中文摘要
在VCSEL元件發展中，850 nm VCSEL廣泛應用於短距離的高速資料傳輸，但目前的850 nm雷射因晶格匹配的原因需成長在不透光的GaAs基板上，若能將其製作成上下皆可發光的元件，則對於封裝、與Si積體電路的整合或混合積體化將更為容易。本論文係以熱壓式晶片直接融合技術(wafer direct bonding)將850 nm VCSELs黏貼於透光的GaP基板上，以解決850 nm雷射長晶於GaAs基板上，其會吸光造成只有單向光發射之限制；本實驗已成功地將850 nm雷射黏貼於GaP基板上，經研究發現清洗過程、熱處理過程中的時間、溫度與壓力和GaP基板表面圖案的尺寸等，皆會嚴重影響晶片黏貼特性與結果，並經過多次實驗證明，找出其最佳的黏貼條件，黏貼後的表面並不會因基板移除的過程中造成DBR對數的減少或損害，仍保持原有的光特性，除此之外，利用氧化侷限法(oxidation confined)製作元件，並對其元件的光電特性進行探討，目前已成功地將850 nm VCSEL黏貼至GaP基板並製作出元件，起始電流於光窗口為20 μm時可至6 mA，光功率輸出於光窗口為50 μm時可至1.2 mW，最大牆插拴效應可至2.38 %。

Abstract
Vertical-cavity surface emitting lasers (VCSELs) are of great interest in the application of high-speed short distance optical data link and free space optical system. The standard operating wavelength for these systems is 850 nm owing to its compatibility with the GaAs or Si based detectors. Since GaAs substrates on which the devices are fabricated are not transparent at this wavelength, the VCSELs are usually designed to emit through top contact windows. Top-emitting VCSELs, however, are not ideal for hybrid integration with Si circuitry because of the complexity of wiring and limited packing density of VCSELs array. On the other hand, bottom- emitting VCSELs, which emit light through a transparent substrate, have several advantages over conventional top-emitting lasers such as accessibility of the laser output at both facets, the ability to fashion optical elements such as lenses into the substrate, and the suitability of this structure to flip-chip bonding for hybrid microelectronic integration. This paper deals with the fabrication and characterization of bottom-emitting 850nm vertical-cavity surface-emitting lasers (VCSELs). The devices were realized by using wafer-bonding technology to exchange the VCSELs structures from absorbing GaAs structure for a transparent GaP substrate.

目錄
封面內頁
簽名頁
授權書……..………………………………………...………………….iii
中文摘要…..…….…..…………………………….…………….……...iv
Abstract ..………………………………………………….…………….v
誌謝………………………………………………………………..……vi
目錄…………………………………………………………………….vii
表目錄……………………………………………….….……………….x
圖目錄……………………………………………….….…………..…..xi
第一章 研究動機與目的.……………………………………………..1
第二章 VCSEL與晶片黏貼之介紹
2.1 VCSEL簡介………………….……………………………..….5
2.1.1 VCSEL的發展史…………………………….……..…..5
2.1.2 VCSEL的主要結構………………………………..…...6
2.1.3 VCSEL的工作原理………………………………..…...7
2.1.4 VCSEL的優點……………………………………..…...8
2.1.5 VCSEL的製作………………………………………...10
2.2 晶片黏貼簡介……………………………………………......14
2.2.1 前言………………………………………………..….14
2.2.2 影響晶片黏貼實驗之因素…………………………...15
2.2.3 晶片直接黏貼技術應用於1.3/1.55μm之VCSEL….16
2.2.4 以晶片直接黏貼技術製作下發射850 nm之VCSEL 17
第三章 實驗
3.1晶片直接黏貼實驗..………….………………………………19
3.2元件製程………………..…….………………………………22
3.2.1 大面積(board area, BA)製程…………………………22
3.2.2 氧化限制(oxidation confined)製程……………..……23
第四章 結果與討論
4.1 晶片直接黏貼之結果與討論…….….………………………27
4.1.1 直接黏貼參數結果與分析…………...………………27
4.1.2 晶片黏貼後之光特性探討…………………………...29
4.2 元件EL量測之結果與討論…………………….….………..32
4.2.1 BA製程之EL量測與探討……………………………32
4.2.2 氧化侷限製程之EL量測與探討…………………….33
4.3 元件L-I-V量測之結果與討論…….………………………..36
第五章 結論 …………………….…………………………………. 41
參考文獻……………………………………………………………….43

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