本研究藉由X光繞射分析儀(XRD)、掃描式電子顯微鏡(SEM)和場發射掃描式電子顯微鏡(FE-SEM)等儀器分析Sn(塊材)/Zn板、Zn(電鍍)/Cu板、Sn(電鍍)/Zn(電鍍)/Cu板和共晶Sn-9Zn/Cu板於蟻酸氣氛中，在溫度為200、250和300℃、時間為5、30分鐘熱處理條件下界面反應與微結構分析，作為無鉛Sn-Zn在未來電子構裝中使用的參考。
Sn(塊材)/Zn板在溫度為300℃、時間為5分鐘浸漬熱處理後，片狀之Zn與共晶Sn-9Zn層狀組織分佈於原Sn中。Zn(電鍍)/Cu板在溫度為200、250及300℃時間為5分鐘熱處理後，界面處生成γ-Cu5Zn8介金屬相。Sn(電鍍)/Zn(電鍍)/Cu板在溫度為200、250與300℃、時間為5分鐘熱處理後，Cu擴散到原電鍍之Zn層反應形成γ-Cu5Zn8介金屬相，當熱處理溫度上升至300℃時，發現Sn擴散進入Cu-Zn介金屬相中取代部份Cu原子位置，使得原γ-Cu5Zn8介金屬相轉變成γ-(Cu1-XSnX)5Zn8介金屬相結構，而且隨著熱處理溫度上升，介金屬相顆粒變大，粒徑分布不一。
Sn-9Zn/Cu板試片於蟻酸氣氛下，在溫度為250℃、300℃時間為5分鐘和溫度為300℃時間為30分鐘浸漬熱處理後，界面處形成γ-Cu5Zn8介金屬相，隨著溫度與時間增加厚度增加。

Interfacial reactions and microstructural analysis of the Sn/Zn and Zn (electroplated)/Cu binary systems, and Sn (electroplated)/Zn (electroplated)/Cu, and Sn-9Zn/Cu ternary systems upon heat treatment at 200, 250, and 300℃ for 5 and 30 min in formic acid atmosphere are investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM) and field-emission scanning electron microscopy (FE-SEM).
In the case of the Sn/Zn system, the result shows that Zn dissolves into Sn and forms an eutectic layered structure, upon heat treatment of the specimen at 300℃for 5 min; whereas in the system of Zn (electroplated)/Cu, a new intermetallic compound, γ-Cu5Zn8, was formed at the Zn/Cu interface upon annealing at 200, 250, and 300℃ for 5 min. In the Sn (electroplated)/Zn (electroplated)/Cu ternary system heat-treated at 200℃、250℃and 300℃for 5 min, it is observed that Cu diffuses into the Zn layer and forms theγ-Cu5Zn8 intermetallic phase. As the heat treatment temperature was raised to 300℃, it is found that Sn diffuses into the Cu5Zn8 layer and a (Cu1-x Snx)5Zn8 phase was produced. In contrast, only theγ-Cu5Zn8 phase is detected in the Sn-Zn/Cu ternary system for the specimens heat-treated at 250 and 300℃ for 5 and 30 min, and the thickness of the intermetallic layer increases with temperature and annealing time.

目錄
中文摘要………………………….…………… Ⅰ
英文摘要……………………………….. Ⅱ
目錄……………………………………….….……….. Ⅲ
圖目錄…………………………….………….….. Ⅶ
表目錄………………………………………………… Ⅹ
第一章 緒 論…………………………….…………… 1
1.1前言.…..…………………………………………….. 1
1.2研究動機與目的……………………...………………. 3
第二章 文獻回顧與理論背景…………………………… 10
2.1 Sn-Pb合金銲錫簡介………………………………….. 10
2.2 Sn-9Zn無鉛銲錫(Lead-free Solder)簡介……………….. 11
2.2.1 Sn、Zn和Cu基本性質………………. 11
2.2.2 Sn-Zn相圖…………………………….……..…….. 11
2.2.3 電化學性質……………….…..……… 12
2.2.4 氧化物性質 12
2.3界面反應( Interface Reaction)……………… 13
2.3.1 Sn/Cu界面反應…………….. 13
2.3.2 Zn/Cu界面反應……… 13
2.3.3 Sn-9Zn合金銲錫與Cu界面反應. 14
2.4介金屬IMC熱力學性質(Thermodynamic Data )…… 15
2.5 相平衡之計算 16
2.6電鍍(Plating)…………………………………………………. 17
2.7無助銲劑軟銲(Fluxless Soldering)……………………… 18
第三章 實驗步驟與方法…………………………… 27
3.1 Cu、Zn和Sn試片規格與前處理………………………………. 27
3.1.1 Cu板規格與前處理……………………. 27
3.1.2 Zn板規格與前處理…………………………………… 27
3.1.3 Sn棒規格與前處理……………………………………. 27
3.2 電鍍液組成與電鍍設備……………………………………… 28
3.2.1 Zn和Sn電鍍液的組成………………………… 28
3.2.2 電鍍設備……………………………… 28
3.2.3 熱處理設備………………… 28
3.3 實驗流程………………………………………………... 30
3.3.1 Zn(電鍍)/Cu板界面反應………………………. 30
3.3.2 Sn(塊材)/Zn板界面反應……………………… 30
3.3.3 Sn(電鍍)/Zn(電鍍)/Cu板界面反應……………. 30
3.3.4 Sn-9Zn/Cu板界面反應 31
3.4 X-光繞射儀(Diffractometer)……………………...……… 32
3.5 掃描式電子顯微鏡(Scanning Electron Microscope, SEM)… 33
3.6 場發射掃描式電子顯微鏡(FE-SEM)…………………. 34
第四章 結果與討論………………………….………………. 38
4.1 Zn(電鍍)/Cu板界面反應……………………… 38
4.2 Sn(塊材)/Zn板界面反應....…………………………… 38
4.3 Sn(電鍍)/Zn(電鍍)/Cu板界面反應………………….. 39
4.3.1 XRD分析結果……………………………………. 39
4.3.2 SEM分析結果………………………… 39
4.3.3 蟻酸氣氛下，200℃、5分鐘熱處理… 40
4.3.4 蟻酸氣氛下，250℃、5分鐘熱處理… 41
4.3.5 蟻酸氣氛下，300℃、5分鐘熱處理… 42
4.4 Sn-9Zn/Cu板界面反應 44
4.4.1 Sn-9Zn共晶銲料 44
4.4.2 Sn-9Zn/Cu板界面反應 44
第五章 結論…………………………………… 78
參考文獻…………………………. 79

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