………....52
2.5.2 殘留應力……………………………………………...….54
2.5.3 加工變質層………………………………………………54
2.5.4 AFM於鏡面的分析……………………………………..55
2.6 研磨加工的磨耗情形….………………………………......57
2.6.1 砂輪表面的磨耗……………………................................57
2.6.2 工件表面的磨耗………....................................................58
2.7 加工成本與加工效率……...................................................58
第三章 實驗步驟與方法…………………………………………...61
3.1 氮化矽粉體的製備………………………………………...61
3.2 氮化矽坯體成形、燒結、與加工件前處理………………64
3.3 二階段研磨加工製程……………........................................66
3.4 磨加工製程與加工件性質之評估………………................70
3.4.1 材料移除率………………………………...........................70
3.4.2 加工件之比研磨能量…………………………………....72
3.4.3加工件之磨後殘留量………………..………..….....72
3.4.4表面粗度及表面完整性………………………………......73
3.4.5氮化矽加工件之殘留應力的量測……………………........75
3.4.6 三點抗彎強度……………………………………...............77
3.4.7 括痕試驗…………………………………….......................77
3.4.8加工件表面的顯微結構之觀察分析……………………....79
3.4.9 加工件表面之化學分析電子儀探測…………..................80
第四章結果與討論……………………………………………….…82
4.1 S3N4加工試片之顯微結構與機械性質………….………..82
4.2 S3N4加工件之材料移除率與比研磨能量…………….......85
4.3 S3N4加工件之表面粗度與表面平整度…………………...89
4.4 括痕試驗…………………..................................................103
4.5 加工參數對於加工件殘留應力與加工件強度………......107
4.5.1 殘留應力...............................................................................107
4.5.2 三點抗折強度………..........................................................112
4.6 S3N4加工件之表面加工品質………..................................116
4.6.1 加工件表面之SEM顯微結構………………………….116
4.6.2 加工件表面之AFM顯微結構………………………….133
4.7 S3N4加工件之表面磨潤化學…………..............................143
4.8 本實驗工作的未來方向與建議…………………………..152
第五章結論………………………………………………………....156
參考文獻……………………………………………………………..159
致謝........……………………………………………………………..164
作者簡歴……………………………………………………………..166

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