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研究生:潘弘崧
論文名稱:黏晶機創新改良之概念設計
論文名稱(外文):Conceptual design of innovative improvement of die bonder
指導教授:陳昭亮
學位類別:碩士
校院名稱:國立中興大學
系所名稱:機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2002
畢業學年度:90
語文別:中文
論文頁數:147
中文關鍵詞:TRIZ黏晶機
相關次數:
  • 被引用被引用:32
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i
IC黏晶為後段IC構裝製程中非常重要的製程之一,黏晶製程品質悠關整個構
裝製程能力,隨著構裝產品高密度的要求,黏晶品質愈來愈受嚴格的要求,再加
上現今對於電子產品的需求與日俱增,使得黏晶裝置的晶粒處理模組必須有較高
的速度才能符合現今的生產需求。有鑑於此,本論文之研究目的即為改善目前一
般黏晶機的缺點:提高黏晶品質-改善晶片在黏晶過程中的破裂情形與增加黏晶
速度-減少晶片在取放時所消耗的時間。
在本研究中,首先用功能分析法先將整個黏晶機系統作分析,並了解各個次
系統之功能,使得對整個系統有進一步的了解。接下來再利用創新設計法-TRIZ
來做系統的翻新設計,並進一步達到改良創新的目的。在本研究裡分別針對取放
頭、頂針機構與取放臂提出數個創新的機構概念設計,最後並利用機構模擬軟體
ADAMS模擬取放臂四個新構型的動態情形。
Die bond is a very important manufacturing process in IC package, the quality of
die bond relate to package manufacturing process. With the request of high density of
IC package product, the quality of die bond is more and more requested. And the
requirement of electrical products is steadily on the increase, the die bonder module
must have high speed to fit in with reqirement of production. So the research
objective of this thesis is to improve the disadvantage ordinary die bonder:improve
the die crack in die bonder and increase the speed of die bonder.
In this research, first of all, analysis the die bonder system with function analysis,
and to know the function of sub-system, then use innovative design method-TRIZ
to do a whole research for die bonder system. In the light of design steps of TRIZ,
bring up some conceptual design on pick and place head, the tip and pick and place
arm. Finally, we analysis pick and place arm with mechanism simulate software-
iii
第一章緒論..................................................................................................................................... 1
1.1 前言......................................................................................................................................1
1.2 文獻回顧...............................................................................................................................2
1.3 研究目的及方法...................................................................................................................5
1.4 論文架構...............................................................................................................................6
第二章黏晶機技術簡介.................................................................................................................... 7
2.1 基本功能...............................................................................................................................9
2.2 主要規格項目.....................................................................................................................13
第三章TRIZ 介紹............................................................................................................................ 16
3.1 TRIZ 簡介............................................................................................................................16
3.2 問題的描述.........................................................................................................................18
3.2.1 Innovative Situation Questionnaire...........................................................................18
3.2.2 問題公式化(Problem Formulation)........................................................................20
3.3 解決問題的方法.................................................................................................................21
3.3.1 利用矛盾矩陣解決矛盾..........................................................................................22
3.3.1.1 39 個工程參數與40 個創造性的原理.........................................................22
3.3.1.2 矛盾矩陣.......................................................................................................31
3.3.1.3 分離物理上的衝突.......................................................................................32
3.3.2 利用物質-場之分析解決矛盾..............................................................................35
3.3.2.1 物質-場之簡介...........................................................................................35
3.3.3.2 76 個標準方法...............................................................................................37
第四章、概念性設計........................................................................................................................ 41
4.1 功能分析.............................................................................................................................41
4.2 問題描述與產生衝突.........................................................................................................43
4.2.1 創新情境問卷(ISQ).................................................................................................43
4.2.2 問題公式化..............................................................................................................49
4.3 創新概念設計.....................................................................................................................53
4.3.1 取放頭......................................................................................................................53
4.3.1.1 用矛盾矩陣分析............................................................................................54
4.3.1.2 用物質-場分析...........................................................................................57
4.3.2 頂出機構...................................................................................................................62
4.3.2.1 用矛盾矩陣分析............................................................................................62
4.3.2.2 用物質-場分析...........................................................................................64
4.3.3 取放臂......................................................................................................................66
4.3.3.1 用矛盾矩陣分析...........................................................................................66
4.3.3.2 用物質-場分析...........................................................................................69
第五章概念具體化.......................................................................................................................... 71
5.1 取放頭................................................................................................................................71
5.1.1 Case 1........................................................................................................................71
5.1.2 Case 2........................................................................................................................73
5.1.3 Case 3........................................................................................................................75
5.1.4 Case 4........................................................................................................................78
5.2 頂出機構.............................................................................................................................81
5.2.1 Case 1........................................................................................................................81
5.2.2 Case 2........................................................................................................................82
5.2.3 Case 3........................................................................................................................83
iv
5.3 取放臂................................................................................................................................84
5.3.1 Case 1........................................................................................................................84
5.3.2 Case 2........................................................................................................................87
5.3.3 Case 3........................................................................................................................89
5.3.4 Case 4........................................................................................................................92
5.4 其他的創新概念設計.........................................................................................................93
5.4.1 Case 1........................................................................................................................93
5.4.2 Case 2........................................................................................................................95
5.4.3 Case 3:....................................................................................................................97
第六章電腦輔助設計.................................................................................................................... 101
6.1 機構模擬軟體-ADAMS 簡介.......................................................................................101
6.2 取放臂機構模擬...............................................................................................................103
6.2.1 Case 0 (傳統黏晶機) ..............................................................................................104
6.2.2 Case 1......................................................................................................................108
6.2.3 Case 2...................................................................................................................... 112
6.2.4 Case 3...................................................................................................................... 118
6.2.5 Case 4......................................................................................................................124
第七章結論與展望........................................................................................................................ 129
7.1 結論..................................................................................................................................129
7.2 未來展望...........................................................................................................................130
參考文獻......................................................................................................................................... 132
附錄一:專利表..............................................................................................................................134
附錄二:矛盾矩陣.......................................................................................................................... 142
132
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Design”, John Wiley&Sons Litd, 2000.
[2] G. Altshuller, “The Innovation Algorithm”, Technical Innovation
[3] G. Altshuller, “Tools of Classical TRIZ”, Ideation International Inc,
[4] V. Kosse, “Solving Problems with TRIZ”, Ideation International
[5] J. Terninko, A. Zusman& B. Zlotin, “Step-by-step TRIZ:Creating
Innovative Solution Concepts”, Responsible Management Inc, 1996
[6] 賴俊魁,”晶圓取放機之整合研究”,中原大學碩士論文,1996 年
[7] 蕭兆宏,”晶圓取放機構電腦輔助設計之研究”,中原大學碩士論
[8] 曹武惠,”電腦輔助分析在半導體構裝機械之應用”,中原大學碩
[9] 周建中,”晶元頂取之晶裂成因研究”,中原大學碩士論文,1999
[10] 徐歷昌,”自動機設計便覽”,全華科技圖書股份有限公司,1997
[11] R. Mori, S. Osaka, & T. Banjo, “Die bonding apparatus”, US
PATENT 4878610, Nov. 1989.
[12] P. Davis, D. Tarrant, ”Method and apparatus for removing die from
an expanded wafer and conveying die to a pickup location”, US
PATENT 5976306, Nov. 1999.
[13] M. K. Bartschat, J. S. Kovalchick, “Method and apparatus for chip
placement”, US PATENT 4980971, Jan. 1991.
[14] H. McIver, “Method of mounting an I.C. chip on a substrate”, US
PATENT 4381602, May 1983.
[15] M. Snyder, E. Bates, “Articulating tip for pick and place head”, US
PATENT 5029383, Jul. 1991.
[16] Y. Suzuki, S. Chiba, A. Nishimura, “Inner lead bonder” US PATENT
4526646, Jul. 1985.
[17] S. Ichikawa, “Chip bonder method and apparatus”, US PATENT
5579980, Dec. 1996.
[18] T. Nakashima, T. Akasaka, “Electrical component placing apparatus
and placing method therefore”, US PATENT 5155903, Oct. 1992.
[19] B. J. Kuppens, H. C. Wardenaar, “Method of and device for feeding
electric and/or electronic elements to given positions”, US PATENT
4494902, Jan. 1985.
[20] E. DOMB, “40 Inventive (Business) Principles With Examples”, The
PQR Group, 190 N. Mountain Ave., Upland, CA 91786 USA, Journal
of TRIZ, July. 1997.
[21] 吳以晴,“系統化創新發明工程TRIZ”,財團法人工業研究院TRIZ
研討會,2001 年12 月。
[22] J. Terninko, E. Domb, & J. Miller, “The Seventy-six Standard
Solutions, with Examples” Journal of TRIZ, Feb. 2000.
[23] E. Dieter, “Engineering Design”, McGraw-Hill International Editions,
2000, pp. 15-20.
[24]http://www.cadmen.com.tw/index.htm
[25]台灣東方馬達股份有限公司綜合目錄
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